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EGS3
Version:
01.000a
DocId:
EGS3_HD_v01.000a

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Summary of Contents for Cinterion EGS3

  • Page 1  EGS3 Version: 01.000a DocId: EGS3_HD_v01.000a...
  • Page 2 UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB- JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT.
  • Page 3: Table Of Contents

    Turn on EGS3 Using the VCHARGE Signal ....... 30 3.3.1.4 Reset EGS3 via AT+CFUN Command........ 31 3.3.1.5 Reset or Turn off EGS3 in Case of Emergency ....31 3.3.1.6 Using EMERG_OFF Signal to Reset Application(s) or External Device(s) ............... 31 3.3.2...
  • Page 4  EGS3 Hardware Interface Description Contents 3.5.5 Charger Requirements................ 44 3.5.6 Implemented Charging Technique............44 3.5.7 Operating Modes during Charging............45 Power Saving....................47 3.6.1 Network Dependency of SLEEP Modes ..........47 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7....... 48 3.6.3...
  • Page 5 Voiceband Transmit Path..............96 Air Interface...................... 97 Electrostatic Discharge ..................98 Mechanics, Mounting and Packaging ..............99 Mechanical Dimensions of EGS3 ..............99 Mounting EGS3 onto the Application Platform..........101 6.2.1 SMT PCB Assembly ................. 101 6.2.1.1 Land Pattern and Stencil ........... 101 6.2.1.2...
  • Page 6 Signal states....................32 Table 9: Temperature dependent behavior..............37 Table 10: Specifications of battery packs suited for use with EGS3 ......43 Table 11: AT commands available in Charge-only mode ..........45 Table 12: Comparison Charge-only and Charge mode ..........46 Table 13: State transitions of EGS3 (except SLEEP mode) ..........
  • Page 7 Figure 15: USB circuit ..................... 54 Figure 16: C interface connected to VCC of application ..........55 Figure 17: C interface connected to VEXT line of EGS3 ..........55 Figure 18: SPI interface....................56 Figure 19: Characteristics of SPI modes................. 57 Figure 20: Audio block diagram..................
  • Page 8  EGS3 Hardware Interface Description Figures Figure 51: EGS3 sample application................112 Figure 52: Reference equipment for Type Approval ............. 113 EGS3_HD_v01.000a Page 8 of 117 2009-08-12 Confidential / Released...
  • Page 9: Document History

     EGS3 Hardware Interface Description 0 Document History Document History Preceding document: "EGS3 Hardware Interface Description" Version 01.000 New document: "EGS3 Hardware Interface Description" Version 01.000a Chapter What is new 3.3.1.1 Removed URC "Shutdown after Illegal Powerup". 3.3.2 Table 8: Changed values of PU = Pull up: typ. -200µA and max. -350µA Added remark on bit rate tolerance for autobauding.
  • Page 10: Introduction

    Introduction This document describes the hardware of the Cinterion EGS3 module that connects to the cel- lular device application and the air interface. It helps you quickly retrieve interface specifica- tions, electrical and mechanical details and information on the requirements to be considered for integrating further components.
  • Page 11 Digital-to-Analog Converter Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Cinterion GSM module) DCS 1800 Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box...
  • Page 12  EGS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description kbps kbits per second Light Emitting Diode Li-Ion / Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mbps Mbits per second Man Machine Interface Mobile Originated...
  • Page 13  EGS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface SRAM Static Random Access Memory Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access...
  • Page 14: Regulatory And Type Approval Information

    1.3.1 Directives and Standards EGS3 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec- ifications provided in the "EGS3 Hardware Interface Description".
  • Page 15: Table 4: Requirements Of Quality

     EGS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 3: Standards of European type approval ETSI EN 301 489-7 Candidate Harmonized European Standard (Telecommunications series) V1.2.1 (2000-09) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec- tro Magnetic Compatibility (EMC) standard for radio equipment and ser- vices;...
  • Page 16: Sar Requirements Specific To Portable Mobiles

    Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable EGS3 based applications to be evalu- ated and approved for compliance with national and/or international regulations.
  • Page 17: Safety Precautions

    The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EGS3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
  • Page 18: Product Concept

     EGS3 Hardware Interface Description 2 Product Concept Product Concept Key Features at a Glance Feature Implementation General Frequency bands Quad band: GSM 850/900/1800/1900MHz GSM class Small MS Output power (according Class 4 (+33dBm ±2dB) for EGSM850 to Release 99) Class 4 (+33dBm ±2dB) for EGSM900...
  • Page 19 Access by AT commands Remote SIM Access EGS3 supports Remote SIM Access. RSA enables EGS3 to use a remote SIM card via its serial interface and an external application, in addition to the SIM card locally attached to the dedicated lines of the application inter- face.
  • Page 20  EGS3 Hardware Interface Description 2.1 Key Features at a Glance Feature Implementation Power on/off, Reset Power on/off Switch-on by hardware signal IGT Switch-off by AT command (AT^SMSO) Automatic switch-off in case of critical temperature and voltage conditions. Reset Orderly shutdown and reset by AT command Emergency reset by hardware signals EMERG_OFF and IGT.
  • Page 21: Egs3 System Overview

     EGS3 Hardware Interface Description 2.2 EGS3 System Overview EGS3 System Overview Figure 1: EGS3 system overview EGS3_HD_v01.000a Page 21 of 117 2009-08-12 Confidential / Released...
  • Page 22: Circuit Concept

     EGS3 Hardware Interface Description 2.3 Circuit Concept Circuit Concept Figure 2 shows a block diagram of the EGS3 module and illustrates the major functional com- ponents: Baseband block: • Digital baseband processor with DSP • Analog processor with power supply unit (PSU) •...
  • Page 23: Application Interface

     EGS3 Hardware Interface Description 3 Application Interface Application Interface EGS3 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • Power supply - see Section 3.2...
  • Page 24: Operating Modes

     EGS3 Hardware Interface Description 3.1 Operating Modes Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Normal operation GSM / GPRS SLEEP Various power save modes set with AT+CFUN command.
  • Page 25: Power Supply

    EGS3 needs to be connected to a power supply at the SMT application interface (3 lines each BATT+ and GND). The power supply of EGS3 has to be a single voltage source at BATT+. It must be able to pro- vide the peak current during the uplink transmission.
  • Page 26: Measuring The Supply Voltage Vbatt

    RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when EGS3 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.
  • Page 27: Power Up / Power Down Scenarios

    EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Power Up / Power Down Scenarios In general, be sure not to turn on EGS3 while it is beyond the safety limits of voltage and tem- perature stated in Chapter 5.
  • Page 28: Figure 5: Powerup With Operating Voltage At Batt+ Applied Before Activating Igt

    AT\Q or AT+IFC (see for details). The default setting of EGS3 is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART”...
  • Page 29: Figure 6: Powerup With Igt Held Low Before Switching On Operating Voltage At Batt

     EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios For details on how to use EMERG_OFF to reset ap- plications or external devices see Section 3.3.1.6. Figure 6: Powerup with IGT held low before switching on operating voltage at BATT+ EGS3_HD_v01.000a...
  • Page 30: Configuring The Igt Line For Use As On/Off Switch

    Switch-on condition:If the EGS3 is off, the IGT line must be asserted for at least 400ms before being released. The module switches on after 400ms. Switch-off condition:If the EGS3 is on, the IGT line must be asserted for at least 1s before being released. The module switches off after the line is released. The switch- off routine is identical with the procedure initiated by AT^SMSO, i.e.
  • Page 31: Reset Egs3 Via At+Cfun Command

    EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios During the Charge-only mode EGS3 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch from Charge-only mode to Normal mode the ignition line (IGT) must be pulled low for at least 2 seconds.
  • Page 32: Signal States After Startup

     EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.2 Signal States after Startup Table 8 describes the various states each interface signal passes through after startup and dur- ing operation. As shown in Figure 5 Figure 6 signals are in an undefined state while the module is initial- izing.
  • Page 33  EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Table 8: Signal states Signal name Undefined state Defined state Active state after configuration by AT during startup after startup ini- command tialization DAI4 Tristate DAI5 Tristate DAI6 Tristate 1.
  • Page 34: Turn Off Egs3

    The best and safest approach to powering down EGS3 is to issue the AT^SMSO command. This procedure lets EGS3 log off from the network and allows the software to enter into a se- cure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode.
  • Page 35: Figure 8: Signal States During Turn-Off Procedure

     EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Figure 8: Signal states during turn-off procedure Note 1: Depending on capacitance load from host application. EGS3_HD_v01.000a Page 35 of 117 2009-08-12 Confidential / Released...
  • Page 36: Turn On/Off Egs3 Applications With Integrated Usb

    Turn on/off EGS3 Applications with Integrated USB In a Windows environment, the USB COM port emulation causes the USB port of EGS3 to ap- pear as a virtual COM port (VCOM port). The VCOM port emulation is only present when Win- dows can communicate with the module, and is lost when the module shuts down.
  • Page 37: Thermal Shutdown

    The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, EGS3 instantly displays an alert (if enabled).
  • Page 38: Deferred Shutdown At Extreme Temperature Conditions

     EGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex- ceeded: • While an emergency call is in progress.
  • Page 39: Overvoltage Shutdown

    Keep in mind that several EGS3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of EGS3, even if the module is switched off. Es- pecially the power amplifier is very sensitive to high voltage and might even be destroyed.
  • Page 40: Automatic Gprs Multislot Class Change

    This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops by 5 degrees, EGS3 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, EGS3 will not switch back to the higher class.
  • Page 41: Charging Control

    Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the EGS3 module to correctly determine the end of charg- ing and terminate charging automatically when the battery is fully charged. If the <current> val- ue is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage.
  • Page 42: Battery Pack Requirements

    Table 10. It is recommended that the battery pack you want to integrate into your EGS3 application is compliant with these specifications. This ensures re- liable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.
  • Page 43: Batteries Tested For Use With Egs3

    3.5.4 Batteries Tested for Use with EGS3 When you choose a battery for your EGS3 application you can take advantage of one of the following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all require- ments listed above. They have been thoroughly tested by Cinterion Wireless Modules and proved to be suited for EGS3.
  • Page 44: Charger Requirements

    Duration of charging: • EGS3 provides a software controlled timer set to 4 hours as a safety feature to prevent per- manent charging of defective batteries. The duration of software controlled charging depends on the battery capacity and the level of discharge. Normally, charging stops when the battery is fully charged or, at the latest, when the software timer expires after 4 hours.
  • Page 45: Operating Modes During Charging

    If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE line while EGS3 is in Power-down mode, EGS3 goes into Charge-only mode. While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism.
  • Page 46: Table 12: Comparison Charge-Only And Charge Mode

    Battery can be charged while GSM module Charge host application charging circuit and remains operational and registered to the mode module’s VCHARGE line while EGS3 is GSM network. • operating, e.g. in IDLE or TALK • In IDLE and TALK mode, the serial inter- mode faces are accessible.
  • Page 47: Power Saving

    CLIC SLEEP mode is that the serial interface remains accessible and that, in intermittent wake- up periods, characters can be sent or received without terminating the selected mode. This al- lows the EGS3 to wake up for the duration of an event and, afterwards, to resume power sav- ing. Please refer to for a summary of all SLEEP modes and the different ways of waking up the module.
  • Page 48: Timing Of The Ctsx Signal In Cyclic Sleep Mode 7

     EGS3 Hardware Interface Description 3.6 Power Saving 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7 Figure 11 illustrates the CTSx signal timing in CYCLIC SLEEP mode 7 (CFUN=7). Figure 11: Timing of CTSx signal (if CFUN= 7) With regard to programming or using timeouts, the UART must take the varying CTS inactivity periods into account.
  • Page 49: Summary Of State Transitions (Except Sleep Mode)

     EGS3 Hardware Interface Description 3.7 Summary of State Transitions (Except SLEEP Mode) Summary of State Transitions (Except SLEEP Mode) The following table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes).
  • Page 50: Sim Interface

    To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test- ed to operate with EGS3 and is part of the Cinterion Wireless Modules reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers.
  • Page 51: Serial Interface Asc0

    The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or in- active state). For electrical characteristics please refer to Table EGS3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...
  • Page 52: Table 15: Dce-Dte Wiring Of Asc0

     EGS3 Hardware Interface Description 3.9 Serial Interface ASC0 Table 15: DCE-DTE wiring of ASC0 V.24 circuit DCE Line function Signal direction Line function Signal direction TXD0 Input Output RXD0 Output Input RTS0 Input Output CTS0 Output Input 108/2 DTR0...
  • Page 53: Serial Interface Asc1

    0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table EGS3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...
  • Page 54: Usb Interface

    The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s USB interface, but not to other EGS3 interfaces. This is because EGS3 is designed as a self- powered device compliant with the “Universal Serial Bus Specification Revision 2.0”...
  • Page 55: I 2 C Interface

    I2CDAT and the serial clock line I2CCLK. The EGS3 module acts as a single master device, e.g. the clock I2CCLK is driven by module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times.
  • Page 56: Spi Interface

    SPIDI/SPIDO, the clock line SPICLK and the chip se- lect line SPICS. The EGS3 module acts as a single master device, e.g. the clock SPICLK is driven by module. Whenever the SPICS line is in a low state, the SPI bus is activated and data can be transferred from the module and vice versa.
  • Page 57: Figure 19: Characteristics Of Spi Modes

     EGS3 Hardware Interface Description 3.13 SPI Interface Figure 19: Characteristics of SPI modes EGS3_HD_v01.000a Page 57 of 117 2009-08-12 Confidential / Released...
  • Page 58: Audio Interfaces

    5 can be used for direct access to the speech coder without signal pre or post processing. When shipped from factory, all audio parameters of EGS3 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Cinterion Wireless Modules reference configuration.
  • Page 59: Speech Processing

    As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems. While EGS3 is in Power-down mode, the input voltage at any MIC line must not exceed ±0.3V relative to AGND (see also Section 5.1).
  • Page 60: Single-Ended Microphone Input

     EGS3 Hardware Interface Description 3.14 Audio Interfaces 3.14.2.1 Single-ended Microphone Input Figure 21 as well as Figure 51 show an example of how to integrate a single-ended microphone input. = typ. 2k = typ. 5k = typ. 470Ohm VMIC = typ.
  • Page 61: Differential Microphone Input

     EGS3 Hardware Interface Description 3.14 Audio Interfaces 3.14.2.2 Differential Microphone Input Figure 22 shows a differential solution for connecting an electret microphone. = typ. 1k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ. 2.5V Vbias = 1.0V … 1.6V, typ.
  • Page 62: Line Input Configuration With Opamp

     EGS3 Hardware Interface Description 3.14 Audio Interfaces 3.14.2.3 Line Input Configuration with OpAmp Figure 23 shows an example of how to connect an opamp into the microphone circuit. = typ. 47k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ.
  • Page 63: Loudspeaker Circuit

     EGS3 Hardware Interface Description 3.14 Audio Interfaces 3.14.3 Loudspeaker Circuit The GSM module comprises two analog differential speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Inter- face EP2 can also be connected in single ended configuration.
  • Page 64: Table 17: Configuration Combinations For The Pcm Interface

     EGS3 Hardware Interface Description 3.14 Audio Interfaces For the PCM interface configuration the parameters <clock>, <mode> and <framemode> of the AT^SAIC command are used. The following table lists possible combinations: Table 17: Configuration combinations for the PCM interface Configuration <clock>...
  • Page 65: Master Mode

     EGS3 Hardware Interface Description 3.14 Audio Interfaces 3.14.4.1 Master Mode To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK) which is synchronous to the GSM system clock. The frequency of the bit clock is 256kHz or 512kHz.
  • Page 66: Slave Mode

     EGS3 Hardware Interface Description 3.14 Audio Interfaces The timing of a PCM long frame is shown in Figure 27. The 16-bit TXDAI and RXDAI data is transferred simultaneously in both directions while the frame sync pulse FS is high. For this rea- son the duration of a frame sync pulse is 16 BITCLK periods, starting at the rising edge of BIT- CLK.
  • Page 67: Figure 28: Slave Pcm Interface Application

     EGS3 Hardware Interface Description 3.14 Audio Interfaces Figure 28: Slave PCM interface application The following figures show the slave short and long frame timings. Because these are edge controlled, frame sync signals may deviate from the ideally form as shown with the dotted lines.
  • Page 68: Control Signals

    Your platform design must be such that the incoming signal accommodates sufficient power supply to the EGS3 module if required. This can be achieved by lowering the current drawn from other components installed in your application.
  • Page 69: Using The Sync Line To Control A Status Led

    As an alternative to generating the synchronization signal, the SYNC line can be configured to drive a status LED that indicates different operating modes of the EGS3 module. To take ad- vantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application.
  • Page 70: Behavior Of The Ring0 Line (Asc0 Interface Only)

     EGS3 Hardware Interface Description 3.15 Control Signals 3.15.3 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface ASC0 (see also Section 3.9). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).
  • Page 71: Antenna Interface

    4 Antenna Interface Antenna Interface The RF interface has an impedance of 50Ω. EGS3 is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi- ated power, modulation accuracy and harmonic suppression.
  • Page 72: Rf Line Routing Design

    RF Line Routing Design To give an example, Cinterion has developed an interface adapter board for EGS3 that gives a hint of how an application board could be designed with respect to the correct RF line imped- ance.
  • Page 73 These line parameters - 800µm width, 1.200µm distance to ground and 200µm distance to both sides - are used for the wiring outside the area populated by the EGS3 module, i.e., the trans- mission line to the antenna connector as shown in Figure Within the area populated by the EGS3 module, the RF line width shall be reduced to 700µm...
  • Page 74: Figure 37: Rf Line On Interface Board. All Dimensions Are Given In Mm

     EGS3 Hardware Interface Description 4.2 RF Line Routing Design Figure 37: RF line on interface board. All dimensions are given in mm EGS3_HD_v01.000a Page 74 of 117 2009-08-12 Confidential / Released...
  • Page 75: Electrical, Reliability And Radio Characteristics

    Absolute Maximum Ratings The absolute maximum ratings stated in Table 20 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to EGS3. Table 20: Absolute maximum ratings Parameter Unit Peak current of power supply Supply voltage BATT+ -0.3...
  • Page 76: Operating Temperatures

    +75 to +85 °C 1. Temperature values are based on a setup with EGS3 mounted onto an adapter without any heat gene- rating components and connected via flex cable to the Cinterion DSB75 Evaluation Kit. 2. Restricted operation allows normal mode speech calls or data transmission for limited time until auto- matic thermal shutdown takes effect.
  • Page 77: Storage Conditions

     EGS3 Hardware Interface Description 5.3 Storage Conditions Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.
  • Page 78: Reliability Characteristics

     EGS3 Hardware Interface Description 5.4 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 25: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz; acceleration: 5g DIN IEC 68-2-6 Frequency range: 20-500Hz;...
  • Page 79: Pad Assignment And Signal Description

    EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Pad Assignment and Signal Description The SMT application interface on the EGS3 provides connecting pads to integrate the module into external applications. Figure 38 shows the connecting pads’ numbering plan, the following Table 26 lists the pads’...
  • Page 80: Table 26: Pad Assignments

     EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 26: Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name Do not use BATTEMP VCHARGE VUSB_IN EMERG_OFF Do not use CTS0 MICN2 CCRST...
  • Page 81: Table 27: Signal Description

    5.5 Pad Assignment and Signal Description Please note that the reference voltages listed in Table 27 are the values measured directly on the EGS3 module. They do not apply to the accessories connected. Table 27: Signal description Function Signal name Signal form and level...
  • Page 82  EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment External VEXT Normal mode: VEXT may be used for applica- supply min = 2.75V tion circuits, for example to sup- voltage typ = 2.93V...
  • Page 83 4.616ms, with 180µs forward time. ent during handover. b) Driving a status LED to indi- cate different operating modes of EGS3. The LED must be installed in the host application. To select a) or b) use the AT^SSYNC command. If unused keep line open.
  • Page 84  EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment ASC1 RXD1 max = 0.2V at I = 2mA 4-wire serial interface for AT Serial min = 2.55V at I = -0.5mA commands or data stream.
  • Page 85  EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment CCIN  100k CCIN = Low, SIM card holder interface max = 0.6V at I = -25µA...
  • Page 86  EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment SPIDI max = 0.2V at I = 2mA If the Serial Peripheral Interface Serial min = 2.55V at I = -0.5mA...
  • Page 87  EGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment Analog VMIC min = 2.4V Microphone supply for cus- Audio typ = 2.5V tomer feeding circuits interface max = 2.6V...
  • Page 88: Power Supply Ratings

     EGS3 Hardware Interface Description 5.6 Power Supply Ratings Power Supply Ratings Table 28: Power supply ratings Parameter Description Conditions Unit BATT+ Supply voltage Directly measured at reference point TP BATT+ and TP GND, see Section 3.2.2. Voltage must stay within the min/max values, including voltage drop, ripple, spikes.
  • Page 89: Table 29: Current Consumption During Tx Burst For Gsm 850Mhz And Gsm 900Mhz

     EGS3 Hardware Interface Description 5.6 Power Supply Ratings Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx...
  • Page 90: Table 30: Current Consumption During Tx Burst For Gsm 1800Mhz And Gsm 1900Mhz

     EGS3 Hardware Interface Description 5.6 Power Supply Ratings Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx...
  • Page 91: Electrical Characteristics Of The Voiceband Part

     EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Electrical Characteristics of the Voiceband Part 5.7.1 Setting Audio Parameters by AT Commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters.
  • Page 92: Audio Programming Model

     EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters inBbcGain and inCalibrate can be set with AT^SNFI.
  • Page 93: Characteristics Of Audio Modes

     EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. All values are noted for default gains e.g. all parameters of AT^SNFI and AT^SNFO are left unchanged.
  • Page 94: Voiceband Receive Path

     EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 1kHz with default audio mode settings, unless otherwise stated. • Default audio mode settings are: mode=5 for EPP1 to EPN1 and mode=6 for EPP2 to EPN2, outBbcGain=1 (Mode 5) or outBbcGain=0 (Mode 6), OutCalibrate=16384 (vol- ume=4) or OutCalibrate=11585 (volume=3), sideTone=0.
  • Page 95  EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Table 33: Voiceband receive path Parameter Unit Test condition / remark Frequency Response 0Hz - 100Hz 200Hz -1.1 300Hz - 3350Hz -0.2 3400Hz -0.7 4000Hz >4400Hz 1. That means the differential voltage at EPP1/EPN1 for a sine wave must not exceed 3.8 Vpp at 8 Ohm.
  • Page 96: Voiceband Transmit Path

     EGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.5 Voiceband Transmit Path Test conditions: • The values specified below were tested to 1kHz and default audio mode settings, unless otherwise stated. • Parameter setup: Audio mode=5 for MICP1 to MICN1 and 6 for MICP2 to MICN2, inBbc-...
  • Page 97: Air Interface

    Test conditions: All measurements have been performed at T = 25°C, V = 4.0V. The BATT+ nom reference points used on EGS3 are the BATT+ and GND contacts (test points are shown in Figure Table 35: Air interface Parameter Unit...
  • Page 98: Electrostatic Discharge

    SIM interface: clamp diodes for protection against overvoltage. The remaining ports of EGS3 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the "Human Body Model"...
  • Page 99: Mechanics, Mounting And Packaging

    6 Mechanics, Mounting and Packaging Mechanics, Mounting and Packaging Mechanical Dimensions of EGS3 Figure 40 shows the top view of EGS3 and provides an overview of the board's mechanical dimensions. For further details see Figure Figure 40: EGS3– top view EGS3_HD_v01.000a...
  • Page 100: Figure 41: Dimensions Of Egs3 (All Dimensions In Mm)

     EGS3 Hardware Interface Description 6.1 Mechanical Dimensions of EGS3 Figure 41: Dimensions of EGS3 (all dimensions in mm) EGS3_HD_v01.000a Page 100 of 117 2009-08-12 Confidential / Released...
  • Page 101: Mounting Egs3 Onto The Application Platform

    Taking the copper pad area as base, maximum possible overprinting is 85% of this area. How- ever, Cinterion tests have shown that for most pads an overprinting of 40% is well suited, i.e., 1.3mm x 1.3mm. An exception is the RF pad: Because of the smaller distance to the adjacent ground pads, there should be no overprinting to optimize RF performance.
  • Page 102: Board Level Characterization

     EGS3 Hardware Interface Description 6.2 Mounting EGS3 onto the Application Platform Figure 43: Recommended stencil design (bottom view) 6.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro- cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.
  • Page 103: Moisture Sensitivity Level

    Moisture Sensitivity Level EGS3 comprises components that are susceptible to damage induced by absorbed moisture. Cinterion’s EGS3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan- dard for moisture sensitive surface mount devices and is classified as MSL 4.
  • Page 104: Maximum Temperature And Duration

    EGS3 is specified for one soldering cycle only. Once EGS3 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.
  • Page 105: Durability And Mechanical Handling

    6.2.4.1 Storage Life EGS3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90%.
  • Page 106: Packaging

    45. The figure also shows the prop- er part orientation. The tape width is 56 mm and the EGS3 modules are placed on the tape with a 36-mm pitch. The reels are 330mm in diameter with 150mm hubs. Each reel contains 300 modules.
  • Page 107: Barcode Label

     EGS3 Hardware Interface Description 6.3 Packaging 6.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 47: Barcode label on tape reel EGS3_HD_v01.000a Page 107 of 117...
  • Page 108: Shipping Materials

    6.3 Packaging 6.3.2 Shipping Materials EGS3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute EGS3 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card •...
  • Page 109: Figure 49: Moisture Sensitivity Label

     EGS3 Hardware Interface Description 6.3 Packaging Figure 49: Moisture Sensitivity Label EGS3_HD_v01.000a Page 109 of 117 2009-08-12 Confidential / Released...
  • Page 110: Transportation Box

     EGS3 Hardware Interface Description 6.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.
  • Page 111: Sample Application

    The internal pull-up resistors (Rp) of the I2C interface can be connected to an external power supply or to the VEXT line of EGS3. The advantage of using VEXT is that when the module enters the Power-down mode, the I2CI interface is shut down as well. If you prefer to connect the resistors to an external power supply, take care that the interface is shut down when the PWR_IND signal goes high in Power-down mode.
  • Page 112  EGS3 Hardware Interface Description 7 Sample Application Sample Application CRS04 up to 7.0V charge BC847 EMERG_OFF BATTEMP BC847 VSENSE VCC µC 100k ISENSE PWR_IND CHARGEGATE Digital Audio 2 x R SYNC For debug and/or test purposes test points will have to be provided...
  • Page 113: Reference Approval

     EGS3 Hardware Interface Description 8 Reference Approval Reference Approval Reference Equipment for Type Approval The Cinterion Wireless Modules reference setup submitted to type approve EGS3 consists of the following components: • Cinterion Wireless Module EGS3 (mounted on adapter) •...
  • Page 114: Compliance With Fcc And Ic Rules And Regulations

    Manufacturers of mobile or fixed devices incorporating EGS3 modules are authorized to use the FCC Grants and Industry Canada Certificates of the EGS3 modules for their own final prod- ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat- ing "Contains FCC ID QIPEGS3", and accordingly “Contains IC 7830A-EGS3“.
  • Page 115  EGS3 Hardware Interface Description 8.2 Compliance with FCC and IC Rules and Regulations FCC RF Radiation Exposure Statement "This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunc- tion with any other antenna or transmitter."...
  • Page 116: Appendix

     EGS3 Hardware Interface Description 9 Appendix Appendix List of Parts and Accessories Table 38: List of parts and accessories Description Supplier Ordering information EGS3 Cinterion Standard module (CWM IMEI): Cinterion ordering number: L30960-N1550-A100 Customer IMEI mode: (CS IMEI) Cinterion ordering number: L30960-N1555-A100...
  • Page 117: Table 39: Molex Sales Contacts (Subject To Change)

     EGS3 Hardware Interface Description 9.1 List of Parts and Accessories Table 39: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Felix-Wankel-Str. 11 Lisle, Illinois 60532 http://www.molex.com 4078 Heilbronn-Biberach U.S.A. Germany...

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