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Cinterion EES3 Hardware Interface Description

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EES3
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Summary of Contents for Cinterion EES3

  • Page 1  EES3 Version: 01.100b DocId: EES3_HD_v01.100b...
  • Page 2 UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB- JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT.

  • Page 3: Table Of Contents

    Turn on EES3 Using the VCHARGE Signal......30 3.3.1.4 Reset EES3 via AT+CFUN Command ........ 31 3.3.1.5 Reset or Turn off EES3 in Case of Emergency ....31 3.3.1.6 Using EMERG_OFF Signal to Reset Application(s) or External Device(s) ............... 31 3.3.2...
  • Page 4  EES3 Hardware Interface Description Contents 3.5.5 Charger Requirements................ 44 3.5.6 Implemented Charging Technique............44 3.5.7 Operating Modes during Charging............45 Power Saving....................47 3.6.1 Network Dependency of SLEEP Modes ..........47 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7....... 48 3.6.3...
  • Page 5 Voiceband Transmit Path..............97 Air Interface...................... 98 Electrostatic Discharge ..................99 Mechanics, Mounting and Packaging ..............100 Mechanical Dimensions of EES3..............100 Mounting EES3 onto the Application Platform ..........102 6.2.1 SMT PCB Assembly ................. 102 6.2.1.1 Land Pattern and Stencil ........... 102 6.2.1.2...
  • Page 6 Signal states....................32 Table 9: Temperature dependent behavior..............37 Table 10: Specifications of battery packs suited for use with EES3 ......43 Table 11: AT commands available in Charge-only mode ..........45 Table 12: Comparison Charge-only and Charge mode ..........46 Table 13: State transitions of EES3 (except SLEEP mode)...........
  • Page 7 URC transmission ..................71 Figure 38: Antenna pads ....................72 Figure 39: 4 layer PCB stack for EES3 interface board ..........73 Figure 40: RF line on interface board. All dimensions are given in mm ......75 Figure 41: Numbering plan for connecting pads (bottom view)........80 Figure 42: Audio programming model ................
  • Page 8 Moisture barrier bag (MBB) with imprint............109 Figure 52: Moisture Sensitivity Label ................110 Figure 53: Humidity Indicator Card - HIC ..............111 Figure 54: EES3 sample application ................113 Figure 55: Reference equipment for Type Approval ............. 114 EES3_HD_v01.100b Page 8 of 118 2009-08-12...

  • Page 9: Document History

     EES3 Hardware Interface Description 0 Document History Document History Preceding document: "EES3 Hardware Interface Description" Version 01.100a New document: "EES3 Hardware Interface Description" Version 01.100b Chapter What is new 3.3.1.1 Removed URC "Shutdown after Illegal Powerup". 3.3.2 Table 8: Changed values of PU = Pull up: typ. -200µA and max. -350µA 3.10...

  • Page 10: Introduction

    Introduction This document describes the hardware of the Cinterion EES3 module that connects to the cel- lular device application and the air interface. It helps you quickly retrieve interface specifica- tions, electrical and mechanical details and information on the requirements to be considered for integrating further components.
  • Page 11 Digital-to-Analog Converter Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Cinterion GSM module) DCS 1800 Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box...
  • Page 12  EES3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description kbps kbits per second Light Emitting Diode Li-Ion / Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mbps Mbits per second Man Machine Interface Mobile Originated...
  • Page 13  EES3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface SRAM Static Random Access Memory Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access...

  • Page 14: Regulatory And Type Approval Information

    1.3.1 Directives and Standards EES3 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec- ifications provided in the "EES3 Hardware Interface Description".

  • Page 15: Table 4: Requirements Of Quality

     EES3 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 3: Standards of European type approval ETSI EN 301 489-7 Candidate Harmonized European Standard (Telecommunications series) V1.2.1 (2000-09) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec- tro Magnetic Compatibility (EMC) standard for radio equipment and ser- vices;...

  • Page 16: Sar Requirements Specific To Portable Mobiles

    Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable EES3 based applications to be evalu- ated and approved for compliance with national and/or international regulations.

  • Page 17: Safety Precautions

    The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EES3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.

  • Page 18: Product Concept

     EES3 Hardware Interface Description 2 Product Concept Product Concept Key Features at a Glance Feature Implementation General Frequency bands Quad band: GSM 850/900/1800/1900MHz GSM class Small MS Output power (according Class 4 (+33dBm ±2dB) for EGSM850 to Release 99) Class 4 (+33dBm ±2dB) for EGSM900...
  • Page 19 Access by AT commands Remote SIM Access EES3 supports Remote SIM Access. RSA enables EES3 to use a remote SIM card via its serial interface and an external application, in addition to the SIM card locally attached to the dedicated lines of the application inter- face.
  • Page 20  EES3 Hardware Interface Description 2.1 Key Features at a Glance Feature Implementation C bus for 7-bit addressing and transmission rates up to 400kbps. Pro- grammable with AT^SSPI command. Alternatively, all lines of the I²C interface are configurable as SPI.

  • Page 21: Ees3 System Overview

     EES3 Hardware Interface Description 2.2 EES3 System Overview EES3 System Overview Figure 1: EES3 system overview EES3_HD_v01.100b Page 21 of 118 2009-08-12 Confidential / Released...

  • Page 22: Circuit Concept

     EES3 Hardware Interface Description 2.3 Circuit Concept Circuit Concept Figure 2 shows a block diagram of the EES3 module and illustrates the major functional com- ponents: Baseband block: • Digital baseband processor with DSP • Analog processor with power supply unit (PSU) •...

  • Page 23: Application Interface

     EES3 Hardware Interface Description 3 Application Interface Application Interface EES3 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • Power supply - see Section 3.2...

  • Page 24: Operating Modes

     EES3 Hardware Interface Description 3.1 Operating Modes Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Normal operation GSM / GPRS SLEEP Various power save modes set with AT+CFUN command.

  • Page 25: Power Supply

    EES3 needs to be connected to a power supply at the SMT application interface (3 lines each BATT+ and GND). The power supply of EES3 has to be a single voltage source at BATT+. It must be able to pro- vide the peak current during the uplink transmission.

  • Page 26: Measuring The Supply Voltage Vbatt

    RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when EES3 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.

  • Page 27: Power Up / Power Down Scenarios

    EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Power Up / Power Down Scenarios In general, be sure not to turn on EES3 while it is beyond the safety limits of voltage and tem- perature stated in Chapter 5.

  • Page 28: Figure 5: Powerup With Operating Voltage At Batt+ Applied Before Activating Igt

    AT\Q or AT+IFC (see for details). The default setting of EES3 is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART”...

  • Page 29: Figure 6: Powerup With Igt Held Low Before Switching On Operating Voltage At Batt

     EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios For details on how to use EMERG_OFF to reset ap- plications or external devices see Section 3.3.1.6. Figure 6: Powerup with IGT held low before switching on operating voltage at BATT+ EES3_HD_v01.100b...

  • Page 30: Configuring The Igt Line For Use As On/Off Switch

    Switch-on condition:If the EES3 is off, the IGT line must be asserted for at least 400ms before being released. The module switches on after 400ms. Switch-off condition:If the EES3 is on, the IGT line must be asserted for at least 1s before being released. The module switches off after the line is released. The switch- off routine is identical with the procedure initiated by AT^SMSO, i.e.

  • Page 31: Reset Ees3 Via At+Cfun Command

    EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios During the Charge-only mode EES3 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch from Charge-only mode to Normal mode the ignition line (IGT) must be pulled low for at least 2 seconds.

  • Page 32: Signal States After Startup

     EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.2 Signal States after Startup Table 8 describes the various states each interface signal passes through after startup and dur- ing operation. As shown in Figure 5 Figure 6 signals are in an undefined state while the module is initial- izing.
  • Page 33  EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Table 8: Signal states Signal name Undefined state Defined state Active state after configuration by AT during startup after startup ini- command tialization DAI4 Tristate DAI5 Tristate DAI6 Tristate 1.

  • Page 34: Turn Off Ees3

    The best and safest approach to powering down EES3 is to issue the AT^SMSO command. This procedure lets EES3 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power- down mode.

  • Page 35: Figure 8: Signal States During Turn-Off Procedure

     EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Figure 8: Signal states during turn-off procedure Note 1: Depending on capacitance load from host application. EES3_HD_v01.100b Page 35 of 118 2009-08-12 Confidential / Released...

  • Page 36: Turn On/Off Ees3 Applications With Integrated Usb

    Turn on/off EES3 Applications with Integrated USB In a Windows environment, the USB COM port emulation causes the USB port of EES3 to ap- pear as a virtual COM port (VCOM port). The VCOM port emulation is only present when Win- dows can communicate with the module, and is lost when the module shuts down.

  • Page 37: Thermal Shutdown

    The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, EES3 instantly displays an alert (if enabled).

  • Page 38: Deferred Shutdown At Extreme Temperature Conditions

     EES3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex- ceeded: • While an emergency call is in progress.

  • Page 39: Overvoltage Shutdown

    Keep in mind that several EES3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of EES3, even if the module is switched off. Es- pecially the power amplifier is very sensitive to high voltage and might even be destroyed.

  • Page 40: Automatic Gprs Multislot Class Change

    This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops by 5 degrees, EES3 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, EES3 will not switch back to the higher class.

  • Page 41: Charging Control

    Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the EES3 module to correctly determine the end of charg- ing and terminate charging automatically when the battery is fully charged. If the <current> val- ue is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage.

  • Page 42: Battery Pack Requirements

    Table 10. It is recommended that the battery pack you want to integrate into your EES3 application is compliant with these specifications. This ensures re- liable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.

  • Page 43: Batteries Tested For Use With Ees3

    3.5.4 Batteries Tested for Use with EES3 When you choose a battery for your EES3 application you can take advantage of one of the following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all require- ments listed above. They have been thoroughly tested by Cinterion Wireless Modules and proved to be suited for EES3.

  • Page 44: Charger Requirements

    Duration of charging: • EES3 provides a software controlled timer set to 4 hours as a safety feature to prevent per- manent charging of defective batteries. The duration of software controlled charging depends on the battery capacity and the level of discharge. Normally, charging stops when the battery is fully charged or, at the latest, when the software timer expires after 4 hours.

  • Page 45: Operating Modes During Charging

    If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE line while EES3 is in Power-down mode, EES3 goes into Charge-only mode. While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism.

  • Page 46: Table 12: Comparison Charge-Only And Charge Mode

    Battery can be charged while GSM module Charge host application charging circuit and remains operational and registered to the mode module’s VCHARGE line while EES3 is GSM network. • operating, e.g. in IDLE or TALK • In IDLE and TALK mode, the serial inter- mode faces are accessible.

  • Page 47: Power Saving

    CLIC SLEEP mode is that the serial interface remains accessible and that, in intermittent wake- up periods, characters can be sent or received without terminating the selected mode. This al- lows the EES3 to wake up for the duration of an event and, afterwards, to resume power sav- ing. Please refer to for a summary of all SLEEP modes and the different ways of waking up the module.

  • Page 48: Timing Of The Ctsx Signal In Cyclic Sleep Mode 7

     EES3 Hardware Interface Description 3.6 Power Saving 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7 Figure 11 illustrates the CTSx signal timing in CYCLIC SLEEP mode 7 (CFUN=7). Figure 11: Timing of CTSx signal (if CFUN= 7) With regard to programming or using timeouts, the UART must take the varying CTS inactivity periods into account.

  • Page 49: Summary Of State Transitions (Except Sleep Mode)

     EES3 Hardware Interface Description 3.7 Summary of State Transitions (Except SLEEP Mode) Summary of State Transitions (Except SLEEP Mode) The following table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes).

  • Page 50: Rtc Backup

    The internal Real Time Clock of EES3 is supplied from a separate voltage regulator in the an- alog controller which is also active when EES3 is in POWER DOWN status. An alarm function is provided that allows to wake up EES3 to Airplane mode without logging on to the GSM net- work.

  • Page 51: Sim Interface

    To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test- ed to operate with EES3 and is part of the Cinterion Wireless Modules reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers.

  • Page 52: Serial Interface Asc0

    The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or in- active state). For electrical characteristics please refer to Table EES3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 53: Table 15: Dce-Dte Wiring Of Asc0

     EES3 Hardware Interface Description 3.10 Serial Interface ASC0 Table 15: DCE-DTE wiring of ASC0 V.24 circuit DCE Line function Signal direction Line function Signal direction TXD0 Input Output RXD0 Output Input RTS0 Input Output CTS0 Output Input 108/2 DTR0...

  • Page 54: Serial Interface Asc1

    0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table EES3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 55: Usb Interface

    The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s USB interface, but not to other EES3 interfaces. This is because EES3 is designed as a self- powered device compliant with the “Universal Serial Bus Specification Revision 2.0”...

  • Page 56: I 2 C Interface

    I2CDAT and the serial clock line I2CCLK. The EES3 module acts as a single master device, e.g. the clock I2CCLK is driven by module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times.

  • Page 57: Spi Interface

    SPIDI/SPIDO, the clock line SPICLK and the chip se- lect line SPICS. The EES3 module acts as a single master device, e.g. the clock SPICLK is driven by module. Whenever the SPICS line is in a low state, the SPI bus is activated and data can be transferred from the module and vice versa.

  • Page 58: Figure 22: Characteristics Of Spi Modes

     EES3 Hardware Interface Description 3.14 SPI Interface Figure 22: Characteristics of SPI modes EES3_HD_v01.100b Page 58 of 118 2009-08-12 Confidential / Released...

  • Page 59: Audio Interfaces

    5 can be used for direct access to the speech coder without signal pre or post processing. When shipped from factory, all audio parameters of EES3 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Cinterion Wireless Modules reference configuration.

  • Page 60: Speech Processing

    As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems. While EES3 is in Power-down mode, the input voltage at any MIC line must not exceed ±0.3V relative to AGND (see also Section 5.1).

  • Page 61: Single-Ended Microphone Input

     EES3 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.1 Single-ended Microphone Input Figure 24 as well as Figure 54 show an example of how to integrate a single-ended microphone input. = typ. 2k = typ. 5k = typ. 470Ohm VMIC = typ.

  • Page 62: Differential Microphone Input

     EES3 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.2 Differential Microphone Input Figure 25 shows a differential solution for connecting an electret microphone. = typ. 1k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ. 2.5V Vbias = 1.0V … 1.6V, typ.

  • Page 63: Line Input Configuration With Opamp

     EES3 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.3 Line Input Configuration with OpAmp Figure 26 shows an example of how to connect an opamp into the microphone circuit. = typ. 47k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ.

  • Page 64: Loudspeaker Circuit

     EES3 Hardware Interface Description 3.15 Audio Interfaces 3.15.3 Loudspeaker Circuit The GSM module comprises two analog differential speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Inter- face EP2 can also be connected in single ended configuration.

  • Page 65: Table 17: Configuration Combinations For The Pcm Interface

     EES3 Hardware Interface Description 3.15 Audio Interfaces For the PCM interface configuration the parameters <clock>, <mode> and <framemode> of the AT^SAIC command are used. The following table lists possible combinations: Table 17: Configuration combinations for the PCM interface Configuration <clock>...

  • Page 66: Master Mode

     EES3 Hardware Interface Description 3.15 Audio Interfaces 3.15.4.1 Master Mode To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK) which is synchronous to the GSM system clock. The frequency of the bit clock is 256kHz or 512kHz.

  • Page 67: Slave Mode

     EES3 Hardware Interface Description 3.15 Audio Interfaces The timing of a PCM long frame is shown in Figure 30. The 16-bit TXDAI and RXDAI data is transferred simultaneously in both directions while the frame sync pulse FS is high. For this rea- son the duration of a frame sync pulse is 16 BITCLK periods, starting at the rising edge of BIT- CLK.

  • Page 68: Figure 31: Slave Pcm Interface Application

     EES3 Hardware Interface Description 3.15 Audio Interfaces Figure 31: Slave PCM interface application The following figures show the slave short and long frame timings. Because these are edge controlled, frame sync signals may deviate from the ideally form as shown with the dotted lines.

  • Page 69: Control Signals

    Your platform design must be such that the incoming signal accommodates sufficient power supply to the EES3 module if re- quired. This can be achieved by lowering the current drawn from other components installed in your application.

  • Page 70: Using The Sync Line To Control A Status Led

    As an alternative to generating the synchronization signal, the SYNC line can be configured to drive a status LED that indicates different operating modes of the EES3 module. To take ad- vantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application.

  • Page 71: Behavior Of The Ring0 Line (Asc0 Interface Only)

     EES3 Hardware Interface Description 3.16 Control Signals 3.16.3 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface ASC0 (see also Section 3.10). The sig- nal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).

  • Page 72: Antenna Interface

    4 Antenna Interface Antenna Interface The RF interface has an impedance of 50Ω. EES3 is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi- ated power, modulation accuracy and harmonic suppression.

  • Page 73: Rf Line Routing Design

    RF Line Routing Design To give an example, Cinterion has developed an interface adapter board for EES3 that gives a hint of how an application board could be designed with respect to the correct RF line imped- ance.
  • Page 74 These line parameters - 800µm width, 1.200µm distance to ground and 200µm distance to both sides - are used for the wiring outside the area populated by the EES3 module, i.e., the trans- mission line to the antenna connector as shown in Figure Within the area populated by the EES3 module, the RF line width shall be reduced to 700µm...

  • Page 75: Figure 40: Rf Line On Interface Board. All Dimensions Are Given In Mm

     EES3 Hardware Interface Description 4.2 RF Line Routing Design Figure 40: RF line on interface board. All dimensions are given in mm EES3_HD_v01.100b Page 75 of 118 2009-08-12 Confidential / Released...

  • Page 76: Electrical, Reliability And Radio Characteristics

    Absolute Maximum Ratings The absolute maximum ratings stated in Table 20 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to EES3. Table 20: Absolute maximum ratings Parameter Unit Peak current of power supply Supply voltage BATT+ -0.3...

  • Page 77: Operating Temperatures

    +75 to +85 °C 1. Temperature values are based on a setup with EES3 mounted onto an adapter without any heat gene- rating components and connected via flex cable to the Cinterion DSB75 Evaluation Kit. 2. Restricted operation allows normal mode speech calls or data transmission for limited time until auto- matic thermal shutdown takes effect.

  • Page 78: Storage Conditions

     EES3 Hardware Interface Description 5.3 Storage Conditions Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.

  • Page 79: Reliability Characteristics

     EES3 Hardware Interface Description 5.4 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 25: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz; acceleration: 5g DIN IEC 68-2-6 Frequency range: 20-500Hz;...

  • Page 80: Pad Assignment And Signal Description

    EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Pad Assignment and Signal Description The SMT application interface on the EES3 provides connecting pads to integrate the module into external applications. Figure 41 shows the connecting pads’ numbering plan, the following Table 26 lists the pads’...

  • Page 81: Table 26: Pad Assignments

     EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 26: Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name VDDLP BATTEMP VCHARGE VUSB_IN EMERG_OFF Do not use CTS0 MICN2 CCRST DAI3 CCIO...

  • Page 82: Table 27: Signal Description

    5.5 Pad Assignment and Signal Description Please note that the reference voltages listed in Table 27 are the values measured directly on the EES3 module. They do not apply to the accessories connected. Table 27: Signal description Function Signal name Signal form and level...
  • Page 83  EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment External VEXT Normal mode: VEXT may be used for applica- supply min = 2.75V tion circuits, for example to sup- voltage typ = 2.93V...
  • Page 84 4.616ms, with 180µs forward time. ent during handover. b) Driving a status LED to indi- cate different operating modes of EES3. The LED must be installed in the host application. To select a) or b) use the AT^SSYNC command. If unused keep line open.
  • Page 85  EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment ASC0 RXD0 max = 0.2V at I = 2mA Serial interface for AT com- Serial min = 2.55V at I = -0.5mA mands or data stream.
  • Page 86  EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment CCIN  100k CCIN = Low, SIM card holder interface max = 0.6V at I = -25µA...
  • Page 87  EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment SPIDI max = 0.2V at I = 2mA If the Serial Peripheral Interface Serial min = 2.55V at I = -0.5mA...
  • Page 88  EES3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment Analog VMIC min = 2.4V Microphone supply for cus- Audio typ = 2.5V tomer feeding circuits interface max = 2.6V...

  • Page 89: Power Supply Ratings

     EES3 Hardware Interface Description 5.6 Power Supply Ratings Power Supply Ratings Table 28: Power supply ratings Parameter Description Conditions Unit BATT+ Supply voltage Directly measured at reference point TP BATT+ and TP GND, see Section 3.2.2. Voltage must stay within the min/max values, including voltage drop, ripple, spikes.

  • Page 90: Table 29: Current Consumption During Tx Burst For Gsm 850Mhz And Gsm 900Mhz

     EES3 Hardware Interface Description 5.6 Power Supply Ratings Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 EPGRS EGPRS Class 10 EGPRS Class 12 Class 8...

  • Page 91: Table 30: Current Consumption During Tx Burst For Gsm 1800Mhz And Gsm 1900Mhz

     EES3 Hardware Interface Description 5.6 Power Supply Ratings Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 EPGRS EGPRS Class 10 EGPRS Class 12 Class 8...

  • Page 92: Electrical Characteristics Of The Voiceband Part

     EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Electrical Characteristics of the Voiceband Part 5.7.1 Setting Audio Parameters by AT Commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters.

  • Page 93: Audio Programming Model

     EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters inBbcGain and inCalibrate can be set with AT^SNFI.

  • Page 94: Characteristics Of Audio Modes

     EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. All values are noted for default gains e.g. all parameters of AT^SNFI and AT^SNFO are left unchanged.

  • Page 95: Ees3_Hd_V01.100B

     EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 1kHz with default audio mode settings, unless otherwise stated. • Default audio mode settings are: mode=5 for EPP1 to EPN1 and mode=6 for EPP2 to EPN2, outBbcGain=1 (Mode 5) or outBbcGain=0 (Mode 6), OutCalibrate=16384 (vol- ume=4) or OutCalibrate=11585 (volume=3), sideTone=0.
  • Page 96  EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Table 33: Voiceband receive path Parameter Unit Test condition / remark Frequency Response 0Hz - 100Hz 200Hz -1.1 300Hz - 3350Hz -0.2 3400Hz -0.7 4000Hz >4400Hz 1. That means the differential voltage at EPP1/EPN1 for a sine wave must not exceed 3.8 Vpp at 8 Ohm.

  • Page 97: Voiceband Transmit Path

     EES3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.5 Voiceband Transmit Path Test conditions: • The values specified below were tested to 1kHz and default audio mode settings, unless otherwise stated. • Parameter setup: Audio mode=5 for MICP1 to MICN1 and 6 for MICP2 to MICN2, inBbc-...

  • Page 98: Air Interface

    Test conditions: All measurements have been performed at T = 25°C, V = 4.0V. The BATT+ nom reference points used on EES3 are the BATT+ and GND contacts (test points are shown in Fig- Table 35: Air interface Parameter Unit...

  • Page 99: Electrostatic Discharge

    SIM interface: clamp diodes for protection against overvoltage. The remaining ports of EES3 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the "Human Body Model"...

  • Page 100: Mechanics, Mounting And Packaging

    6 Mechanics, Mounting and Packaging Mechanics, Mounting and Packaging Mechanical Dimensions of EES3 Figure 43 shows the top view of EES3 and provides an overview of the board's mechanical di- mensions. For further details see Figure Figure 43: EES3– top view EES3_HD_v01.100b...

  • Page 101: Figure 44: Dimensions Of Ees3 (All Dimensions In Mm)

     EES3 Hardware Interface Description 6.1 Mechanical Dimensions of EES3 Figure 44: Dimensions of EES3 (all dimensions in mm) EES3_HD_v01.100b Page 101 of 118 2009-08-12 Confidential / Released...

  • Page 102: Mounting Ees3 Onto The Application Platform

    Taking the copper pad area as base, maximum possible overprinting is 85% of this area. How- ever, Cinterion tests have shown that for most pads an overprinting of 40% is well suited, i.e., 1.3mm x 1.3mm. An exception is the RF pad: Because of the smaller distance to the adjacent ground pads, there should be no overprinting to optimize RF performance.

  • Page 103: Board Level Characterization

     EES3 Hardware Interface Description 6.2 Mounting EES3 onto the Application Platform Figure 46: Recommended stencil design (bottom view) 6.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro- cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.

  • Page 104: Moisture Sensitivity Level

    Moisture Sensitivity Level EES3 comprises components that are susceptible to damage induced by absorbed moisture. Cinterion’s EES3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan- dard for moisture sensitive surface mount devices and is classified as MSL 4.

  • Page 105: Maximum Temperature And Duration

    EES3 is specified for one soldering cycle only. Once EES3 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.

  • Page 106: Durability And Mechanical Handling

    6.2.4.1 Storage Life EES3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90%.

  • Page 107: Packaging

    48. The figure also shows the prop- er part orientation. The tape width is 56 mm and the EES3 modules are placed on the tape with a 36-mm pitch. The reels are 330mm in diameter with 150mm hubs. Each reel contains 300 modules.

  • Page 108: Barcode Label

     EES3 Hardware Interface Description 6.3 Packaging 6.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 50: Barcode label on tape reel EES3_HD_v01.100b Page 108 of 118...

  • Page 109: Shipping Materials

    6.3 Packaging 6.3.2 Shipping Materials EES3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute EES3 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card •...

  • Page 110: Figure 52: Moisture Sensitivity Label

     EES3 Hardware Interface Description 6.3 Packaging Figure 52: Moisture Sensitivity Label EES3_HD_v01.100b Page 110 of 118 2009-08-12 Confidential / Released...

  • Page 111: Transportation Box

     EES3 Hardware Interface Description 6.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.

  • Page 112: Sample Application

    The internal pull-up resistors (Rp) of the I2C interface can be connected to an external power supply or to the VEXT line of EES3. The advantage of using VEXT is that when the module enters the Power-down mode, the I2CI interface is shut down as well. If you prefer to connect the resistors to an external power supply, take care that the interface is shut down when the PWR_IND signal goes high in Power-down mode.

  • Page 113: Figure 54: Ees3 Sample Application

     EES3 Hardware Interface Description 7 Sample Application Sample Application CRS04 up to 7.0V charge BC847 EMERG_OFF BATTEMP BC847 VSENSE VCC µC 100k ISENSE PWR_IND CHARGEGATE Digital Audio 2 x R SYNC For debug and/or test purposes test points will have to be provided...

  • Page 114: Reference Approval

     EES3 Hardware Interface Description 8 Reference Approval Reference Approval Reference Equipment for Type Approval The Cinterion Wireless Modules reference setup submitted to type approve EES3 consists of the following components: • Cinterion Wireless Module EES3 (mounted on adapter) •...

  • Page 115: Compliance With Fcc And Ic Rules And Regulations

    Manufacturers of mobile or fixed devices incorporating EES3 modules are authorized to use the FCC Grants and Industry Canada Certificates of the EES3 modules for their own final prod- ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat- ing "Contains FCC ID QIPEES3", and accordingly “Contains IC 7830A-EES3“.

  • Page 116: Ees3_Hd_V01.100B

     EES3 Hardware Interface Description 8.2 Compliance with FCC and IC Rules and Regulations FCC RF Radiation Exposure Statement "This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunc- tion with any other antenna or transmitter."...

  • Page 117: Appendix

     EES3 Hardware Interface Description 9 Appendix Appendix List of Parts and Accessories Table 38: List of parts and accessories Description Supplier Ordering information EES3 Cinterion Standard module (CWM IMEI): Cinterion ordering number: L30960-N1500-A100 Customer IMEI mode: (CS IMEI) Cinterion ordering number: L30960-N1505-A100...

  • Page 118: Table 39: Molex Sales Contacts (Subject To Change)

     EES3 Hardware Interface Description 9.1 List of Parts and Accessories Table 39: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Felix-Wankel-Str. 11 Lisle, Illinois 60532 http://www.molex.com 4078 Heilbronn-Biberach U.S.A. Germany...

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