Huawei FusionServer G5500 Manual page 52

ASRock: 3U8G-C612/V
www.huawei.com ▪ Huawei Confidential ▪
Parameter
Dimensions (H x W x D)
Architecture
CPU
Maximum CPU power
GPU
Maximum GPU power
CPU:GPU topology
Hard drive
RAID
PCIe expansion
On-board network adapter
Power supply
Fan
Temperature
Beating Points
•
The integrated design of the chassis does not support independent evolution of the CPUs and GPUs.
•
The CPU:GPU topology is fixed and cannot be flexibly configured.
•
Only 16 DIMMs are supported, and the memory capacity is limited.
•
NVMe SSD is not supported. (Without the RAID function)
•
The fans are built-in and require opening the chassis for maintenance.
•
The power capability is limited. The N+N redundancy cannot be supported when the power supply is fully loaded.
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G5500-G560 ASRock 3U8G-C612/V
4U (175*447*790) 3U
Modular Integrated
2S + 24DIMM 2S + 16DIMM
300 W 145 W
8*P100/P40/P4 8*P100/P40/P4
350 W 300 W
1:8/1:4 flexible configuration 1:8
6*2.5'' NVMe SSD 6*2.5'' SATA SSD/HDD
2*2.5'' SAS/SATA HDD
8*3.5'' HDD
RAID 0/1/10/5/50/6/60 ? (No RAID controller card?)
4*PCIe x16 1*PCIe x16 or 2*GE/10GE
/
4*2200 W hot swap, 2+2 4*1200 W hot swap, 3+1
6 hot swap, 5+1 The built-in does not support hot swap. When the fan
fails, heat dissipation is affected.
5°C to 35°C 10°C to 35°C