Huawei VP9660 Manual page 14

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Huawei VP9660
Product Overview
1 Front panel of the air outlet
trough
4 Board slots
7 Air intake trough
10 Dust filter
Heat Dissipation System
The VP9660 heat dissipation system incorporates the following:
l
l
Issue 08 (2018-11-21)
Fan assembly: dissipates the heat of the board inside the chassis.
Fan supplied with the power module: dissipates the heat of the power module.
The VP9660 fan assemblies are located on the upper and central parts of the chassis. Air
can blow from the front, left, or right of the fan assemblies into the chassis to cool the
boards inside. The fan assembly provides a fan monitoring board, which can generate
alarms when faults occur in the fan.
For heat dissipation, do not leave any slots empty. If a slot has no board installed, install
a filler panel.
The fan supplied with the power module is at the bottom of the chassis. The air channel
of the power module is separated from the fan assembly. The air enters into the power
module from the front side and vents out from the rear side for heat dissipation.
As shown in
Figure
3-3, each fan assembly provides two indicators and no power
switch.
Figure 3-3 VP9660 upper fan assembly
Copyright © Huawei Technologies Co., Ltd.
2 Upper fan assembly
5 ESD holes
8 Power module slot
11 Chassis handle
3 Product Structure
3 Mounting ear screw hole
6 Cable trough panel
9 Lower fan assembly
12 Air outlet
11

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