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4.
Remove the fan/heat sink assembly (4).
NOTE:
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Replacement thermal
material locations vary by computer model.
Computer models equipped with a graphics subsystem with discrete memory have replacement thermal
material locations as shown in the following illustration:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
ENWW
Due to the adhesive quality of the thermal material located between the fan/heat sink
Component replacement procedures
75
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