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HP XZ940UT Quickspecs page 11

Microtower business pc

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QuickSpecs
Technical Specifications
RoHS2 Compliance
RoHS2 Compliance
RoHS2 Compliance
RoHS2 Compliance
Material Usage
Material Usage
Material Usage
Material Usage
Packaging
Packaging
Packaging
Packaging
External: (Carton)
1145g
Internal: (Cushion)
192g
Internal: (Bag for Chassis)
35g
Internal: (Accessory Bag)
19g
Internal: (Insert)
39g
Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations,
including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to
exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.
By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for
all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is
no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
This product does not contain any of the following substances in excess of regulatory limits (refer to the
HP General Specification for the Environment at:
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants - may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) - except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Nickel finishes that release greater than 0.5 micro-grams/cm2/week, measured according to EN
1811:1998, are not used on any product surface designed to be frequently handled or touched
by users.
HP follows these guidelines to decrease the environmental impact of product packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
DA - 14119
North America — Version 3 — August 29, 2011
HP Pro 3400 Microtower Business PC
HP Pro 3400 Microtower Business PC
HP Pro 3400 Microtower Business PC
HP Pro 3400 Microtower Business PC
Page 11

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