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Cinterion EGS5 Hardware Interface Description

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EGS5
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02.004
DocId:
EGS5_HD_v02.004

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Summary of Contents for Cinterion EGS5

  • Page 1  EGS5 Version: 02.004 DocId: EGS5_HD_v02.004...
  • Page 2 UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB- JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT.

  • Page 3: Table Of Contents

    Turn on EGS5 Using the VCHARGE Signal ....... 32 3.3.1.4 Reset EGS5 via AT+CFUN Command........ 33 3.3.1.5 Reset or Turn off EGS5 in Case of Emergency ....33 3.3.1.6 Using EMERG_OFF Signal to Reset Application(s) or External Device(s)............... 33 3.3.2 Signal States after Startup ..............
  • Page 4  EGS5 Hardware Interface Description Contents 3.5.3 Battery Pack Requirements ..............43 3.5.4 Charger Requirements................ 44 3.5.5 Implemented Charging Technique............45 3.5.6 Operating Modes during Charging............46 Power Saving....................48 3.6.1 Network Dependency of SLEEP Modes ..........48 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7....... 49 3.6.3...
  • Page 5 Voiceband Transmit Path..............102 Air Interface....................103 Electrostatic Discharge .................. 104 Mechanics, Mounting and Packaging ..............105 Mechanical Dimensions of EGS5 ..............105 Mounting EGS5 onto the Application Platform..........107 6.2.1 SMT PCB Assembly ................. 107 6.2.1.1 Land Pattern and Stencil ........... 107 6.2.1.2...
  • Page 6 Signal States ....................34 Table 9: Temperature dependent behavior..............39 Table 10: Specifications of battery packs suitable for use with EGS5 ......44 Table 11: AT commands available in Charge-only mode ..........46 Table 12: Comparison Charge-only and Charge mode ..........47 Table 13: State transitions of EGS5 (except SLEEP mode) ..........
  • Page 7 Figure 18: USB circuit ..................... 56 Figure 19: C interface connected to VCC of application ..........57 Figure 20: C interface connected to VEXT line of EGS5 ..........57 Figure 21: SPI interface....................58 Figure 22: Characteristics of SPI modes................. 59 Figure 23: Audio block diagram..................
  • Page 8  EGS5 Hardware Interface Description Figures Figure 49: Carrier tape ....................112 Figure 50: Reel direction ....................112 Figure 51: Barcode label on tape reel ................113 Figure 52: Moisture barrier bag (MBB) with imprint............114 Figure 53: Moisture Sensitivity Label ................115 Figure 54: Humidity Indicator Card - HIC ..............

  • Page 9: Document History

     EGS5 Hardware Interface Description 0 Document History Document History Preceding document: "EGS5 Hardware Interface Description" Version 02.003 New document: "EGS5 Hardware Interface Description" Version 02.004 Chapter What is new Updated DocID. Preceding document: "EGS5 Hardware Interface Description" Version 01.841 New document: "EGS5 Hardware Interface Description"...

  • Page 10: Introduction

    Introduction This document describes the hardware of the Cinterion EGS5 module that connects to the cel- lular device application and the air interface. It helps you quickly retrieve interface specifica- tions, electrical and mechanical details and information on the requirements to be considered for integrating further components.
  • Page 11 Digital-to-Analog Converter Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Cinterion GSM module) DCS 1800 Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box...
  • Page 12  EGS5 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description IMEI International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbps kbits per second Light Emitting Diode Land Grid Array Li-Ion / Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery...
  • Page 13  EGS5 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate SELV Safety Extra Low Voltage...

  • Page 14: Regulatory And Type Approval Information

    1.3.1 Directives and Standards EGS5 has been approved to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec- ifications provided in the "EGS5 Hardware Interface Description"...

  • Page 15: Table 4: Requirements Of Quality

     EGS5 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 3: Standards of European type approval ETSI EN 301 489-7 Candidate Harmonized European Standard (Telecommunications series) V1.3.1 Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec- tro Magnetic Compatibility (EMC) standard for radio equipment and ser- vices;...

  • Page 16: Table 6: Toxic Or Hazardous Substances Or Elements With Defined Concentration Limits

     EGS5 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 6: Toxic or hazardous substances or elements with defined concentration limits EGS5_HD_v02.004 Page 16 of 123 2012-02-09 Confidential / Released...

  • Page 17: Sar Requirements Specific To Portable Mobiles

    See also Section 8.2. 1.3.3 SELV Requirements The power supply connected to the EGS5 module shall be in compliance with the SELV re- quirements defined in EN 60950-1. See also Section 5.1 for further detail. EGS5_HD_v02.004...

  • Page 18: Safety Precautions

    The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EGS5. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.

  • Page 19: Product Concept

     EGS5 Hardware Interface Description 2 Product Concept Product Concept Key Features at a Glance Feature Implementation General Frequency bands Quad band: GSM 850/900/1800/1900MHz GSM class Small MS Output power (according Class 4 (+33dBm ±2dB) for EGSM850 to Release 99) Class 4 (+33dBm ±2dB) for EGSM900...
  • Page 20 Access by AT commands Remote SIM Access EGS5 supports Remote SIM Access. RSA enables EGS5 to use a remote SIM card via its serial interface and an external application, in addition to the SIM card locally attached to the dedicated lines of the application inter- face.
  • Page 21  EGS5 Hardware Interface Description 2.1 Key Features at a Glance Feature Implementation C bus for 7-bit addressing and transmission rates up to 400kbps. Pro- grammable with AT^SSPI command. Alternatively, all lines of the I²C interface are configurable as SPI.

  • Page 22: Egs5 System Overview

    Digital Analog Power GPIO Charge GPIO Audio Audio Supply (Modem) Pulse Counter UART Audio Codec Host Slave Slave Charging circuit Headphones or Headset Charger User Application Figure 1: EGS5 system overview EGS5_HD_v02.004 Page 22 of 123 2012-02-09 Confidential / Released...

  • Page 23: Circuit Concept

     EGS5 Hardware Interface Description 2.3 Circuit Concept Circuit Concept Figure 2 shows a block diagram of the EGS5 module and illustrates the major functional com- ponents: Baseband block: • Digital baseband processor with DSP • Analog processor with power supply unit (PSU) •...

  • Page 24: Application Interface

     EGS5 Hardware Interface Description 3 Application Interface Application Interface EGS5 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • Power supply - see Section 3.1...

  • Page 25: Operating Modes

     EGS5 Hardware Interface Description 3.1 Operating Modes Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Normal operation GSM / GPRS Various power save modes set with AT+CFUN command.

  • Page 26: Power Supply

    EGS5 needs to be connected to a power supply at the SMT application interface (3 lines each BATT+ and GND). The power supply of EGS5 has to be a single voltage source at BATT+. It must be able to pro- vide the peak current during the uplink transmission.

  • Page 27: Measuring The Supply Voltage Vbatt

    RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when EGS5 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.

  • Page 28: Power Up / Power Down Scenarios

    EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Power Up / Power Down Scenarios In general, be sure not to turn on EGS5 while it is beyond the safety limits of voltage and tem- perature stated in Chapter 5.

  • Page 29: Turn On Egs5 Using Ignition Line Igt

    Turn on EGS5 Using Ignition Line IGT When the EGS5 module is in Power-down mode or Charge-only mode, it can be started to Nor- mal mode or Airplane mode by driving the IGT (ignition) line to ground. This must be accom- plished with an open drain/collector driver to avoid current flowing into this line.

  • Page 30: Figure 5: Power-On With Operating Voltage At Batt+ Applied Before Activating Igt

     EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios For details on how to use EMERG_OFF to reset ap- plications or external devices see Section 3.3.1.6. Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT EGS5_HD_v02.004...

  • Page 31: Figure 6: Power-On With Igt Held Low Before Switching On Operating Voltage At Batt

     EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios For details on how to use EMERG_OFF to reset ap- plications or external devices see Section 3.3.1.6. Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+ EGS5_HD_v02.004...

  • Page 32: Configuring The Igt Line For Use As On/Off Switch

    Switch-on condition:If the EGS5 is off, the IGT line must be asserted for at least 400ms before being released. The module switches on after 400ms. Switch-off condition: If the EGS5 is on, the IGT line must be asserted for at least 1s before being released. The module switches off after the line is released. The switch-off routine is identical with the procedure initiated by AT^SMSO, i.e.

  • Page 33: Reset Egs5 Via At+Cfun Command

    5 seconds. Pulling the EMERG_OFF line causes the loss of all infor- mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if EGS5 does not respond, if reset or shutdown via AT command fails. The EMERG_ signal is available on the application interface.

  • Page 34: Signal States After Startup

     EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.2 Signal States after Startup Table 8 describes the various states each interface signal passes through after startup and dur- ing operation. As shown in Figure 5 Figure 6 signals are in an undefined state while the module is initial- izing.
  • Page 35  EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Table 8: Signal States Signal name Undefined Defined state Active state after configuration by AT state during after initialization command startup GPIO GPIO6 I, PU Tristate GPIO7 I, PU...

  • Page 36: Turn Off Egs5

    The best and safest approach to powering down EGS5 is to issue the AT^SMSO command. This procedure lets EGS5 log off from the network and allows the software to enter into a se- cure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode.

  • Page 37: Turn On/Off Egs5 Applications With Integrated Usb

    Turn on/off EGS5 Applications with Integrated USB In a Windows environment, the USB COM port emulation causes the USB port of EGS5 to ap- pear as a virtual COM port (VCOM port). The VCOM port emulation is only present when Win- dows can communicate with the module, and is lost when the module shuts down.

  • Page 38: Automatic Shutdown

    The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, EGS5 instantly displays an alert (if enabled).

  • Page 39: Deferred Shutdown At Extreme Temperature Conditions

     EGS5 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Table 9: Temperature dependent behavior Sending temperature alert (15s after EGS5 start-up, otherwise only if URC presentation enabled) ^SCTM_A: 1 Caution: Battery close to overtemperature limit. ^SCTM_B: 1 Caution: Board close to overtemperature limit, i.e., board is 5°C below overtem-...

  • Page 40: Undervoltage Shutdown

    Keep in mind that several EGS5 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of EGS5, even if the module is switched off. Es- pecially the power amplifier is very sensitive to high voltage and might even be destroyed.

  • Page 41: Automatic Gprs Multislot Class Change

    This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops by 5 degrees, EGS5 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, EGS5 will not switch back to the higher class.

  • Page 42: Charging Control

    Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the EGS5 module to correctly determine the end of charg- ing and terminate charging automatically when the battery is fully charged. If the <current> val- ue is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage.

  • Page 43: Egs5_Hd_V02.004

    Table 10. It is recommended that the battery pack you want to integrate into your EGS5 application is compliant with these specifications. This ensures re- liable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.

  • Page 44: Charger Requirements

     EGS5 Hardware Interface Description 3.5 Charging Control EGS5 Table 10: Specifications of battery packs suitable for use with Battery type Rechargeable Lithium Ion or Lithium Polymer battery Nominal voltage 3.6V / 3.7V Capacity > 500mAh 10k  ± 5% @ 25°C approx.

  • Page 45: Implemented Charging Technique

    Duration of charging: • EGS5 provides a software controlled timer set to 4 hours as a safety feature to prevent per- manent charging of defective batteries. The duration of software controlled charging depends on the battery capacity and the level of discharge. Normally, charging stops when the battery is fully charged or, at the latest, when the software timer expires after 4 hours.

  • Page 46: Operating Modes During Charging

    If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE line while EGS5 is in Power-down mode, EGS5 goes into Charge-only mode. While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism.

  • Page 47: Table 12: Comparison Charge-Only And Charge Mode

    Battery can be charged while GSM module Charge host application charging circuit and remains operational and registered to the mode module’s VCHARGE line while EGS5 is GSM network. • operating, e.g. in IDLE or TALK mode • In IDLE and TALK mode, the serial inter- •...

  • Page 48: Power Saving

    CLIC SLEEP mode is that the serial interface remains accessible and that, in intermittent wake- up periods, characters can be sent or received without terminating the selected mode. This al- lows the EGS5 to wake up for the duration of an event and, afterwards, to resume power sav- ing. Please refer to for a summary of all SLEEP modes and the different ways of waking up the module.

  • Page 49: Timing Of The Ctsx Signal In Cyclic Sleep Mode 7

     EGS5 Hardware Interface Description 3.6 Power Saving 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7 Figure 11 illustrates the CTSx signal timing in CYCLIC SLEEP mode 7 (CFUN=7). Figure 11: Timing of CTSx signal (if CFUN= 7) With regard to programming or using timeouts, the UART must take the varying CTS inactivity periods into account.

  • Page 50: Summary Of State Transitions (Except Sleep Mode)

     EGS5 Hardware Interface Description 3.7 Summary of State Transitions (Except SLEEP Mode) Summary of State Transitions (Except SLEEP Mode) The following table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes).

  • Page 51: Rtc Backup

    The internal Real Time Clock of EGS5 is supplied from a separate voltage regulator in the an- alog controller which is also active when EGS5 is in POWER DOWN status. An alarm function is provided that allows to wake up EGS5 to Airplane mode without logging on to the GSM net- work.

  • Page 52: Sim Interface

    To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test- ed to operate with EGS5 and is part of the Cinterion Wireless Modules reference equipment submitted for type approval. See Chapter 9 for Molex ordering numbers.

  • Page 53: Serial Interface Asc0

    The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or in- active state). For electrical characteristics please refer to Table EGS5 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 54: Table 15: Dce-Dte Wiring Of Asc0

     EGS5 Hardware Interface Description 3.10 Serial Interface ASC0 Table 15: DCE-DTE wiring of ASC0 V.24 circuit DCE Line function Signal direction Line function Signal direction TXD0 Input Output RXD0 Output Input RTS0 Input Output CTS0 Output Input 108/2 DTR0...

  • Page 55: Serial Interface Asc1

    0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table EGS5 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 56: Usb Interface

    The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s USB interface, but not to other EGS5 interfaces. This is because EGS5 is designed as a self- powered device compliant with the “Universal Serial Bus Specification Revision 2.0”...

  • Page 57: I 2 C Interface

    [1]. The I C interface can be powered from an external supply or via the VEXT line of EGS5. If con- nected to the VEXT line the I C interface will be properly shut down when the module enters the Power-down mode.

  • Page 58: Spi Interface

    SPIDI/SPIDO, the clock line SPICLK and the chip se- lect line SPICS. The EGS5 module acts as a single master device, e.g. the clock SPICLK is driven by module. Whenever the SPICS line is in a low state, the SPI bus is activated and data can be transferred from the module and vice versa.

  • Page 59: Figure 22: Characteristics Of Spi Modes

     EGS5 Hardware Interface Description 3.14 SPI Interface Figure 22: Characteristics of SPI modes EGS5_HD_v02.004 Page 59 of 123 2012-02-09 Confidential / Released...

  • Page 60: Audio Interfaces

    5 can be used for direct access to the speech coder without signal pre or post processing. When shipped from factory, all audio parameters of EGS5 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Cinterion Wireless Modules reference configuration.

  • Page 61: Speech Processing

    As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems. While EGS5 is in Power-down mode, the input voltage at any MIC line must not exceed ±0.3 V relative to AGND (see also Section 5.1).

  • Page 62: Single-Ended Microphone Input

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.1 Single-ended Microphone Input Figure 24 as well as Figure 55 show an example of how to integrate a single-ended microphone input. = typ. 2k = typ. 5k = typ. 470Ohm VMIC = typ.

  • Page 63: Differential Microphone Input

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.2 Differential Microphone Input Figure 25 shows a differential solution for connecting an electret microphone. = typ. 1 k = 470  VMIC = typ. 100 nF = typ. 22 µF = typ. 2.5 V = 1.0V …...

  • Page 64: Line Input Configuration With Opamp

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.2.3 Line Input Configuration with OpAmp Figure 26 shows an example of how to connect an opamp into the microphone circuit. = typ. 47 k = 470  VMIC = typ. 100 nF = typ.

  • Page 65: Loudspeaker Circuit

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.3 Loudspeaker Circuit The GSM module comprises two analog differential speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Inter- face EP2 can also be connected in single ended configuration.

  • Page 66: Digital Audio Interface (Dai)

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.4 Digital Audio Interface (DAI) The DAI can be used to connect audio devices capable of PCM (Pulse Code Modulation) or for type approval. The following chapters describe the PCM interface functionality.

  • Page 67: Master Mode

     EGS5 Hardware Interface Description 3.15 Audio Interfaces Table 18: Overview of DAI signal functions Signal name Function for PCM Interface Input/Output DAI0 TXDAI Master/Slave DAI1 RXDAI Master/Slave DAI2 FS (Frame sync) Master DAI3 BITCLK Master DAI4 FSIN Slave DAI5...

  • Page 68: Figure 29: Short Frame Pcm Timing

     EGS5 Hardware Interface Description 3.15 Audio Interfaces The timing of a PCM short frame is shown in Figure 29. The 16-bit TXDAI and RXDAI data is transferred simultaneously in both directions during the first 16 clock cycles after the frame sync pulse.

  • Page 69: Slave Mode

     EGS5 Hardware Interface Description 3.15 Audio Interfaces 3.15.4.2 Slave Mode In slave mode the PCM interface is controlled by an external bit clock and an external frame sync signal applied to the BCLKIN and FSIN lines and delivered either by the connected codec or another source.

  • Page 70: Figure 32: Slave Pcm Timing, Short Frame Selected

     EGS5 Hardware Interface Description 3.15 Audio Interfaces The following figures show the slave short and long frame timings. Because these are edge controlled, frame sync signals may deviate from the ideally form as shown with the dotted lines. Figure 32: Slave PCM Timing, Short Frame selected Figure 33: Slave PCM Timing, Long Frame selected EGS5_HD_v02.004...

  • Page 71: Analog-To-Digital Converter (Adc)

    3.16 Analog-to-Digital Converter (ADC) The ADC of the EGS5 consists of 2 independent, unbalanced, multiplexed analog inputs that can be used for measuring external DC voltages in the range of 0mV…+2400 mV. The ADC has a resolution of 12 bits.

  • Page 72: Gpio Interface

    3.17 GPIO Interface The EGS5 has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. The GIPO related AT commands are the following: AT^SPIO, AT^SCPIN, AT^SCPOL, AT^SC- PORT, AT^SDPORT, AT^SGIO, AT^SSIO.

  • Page 73: Control Signals

    Your platform design must be such that the incoming signal accommodates sufficient power supply to the EGS5 module if required. This can be achieved by lowering the current drawn from other components installed in your application.

  • Page 74: Using The Sync Line To Control A Status Led

    As an alternative to generating the synchronization signal, the SYNC line can be configured to drive a status LED that indicates different operating modes of the EGS5 module. To take ad- vantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application.

  • Page 75: Behavior Of The Ring0 Line (Asc0 Interface Only)

     EGS5 Hardware Interface Description 3.18 Control Signals 3.18.3 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface ASC0 (see also Section 3.10). The sig- nal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).

  • Page 76: Antenna Interface

    4 Antenna Interface Antenna Interface The antenna interface has an impedance of 50Ω. EGS5 is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi- ated power, modulation accuracy and harmonic suppression.

  • Page 77: Rf Line Routing Design

    (ARP) for the Cinterion Wireless Modules refer- ence equipment submitted to type approve EGS5. All RF data specified throughout this docu- ment is related to the ARP. Please contact Cinterion for details on how to connect such an optional antenna connector.
  • Page 78 These line parameters - 800µm width, 1.200µm distance to ground and 200µm distance to both sides - are used for the wiring outside the area populated by the EGS5 module, i.e., the trans- mission line to the antenna connector as shown in Figure Within the area populated by the EGS5 module, the RF line width shall be reduced to 700µm...

  • Page 79: Figure 41: Rf Line On Interface Board. All Dimensions Are Given In Mm

     EGS5 Hardware Interface Description 4.2 RF Line Routing Design Figure 41: RF line on interface board. All dimensions are given in mm EGS5_HD_v02.004 Page 79 of 123 2012-02-09 Confidential / Released...

  • Page 80: Electrical, Reliability And Radio Characteristics

    Stresses beyond any of these limits will cause permanent damage to EGS5. The power supply connected to the EGS5 module shall be compliant with the SELV require- ments defined in EN60950. Above all, the peak current of the power supply shall be limited ac-...

  • Page 81: Operating Temperatures

    +75 to °C Temperature values are based on a setup with EGS5 mounted onto an adapter without any heat genera- ting components and connected via flex cable to the Cinterion DSB75 Evaluation Kit. Restricted operation allows normal mode speech calls or data transmission for limited time until au- tomatic thermal shutdown takes effect.

  • Page 82: Storage Conditions

     EGS5 Hardware Interface Description 5.3 Storage Conditions Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.

  • Page 83: Reliability Characteristics

     EGS5 Hardware Interface Description 5.4 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 25: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz; acceleration: 5g DIN IEC 60068-2-6 Frequency range: 20-500Hz;...

  • Page 84: Pad Assignment And Signal Description

    EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Pad Assignment and Signal Description The SMT application interface on the EGS5 provides connecting pads to integrate the module into external applications. Figure 42 shows the connecting pads’ numbering plan, the following Table 26 lists the pads’...

  • Page 85: Table 26: Pad Assignments

     EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 26: Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name VDDLP BATTEMP VCHARGE VUSB_IN EMERG_OFF DAC_OUT CTS0 MICN2 CCRST DAI3 CCIO DAI4 CCVCC...

  • Page 86: Table 27: Signal Description

    5.5 Pad Assignment and Signal Description Please note that the reference voltages listed in Table 27 are the values measured directly on the EGS5 module. They do not apply to the accessories connected Table 27: Signal description Function Signal name Signal form and level...
  • Page 87  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment External VEXT Normal mode: VEXT may be used for applica- supply min = 2.75V tion circuits, for example to sup- voltage typ = 2.93V...
  • Page 88 4.616ms, with 180µs forward time. b) Driving a status LED to indi- cate different operating modes of EGS5. The LED must be installed in the host application. To select a) or b) use the AT^SSYNC command. If unused keep line open.
  • Page 89  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment ASC0 RXD0 max = 0.2V at I = 2mA Serial interface for AT com- Serial min = 2.55V at I = -0.5mA mands or data stream.
  • Page 90  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment 100k  CCIN  CCIN = Low, SIM card holder interface max = 0.6V at I = -25µA...
  • Page 91  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment SPIDI max = 0.2V at I = 2mA If the Serial Peripheral Interface Serial min = 2.55V at I = -0.5mA...
  • Page 92  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment General GPIO1 I/O V max = 0.2V at I = 2mA Recommendation: Connect Purpose min = 2.55V at I = -0.5mA...
  • Page 93  EGS5 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description Function Signal name Signal form and level Comment Analog VMIC min = 2.4V Microphone supply for cus- Audio typ = 2.5V tomer feeding circuits interface max = 2.6V...

  • Page 94: Power Supply Ratings

     EGS5 Hardware Interface Description 5.6 Power Supply Ratings Power Supply Ratings Table 28: Power supply ratings Parameter Description Conditions Unit BATT+ Supply voltage Directly measured at reference point TP BATT+ and TP GND, see Section 3.2.2. Voltage must stay within the min/max values, including voltage drop, ripple, spikes.

  • Page 95: Table 29: Current Consumption During Tx Burst For Gsm 850Mhz And Gsm 900Mhz

     EGS5 Hardware Interface Description 5.6 Power Supply Ratings Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx...

  • Page 96: Table 30: Current Consumption During Tx Burst For Gsm 1800Mhz And Gsm 1900Mhz

     EGS5 Hardware Interface Description 5.6 Power Supply Ratings Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz Mode GSM call GPRS GPRS Class10 GPRS Class 12 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx...

  • Page 97: Electrical Characteristics Of The Voiceband Part

     EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Electrical Characteristics of the Voiceband Part 5.7.1 Setting Audio Parameters by AT Commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters.

  • Page 98: Audio Programming Model

     EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters inBbcGain and inCalibrate can be set with AT^SNFI.

  • Page 99: Characteristics Of Audio Modes

     EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. All values are noted for default gains e.g. all parameters of AT^SNFI and AT^SNFO are left unchanged.

  • Page 100: Voiceband Receive Path

     EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 1kHz using audio mode 5. • EPP1 to EPN1 with default settings • EPP2 to EPN2 with AT^SAIC=2,2,2,0,0,0 at^snfi=1,32767 and at^snfo=0,4096,5792,8192,...
  • Page 101  EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Table 33: Voiceband receive path Parameter Unit Test condition / remark Frequency Response 0Hz - 100Hz 200Hz -1.1 300Hz - 3350Hz -0.2 3400Hz -0.7 4000Hz >4400Hz Full scale of EPP2/EPN2 is lower than full scale of EPP1/EPN1 but the default gain is the same.

  • Page 102: Voiceband Transmit Path

     EGS5 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.5 Voiceband Transmit Path Test conditions: • The values specified below were tested to 1kHz using audio mode 5. • MICP1 to MICN1 with default settings. • MICP2 to MICN2 with at^saic=2,2,2,0,0,0 at^snfi=1,32767 and at^snfo=0,4096,5792,8192,...

  • Page 103: Air Interface

    Test conditions: All measurements have been performed at T = 25×C, V = 4.0V. The ref- BATT+ nom erence points used on EGS5 are the BATT+ and GND contacts (test points are shown in Figure Table 35: Air interface Parameter...

  • Page 104: Electrostatic Discharge

    SIM interface: clamp diodes for protection against overvoltage. The remaining ports of EGS5 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the "Human Body Model"...

  • Page 105: Mechanics, Mounting And Packaging

    6 Mechanics, Mounting and Packaging Mechanics, Mounting and Packaging Mechanical Dimensions of EGS5 Figure 44 shows the top view of EGS5 and provides an overview of the board's mechanical dimensions. For further details see Figure Figure 44: EGS5– top view EGS5_HD_v02.004...

  • Page 106: Figure 45: Dimensions Of Egs5 (All Dimensions In Mm)

     EGS5 Hardware Interface Description 6.1 Mechanical Dimensions of EGS5 Figure 45: Dimensions of EGS5 (all dimensions in mm) EGS5_HD_v02.004 Page 106 of 123 2012-02-09 Confidential / Released...

  • Page 107: Mounting Egs5 Onto The Application Platform

    Taking the copper pad area as base, maximum possible overprinting is 85% of this area. How- ever, Cinterion tests have shown that for most pads an overprinting of 40% is well suited, i.e., 1.3mm x 1.3mm. An exception is the RF pad: Because of the smaller distance to the adjacent ground pads, there should be no overprinting to optimize RF performance.

  • Page 108: Board Level Characterization

     EGS5 Hardware Interface Description 6.2 Mounting EGS5 onto the Application Platform Figure 47: Recommended stencil design (bottom view) 6.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro- cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.

  • Page 109: Moisture Sensitivity Level

    Moisture Sensitivity Level EGS5 comprises components that are susceptible to damage induced by absorbed moisture. Cinterion’s EGS5 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan- dard for moisture sensitive surface mount devices and is classified as MSL 4.

  • Page 110: Maximum Temperature And Duration

    EGS5 is specified for one soldering cycle only. Once EGS5 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.

  • Page 111: Durability And Mechanical Handling

    6.2.4.1 Storage Life EGS5 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90%.

  • Page 112: Packaging

    49. The figure also shows the prop- er part orientation. The tape width is 56 mm and the EGS5 modules are placed on the tape with a 36-mm pitch. The reels are 330mm in diameter with 150mm hubs. Each reel contains 300 modules.

  • Page 113: Barcode Label

     EGS5 Hardware Interface Description 6.3 Packaging 6.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 51: Barcode label on tape reel EGS5_HD_v02.004 Page 113 of 123...

  • Page 114: Shipping Materials

    6.3 Packaging 6.3.2 Shipping Materials EGS5 is distributed in tape and reel carriers. The tape and reel carriers used to distribute EGS5 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card •...

  • Page 115: Figure 53: Moisture Sensitivity Label

     EGS5 Hardware Interface Description 6.3 Packaging Figure 53: Moisture Sensitivity Label EGS5_HD_v02.004 Page 115 of 123 2012-02-09 Confidential / Released...

  • Page 116: Transportation Box

     EGS5 Hardware Interface Description 6.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.

  • Page 117: Sample Application

    AT^SSPI command. The internal pull-up resistors (Rp) of the I2C interface can be connected to an external power supply or to the VEXT line of EGS5. The advantage of using VEXT is that when the module enters the Power-down mode, the I2CI interface is shut down as well.

  • Page 118: Figure 55: Egs5 Sample Application

     EGS5 Hardware Interface Description 7 Sample Application Sample Application up to 7.0V CRS04 charge BC847 EMERG_RST BC847 BATTEMP VSENSE VCC µC 100k PWR_IND ISENSE CHARGEGATE Digital Audio 2 x R SYNC Functions dependent on use of Java For debug and/or test purposes...

  • Page 119: Reference Approval

    EGS5 Hardware Interface Description 8 Reference Approval Reference Approval Reference Equipment for Type Approval The Cinterion Wireless Modules GmbH reference setup submitted to type approve EGS5 con- sists of the following components: • Cinterion Wireless Module EGS5 (mounted on adapter) •...

  • Page 120: Compliance With Fcc And Ic Rules And Regulations

    Manufacturers of mobile or fixed devices incorporating EGS5 modules are authorized to use the FCC Grants and Industry Canada Certificates of the EGS5 modules for their own final prod- ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat- ing "Contains FCC ID QIPEGS5", and accordingly “Contains IC 7830A-EGS5“.
  • Page 121  EGS5 Hardware Interface Description 8.2 Compliance with FCC and IC Rules and Regulations FCC RF Radiation Exposure Statement "This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunc- tion with any other antenna or transmitter."...

  • Page 122: Appendix

     EGS5 Hardware Interface Description 9 Appendix Appendix List of Parts and Accessories Table 38: List of parts and accessories Description Supplier Ordering information EGS5 Cinterion Standard module Cinterion Wireless Module IMEI: Ordering number: L30960-N1530-A200 Customer IMEI mode: Ordering number: L30960-N1535-A200...

  • Page 123: Table 39: Molex Sales Contacts (Subject To Change)

     EGS5 Hardware Interface Description 9.1 List of Parts and Accessories Table 39: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Otto-Hahn-Str. 1b Lisle, Illinois 60532 http://www.molex.com 69190 Walldorf U.S.A. Germany...

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