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Cinterion EGS3 manual available for free PDF download: Hardware Interface Description
Cinterion EGS3 Hardware Interface Description (117 pages)
Brand:
Cinterion
| Category:
Control Unit
| Size: 2 MB
Table of Contents
Table of Contents
3
Document History
9
Introduction
10
Related Documents
10
Terms and Abbreviations
10
Regulatory and Type Approval Information
14
Directives and Standards
14
Table 1: Directives
14
Table 2: Standards of North American Type Approval
14
Table 3: Standards of European Type Approval
14
Table 4: Requirements of Quality
15
Table 5: Standards of the Ministry of Information Industry of the
15
SAR Requirements Specific to Portable Mobiles
16
Table 6: Toxic or Hazardous Substances or Elements with Defined Concentration Limits
16
Safety Precautions
17
Product Concept
18
Key Features at a Glance
18
EGS3 System Overview
21
Figure 1: EGS3 System Overview
21
Circuit Concept
22
Figure 2: EGS3 Block Diagram
22
Application Interface
23
Operating Modes
24
Table 7: Overview of Operating Modes
24
Power Supply
25
Minimizing Power Losses
25
Figure 3: Power Supply Limits During Transmit Burst
25
Measuring the Supply Voltage VBATT
26
Monitoring Power Supply by at Command
26
Figure 4: Position of Reference Points Batt+And GND
26
Power up / Power down Scenarios
27
Turn on EGS3
27
Turn on EGS3 Using Ignition Line IGT
27
Figure 5: Powerup with Operating Voltage at BATT+ Applied before Activating IGT
28
Figure 6: Powerup with IGT Held Low before Switching on Operating Voltage at BATT
29
Configuring the IGT Line for Use as ON/OFF Switch
30
Turn on EGS3 Using the VCHARGE Signal
30
Figure 7: Timing of IGT if Used as ON/OFF Switch
30
Reset EGS3 Via AT+CFUN Command
31
Reset or Turn off EGS3 in Case of Emergency
31
Using EMERG_OFF Signal to Reset Application(S) or External Device(S)
31
Signal States after Startup
32
Table 8: Signal States
32
Turn off EGS3
34
Turn off EGS3 Using at Command
34
Figure 8: Signal States During Turn-Off Procedure
35
Turn On/Off EGS3 Applications with Integrated USB
36
Automatic Shutdown
36
Thermal Shutdown
37
Table 9: Temperature Dependent Behavior
37
Deferred Shutdown at Extreme Temperature Conditions
38
Undervoltage Shutdown
38
Overvoltage Shutdown
39
Automatic GPRS Multislot Class Change
40
Charging Control
41
Hardware Requirements
41
Software Requirements
41
Battery Pack Requirements
42
Figure 9: Battery Pack Circuit Diagram
42
Batteries Tested for Use with EGS3
43
Table 10: Specifications of Battery Packs Suited for Use with EGS3
43
Charger Requirements
44
Implemented Charging Technique
44
Operating Modes During Charging
45
Table 11: at Commands Available in Charge-Only Mode
45
Table 12: Comparison Charge-Only and Charge Mode
46
Power Saving
47
Network Dependency of SLEEP Modes
47
Figure 10: Power Saving and Paging
47
Timing of the Ctsx Signal in CYCLIC SLEEP Mode 7
48
Timing of the Rtsx Signal in CYCLIC SLEEP Mode 9
48
Figure 11: Timing of Ctsx Signal (if CFUN= 7)
48
Figure 12: Timing of Rtsx Signal (if CFUN = 9)
48
Summary of State Transitions (Except SLEEP Mode)
49
Table 13: State Transitions of EGS3 (Except SLEEP Mode)
49
SIM Interface
50
Table 14: Signals of the SIM Interface (SMT Application Interface)
50
Serial Interface ASC0
51
Figure 13: Serial Interface ASC0
51
Table 15: DCE-DTE Wiring of ASC0
52
Serial Interface ASC1
53
Table 16: DCE-DTE Wiring of ASC1
53
Figure 14: Serial Interface ASC1
53
USB Interface
54
Figure 15: USB Circuit
54
I 2 C Interface
55
Figure 16: I 2 C Interface Connected to VCC of Application
55
Figure 17: I 2 C Interface Connected to VEXT Line of EGS3
55
SPI Interface
56
Figure 18: SPI Interface
56
Figure 19: Characteristics of SPI Modes
57
Audio Interfaces
58
Figure 20: Audio Block Diagram
58
Speech Processing
59
Microphone Circuit
59
Single-Ended Microphone Input
60
Figure 21: Single Ended Microphone Input
60
Differential Microphone Input
61
Figure 22: Differential Microphone Input
61
Line Input Configuration with Opamp
62
Figure 23: Line Input Configuration with Opamp
62
Loudspeaker Circuit
63
Digital Audio Interface (DAI)
63
Figure 24: Differential Loudspeaker Configuration
63
Table 17: Configuration Combinations for the PCM Interface
64
Table 18: Overview of DAI Signal Functions
64
Master Mode
65
Figure 25: Master PCM Interface Application
65
Figure 26: Short Frame PCM Timing
65
Slave Mode
66
Figure 27: Long Frame PCM Timing
66
Figure 28: Slave PCM Interface Application
67
Figure 29: Slave PCM Timing, Short Frame Selected
67
Figure 30: Slave PCM Timing, Long Frame Selected
67
Control Signals
68
Synchronization Signal
68
Figure 31: SYNC Signal During Transmit Burst
68
Using the SYNC Line to Control a Status LED
69
Figure 32: LED Circuit (Example)
69
Behavior of the RING0 Line (ASC0 Interface Only)
70
PWR_IND Signal
70
Figure 33: Incoming Voice/Fax/Data Call
70
Figure 34: URC Transmission
70
Antenna Interface
71
Antenna Installation
71
Table 19: Return Loss in the Active Band
71
Figure 35: Antenna Pads
71
RF Line Routing Design
72
Figure 36: 4 Layer PCB Stack for EGS3 Interface Board
72
Figure 37: RF Line on Interface Board. All Dimensions Are Given in MM
74
Electrical, Reliability and Radio Characteristics
75
Absolute Maximum Ratings
75
Table 20: Absolute Maximum Ratings
75
Operating Temperatures
76
Table 21: Board / Battery Temperature
76
Table 22: Ambient Temperature According to IEC 60068-2 (Without Forced Air Circulation)
76
Table 23: Charging Temperature
76
Storage Conditions
77
Table 24: Storage Conditions
77
Reliability Characteristics
78
Table 25: Summary of Reliability Test Conditions
78
Pad Assignment and Signal Description
79
Figure 38: Numbering Plan for Connecting Pads (Bottom View)
79
Table 26: Pad Assignments
80
Table 27: Signal Description
81
Power Supply Ratings
88
Table 28: Power Supply Ratings
88
Table 29: Current Consumption During Tx Burst for GSM 850Mhz and GSM 900Mhz
89
Table 30: Current Consumption During Tx Burst for GSM 1800Mhz and GSM 1900Mhz
90
Electrical Characteristics of the Voiceband Part
91
Setting Audio Parameters by at Commands
91
Table 31: Audio Parameters Adjustable by at Commands
91
Audio Programming Model
92
Figure 39: Audio Programming Model
92
Characteristics of Audio Modes
93
Table 32: Voiceband Characteristics (Typical)
93
Voiceband Receive Path
94
Table 33: Voiceband Receive Path
94
Voiceband Transmit Path
96
Table 34: Voiceband Transmit Path
96
Air Interface
97
Table 35: Air Interface
97
Electrostatic Discharge
98
Table 36: Measured Electrostatic Values
98
Mechanics, Mounting and Packaging
99
Mechanical Dimensions of EGS3
99
Figure 40: EGS3- Top View
99
Figure 41: Dimensions of EGS3 (All Dimensions in MM)
100
Mounting EGS3 Onto the Application Platform
101
SMT PCB Assembly
101
Land Pattern and Stencil
101
Figure 42: Land Pattern (Bottom View)
101
Board Level Characterization
102
Figure 43: Recommended Stencil Design (Bottom View)
102
Moisture Sensitivity Level
103
Soldering Conditions and Temperature
103
Reflow Profile
103
Figure 44: Reflow Profile
103
Maximum Temperature and Duration
104
Table 37: Reflow Temperature Ratings
104
Durability and Mechanical Handling
105
Storage Life
105
Processing Life
105
Baking
105
Electrostatic Discharge
105
Packaging
106
Tape and Reel
106
Orientation
106
Figure 45: Carrier Tape
106
Figure 46: Reel Direction
106
Barcode Label
107
Figure 47: Barcode Label on Tape Reel
107
Shipping Materials
108
Moisture Barrier Bag
108
Figure 48: Moisture Barrier Bag (MBB) with Imprint
108
Figure 49: Moisture Sensitivity Label
109
Transportation Box
110
Figure 50: Humidity Indicator Card - HIC
110
Sample Application
111
Reference Approval
113
Reference Equipment for Type Approval
113
Compliance with FCC and IC Rules and Regulations
114
Appendix
116
List of Parts and Accessories
116
Table 38: List of Parts and Accessories
116
Table 39: Molex Sales Contacts (Subject to Change)
117
Table 40: Hirose Sales Contacts (Subject to Change)
117
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