HP G62-373 Maintenance And Service Manual page 90

Removal and replacement procedures
The following illustration shows the replacement thermal material locations for computer models equipped with
graphics subsystems with discrete memory.
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The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Thermal grease is located on the section of
the fan/heat sink assembly 1 that services the processor 3. A thermal pad is located on the section of the
fan/heat sink assembly 2 that services the Northbridge chip 4. Replacement thermal grease and pads are
included with all system board, fan/heat sink assembly, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
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