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Cinterion BGS3 Hardware Interface Description

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BGS3
Version:
01.000d
DocId:
BGS3_HD_v01.000d

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Summary of Contents for Cinterion BGS3

  • Page 1  BGS3 Version: 01.000d DocId: BGS3_HD_v01.000d...
  • Page 2 UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB- JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT.

  • Page 3: Table Of Contents

    Turn on BGS3 Using the VCHARGE Signal ....... 29 3.3.1.4 Reset BGS3 via AT+CFUN Command........ 30 3.3.1.5 Reset or Turn off BGS3 in Case of Emergency ....30 3.3.1.6 Using EMERG_OFF Signal to Reset Application(s) or External Device(s) ............... 30 3.3.2...
  • Page 4  BGS3 Hardware Interface Description Contents 3.5.6 Implemented Charging Technique............41 3.5.7 Operating Modes during Charging............42 Power Saving....................44 3.6.1 Network Dependency of SLEEP Modes ..........44 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7....... 45 3.6.3...
  • Page 5  BGS3 Hardware Interface Description Contents Mechanics, Mounting and Packaging ..............91 Mechanical Dimensions of BGS3 ..............91 Mounting BGS3 onto the Application Platform..........93 6.2.1 SMT PCB Assembly ................93 6.2.1.1 Land Pattern and Stencil ............. 93 6.2.1.2 Board Level Characterization..........94 6.2.2...
  • Page 6 Signal states....................31 Table 9: Temperature dependent behavior..............34 Table 10: Specifications of battery packs suited for use with BGS3 ......40 Table 11: AT commands available in Charge-only mode ..........42 Table 12: Comparison Charge-only and Charge mode ..........43 Table 13: State transitions of BGS3 (except SLEEP mode) ..........
  • Page 7 URC transmission ..................63 Figure 30: Antenna pads ....................64 Figure 31: 4 layer PCB stack for BGS3 interface board..........65 Figure 32: RF line on interface board. All dimensions are given in mm ......67 Figure 33: Numbering plan for connecting pads (bottom view)........72 Figure 34: Audio programming model ................

  • Page 8: Document History

     BGS3 Hardware Interface Description 0 Document History Document History Preceding document: "BGS3 Hardware Interface Description" Version 01.000c New document: "BGS3 Hardware Interface Description" Version 01.000d Chapter What is new 5.3, Renamed all IEC 68-* standards to IEC 60068-*. 6.3.1.1...
  • Page 9  BGS3 Hardware Interface Description 0 Document History New document: "BGS3 Hardware Interface Description" Version 00.051 Chapter What is new Initial document setup. BGS3_HD_v01.000d Page 9 of 109 2010-03-26 Confidential / Released...

  • Page 10: Introduction

    Introduction This document describes the hardware of the Cinterion BGS3 module that connects to the cel- lular device application and the air interface. It helps you quickly retrieve interface specifica- tions, electrical and mechanical details and information on the requirements to be considered for integrating further components.
  • Page 11 Digital-to-Analog Converter Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Cinterion GSM module) DCS 1800 Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box...
  • Page 12  BGS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description Light Emitting Diode Li-Ion / Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mbps Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE...
  • Page 13  BGS3 Hardware Interface Description 1.2 Terms and Abbreviations Abbreviation Description Surface Mount Device Short Message Service Surface Mount Technology SRAM Static Random Access Memory Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access Terminal Equipment, also referred to as DTE...

  • Page 14: Regulatory And Type Approval Information

    1.3.1 Directives and Standards BGS3 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec- ifications provided in the "BGS3 Hardware Interface Description".

  • Page 15: Table 4: Requirements Of Quality

     BGS3 Hardware Interface Description 1.3 Regulatory and Type Approval Information Table 3: Standards of European type approval ETSI EN 301 489-7 Candidate Harmonized European Standard (Telecommunications series) V1.3.1 Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec- tro Magnetic Compatibility (EMC) standard for radio equipment and ser- vices;...

  • Page 16: Sar Requirements Specific To Portable Mobiles

    Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable BGS3 based applications to be evalu- ated and approved for compliance with national and/or international regulations.

  • Page 17: Safety Precautions

    The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating BGS3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.

  • Page 18: Product Concept

     BGS3 Hardware Interface Description 2 Product Concept Product Concept Key Features at a Glance Feature Implementation General Frequency bands Quad band: GSM 850/900/1800/1900MHz GSM class Small MS Output power (according Class 4 (+33dBm ±2dB) for EGSM850 to Release 99) Class 4 (+33dBm ±2dB) for EGSM900...
  • Page 19 BGS3 Hardware Interface Description 2.1 Key Features at a Glance Feature Implementation Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Cinterion AT commands for RIL compatibility Microsoft compatibility RIL for Pocket PC and Smartphone SIM Application Toolkit SAT Release 99...

  • Page 20: Bgs3 System Overview

    Antenna Interface Module Application Interface ASC0 ASC1 Digital Analog Power Charge Audio Audio Supply (Modem) Audio UART Codec Charging circuit Headphones or Headset Charger User Application Figure 1: BGS3 system overview BGS3_HD_v01.000d Page 20 of 109 2010-03-26 Confidential / Released...

  • Page 21: Circuit Concept

     BGS3 Hardware Interface Description 2.3 Circuit Concept Circuit Concept Figure 2 shows a block diagram of the BGS3 module and illustrates the major functional com- ponents: Baseband block: • Digital baseband processor with DSP • Analog processor with power supply unit (PSU) •...

  • Page 22: Application Interface

     BGS3 Hardware Interface Description 3 Application Interface Application Interface BGS3 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: • Power supply - see Section 3.2...

  • Page 23: Operating Modes

     BGS3 Hardware Interface Description 3.1 Operating Modes Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 7: Overview of operating modes Normal operation GSM / GPRS SLEEP Various power save modes set with AT+CFUN command.

  • Page 24: Power Supply

    BGS3 needs to be connected to a power supply at the SMT application interface (3 lines each BATT+ and GND). The power supply of BGS3 has to be a single voltage source at BATT+. It must be able to pro- vide the peak current during the uplink transmission.

  • Page 25: Measuring The Supply Voltage Vbatt

    RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when BGS3 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.

  • Page 26: Power Up / Power Down Scenarios

    BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios Power Up / Power Down Scenarios In general, be sure not to turn on BGS3 while it is beyond the safety limits of voltage and tem- perature stated in Chapter 5.

  • Page 27: Figure 5: Powerup With Operating Voltage At Batt+ Applied Before Activating Igt

    AT\Q or AT^IFC (see for details). The default setting of BGS3 is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the “^SYSSTART”...

  • Page 28: Figure 6: Powerup With Igt Held Low Before Switching On Operating Voltage At Batt

     BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios For details on how to use EMERG_OFF to reset ap- plications or external devices see Section 3.3.1.6. Figure 6: Powerup with IGT held low before switching on operating voltage at BATT+ BGS3_HD_v01.000d...

  • Page 29: Configuring The Igt Line For Use As On/Off Switch

    Switch-on condition:If the BGS3 is off, the IGT line must be asserted for at least 400ms before being released. The module switches on after 400ms. Switch-off condition:If the BGS3 is on, the IGT line must be asserted for at least 1s before being released. The module switches off after the line is released. The switch-off routine is identical with the procedure initiated by AT^SMSO, i.e.

  • Page 30: Reset Bgs3 Via At+Cfun Command

    BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios During the Charge-only mode BGS3 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch from Charge-only mode to Normal mode the ignition line (IGT) must be pulled low for at least 2 seconds.

  • Page 31: Signal States After Startup

     BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.2 Signal States after Startup Table 8 describes the various states each interface signal passes through after startup and dur- ing operation. As shown in Figure 5 Figure 6 signals are in an undefined state while the module is initial- izing.

  • Page 32: Turn Off Bgs3

    The best and safest approach to powering down BGS3 is to issue the AT^SMSO command. This procedure lets BGS3 log off from the network and allows the software to enter into a se- cure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode.

  • Page 33: Automatic Shutdown

    BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios While BGS3 is in Power-down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital lines of the application interface, especially of the serial interfaces.

  • Page 34: Thermal Shutdown

    The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, BGS3 instantly displays an alert (if enabled).

  • Page 35: Deferred Shutdown At Extreme Temperature Conditions

     BGS3 Hardware Interface Description 3.3 Power Up / Power Down Scenarios 3.3.4.2 Deferred Shutdown at Extreme Temperature Conditions In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex- ceeded: • While an emergency call is in progress.

  • Page 36: Overvoltage Shutdown

    Keep in mind that several BGS3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of BGS3, even if the module is switched off. Es- pecially the power amplifier is very sensitive to high voltage and might even be destroyed.

  • Page 37: Automatic Gprs Multislot Class Change

    This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops by 5 degrees, BGS3 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, BGS3 will not switch back to the higher class.

  • Page 38: Charging Control

    Use the command AT^SBC, parameter <current>, to enter the current consumption of the host application. This information enables the BGS3 module to correctly determine the end of charg- ing and terminate charging automatically when the battery is fully charged. If the <current> val- ue is inaccurate and the application draws a current higher than the final charge current, either charging will not be terminated or the battery fails to reach its maximum voltage.

  • Page 39: Battery Pack Requirements

    Table 10. It is recommended that the battery pack you want to integrate into your BGS3 application is compliant with these specifications. This ensures re- liable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command. Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values.

  • Page 40: Batteries Tested For Use With Bgs3

    3.5.4 Batteries Tested for Use with BGS3 When you choose a battery for your BGS3 application you can take advantage of one of the following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all require- ments listed above. They have been thoroughly tested by Cinterion Wireless Modules and proved to be suited for BGS3.

  • Page 41: Charger Requirements

    Duration of charging: • BGS3 provides a software controlled timer set to 4 hours as a safety feature to prevent per- manent charging of defective batteries. The duration of software controlled charging depends on the battery capacity and the level of discharge. Normally, charging stops when the battery is fully charged or, at the latest, when the software timer expires after 4 hours.

  • Page 42: Operating Modes During Charging

    If the charger is connected to the charger input of the external charging circuit and the module’s VCHARGE line while BGS3 is in Power-down mode, BGS3 goes into Charge-only mode. While the charger remains connected it is not possible to switch the module off by using the AT^SMSO command or the automatic shutdown mechanism.

  • Page 43: Table 12: Comparison Charge-Only And Charge Mode

    Battery can be charged while GSM module Charge host application charging circuit and remains operational and registered to the mode module’s VCHARGE line while BGS3 is GSM network. • operating, e.g. in IDLE or TALK • In IDLE and TALK mode, the serial inter- mode faces are accessible.

  • Page 44: Power Saving

    CLIC SLEEP mode is that the serial interface remains accessible and that, in intermittent wake- up periods, characters can be sent or received without terminating the selected mode. This al- lows the BGS3 to wake up for the duration of an event and, afterwards, to resume power sav- ing. Please refer to for a summary of all SLEEP modes and the different ways of waking up the module.

  • Page 45: Timing Of The Ctsx Signal In Cyclic Sleep Mode 7

     BGS3 Hardware Interface Description 3.6 Power Saving 3.6.2 Timing of the CTSx Signal in CYCLIC SLEEP Mode 7 Figure 11 illustrates the CTSx signal timing in CYCLIC SLEEP mode 7 (CFUN=7). Figure 11: Timing of CTSx signal (if CFUN= 7) With regard to programming or using timeouts, the UART must take the varying CTS inactivity periods into account.

  • Page 46: Summary Of State Transitions (Except Sleep Mode)

     BGS3 Hardware Interface Description 3.7 Summary of State Transitions (Except SLEEP Mode) Summary of State Transitions (Except SLEEP Mode) The following table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes).

  • Page 47: Sim Interface

    To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test- ed to operate with BGS3 and is part of the Cinterion Wireless Modules reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers.

  • Page 48: Serial Interface Asc0

    The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or in- active state). For electrical characteristics please refer to Table BGS3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 49: Table 15: Dce-Dte Wiring Of Asc0

     BGS3 Hardware Interface Description 3.9 Serial Interface ASC0 Table 15: DCE-DTE wiring of ASC0 V.24 circuit DCE Line function Signal direction Line function Signal direction TXD0 Input Output RXD0 Output Input RTS0 Input Output CTS0 Output Input 108/2 DTR0...

  • Page 50: Serial Interface Asc1

    0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table BGS3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •...

  • Page 51: Audio Interfaces

    5 can be used for direct access to the speech coder without signal pre or post processing. When shipped from factory, all audio parameters of BGS3 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Cinterion Wireless Modules reference configuration.

  • Page 52: Speech Processing

    As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems. While BGS3 is in Power-down mode, the input voltage at any MIC line must not exceed ±0.3V relative to AGND (see also Section 5.1).

  • Page 53: Single-Ended Microphone Input

     BGS3 Hardware Interface Description 3.11 Audio Interfaces 3.11.2.1 Single-ended Microphone Input Figure 16 as well as Figure 46 show an example of how to integrate a single-ended microphone input. = typ. 2k = typ. 5k = typ. 470Ohm VMIC = typ.

  • Page 54: Differential Microphone Input

     BGS3 Hardware Interface Description 3.11 Audio Interfaces 3.11.2.2 Differential Microphone Input Figure 17 shows a differential solution for connecting an electret microphone. = typ. 1k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ. 2.5V Vbias = 1.0V … 1.6V, typ.

  • Page 55: Line Input Configuration With Opamp

     BGS3 Hardware Interface Description 3.11 Audio Interfaces 3.11.2.3 Line Input Configuration with OpAmp Figure 18 shows an example of how to connect an opamp into the microphone circuit. = typ. 47k = 470Ohm VMIC = typ. 100nF = typ. 22µF = typ.

  • Page 56: Loudspeaker Circuit

     BGS3 Hardware Interface Description 3.11 Audio Interfaces 3.11.3 Loudspeaker Circuit The GSM module comprises two analog differential speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Inter- face EP2 can also be connected in single ended configuration.

  • Page 57: Table 17: Configuration Combinations For The Pcm Interface

     BGS3 Hardware Interface Description 3.11 Audio Interfaces For the PCM interface configuration the parameters <clock>, <mode> and <framemode> of the AT^SAIC command are used. The following table lists possible combinations: Table 17: Configuration combinations for the PCM interface Configuration <clock>...

  • Page 58: Master Mode

     BGS3 Hardware Interface Description 3.11 Audio Interfaces 3.11.4.1 Master Mode To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK) which is synchronous to the GSM system clock. The frequency of the bit clock is 256kHz or 512kHz.

  • Page 59: Slave Mode

     BGS3 Hardware Interface Description 3.11 Audio Interfaces The timing of a PCM long frame is shown in Figure 22. The 16-bit TXDAI and RXDAI data is transferred simultaneously in both directions while the frame sync pulse FS is high. For this rea- son the duration of a frame sync pulse is 16 BITCLK periods, starting at the rising edge of BIT- CLK.

  • Page 60: Figure 23: Slave Pcm Interface Application

     BGS3 Hardware Interface Description 3.11 Audio Interfaces Figure 23: Slave PCM interface application The following figures show the slave short and long frame timings. Because these are edge controlled, frame sync signals may deviate from the ideally form as shown with the dotted lines.

  • Page 61: Control Signals

    Your platform design must be such that the incoming signal accommodates sufficient power supply to the BGS3 module if required. This can be achieved by lowering the current drawn from other components installed in your application.

  • Page 62: Using The Sync Line To Control A Status Led

    As an alternative to generating the synchronization signal, the SYNC line can be configured to drive a status LED that indicates different operating modes of the BGS3 module. To take ad- vantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application.

  • Page 63: Behavior Of The Ring0 Line (Asc0 Interface Only)

     BGS3 Hardware Interface Description 3.12 Control Signals 3.12.3 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface ASC0 (see also Section 3.9). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).

  • Page 64: Antenna Interface

    4 Antenna Interface Antenna Interface The RF interface has an impedance of 50Ω. BGS3 is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi- ated power, modulation accuracy and harmonic suppression.

  • Page 65: Rf Line Routing Design

    (U.FL-R-SMT) along with other necessary components. The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Cinterion Wireless Modules refer- ence equipment submitted to type approve BGS3. All RF data specified throughout this docu- ment is related to the ARP.
  • Page 66 These line parameters - 800µm width, 1.200µm distance to ground and 200µm distance to both sides - are used for the wiring outside the area populated by the BGS3 module, i.e., the trans- mission line to the antenna connector as shown in Figure Within the area populated by the EGS3 module, the RF line width shall be reduced to 700µm...

  • Page 67: Figure 32: Rf Line On Interface Board. All Dimensions Are Given In Mm

     BGS3 Hardware Interface Description 4.2 RF Line Routing Design Figure 32: RF line on interface board. All dimensions are given in mm BGS3_HD_v01.000d Page 67 of 109 2010-03-26 Confidential / Released...

  • Page 68: Electrical, Reliability And Radio Characteristics

    Absolute Maximum Ratings The absolute maximum ratings stated in Table 20 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to BGS3. Table 20: Absolute maximum ratings Parameter Unit Peak current of power supply Supply voltage BATT+ -0.3...

  • Page 69: Operating Temperatures

    +75 to +85 °C 1. Temperature values are based on a setup with BGS3 mounted onto an adapter without any heat gene- rating components and connected via flex cable to the Cinterion DSB75 Evaluation Kit. 2. Restricted operation allows normal mode speech calls or data transmission for limited time until auto- matic thermal shutdown takes effect.

  • Page 70: Storage Conditions

     BGS3 Hardware Interface Description 5.3 Storage Conditions Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum.

  • Page 71: Reliability Characteristics

     BGS3 Hardware Interface Description 5.4 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 25: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz; acceleration: 5g DIN IEC 60068-2-6 Frequency range: 20-500Hz;...

  • Page 72: Pad Assignment And Signal Description

    BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Pad Assignment and Signal Description The SMT application interface on the BGS3 provides connecting pads to integrate the module into external applications. Figure 33 shows the connecting pads’ numbering plan, the following Table 26 lists the pads’...

  • Page 73: Table 26: Pad Assignments

     BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 26: Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name Do not use BATTEMP VCHARGE Do not use EMERG_OFF Do not use CTS0...

  • Page 74: Table 27: Signal Description

    5.5 Pad Assignment and Signal Description Please note that the reference voltages listed in Table 27 are the values measured directly on the BGS3 module. They do not apply to the accessories connected. Table 27: Signal description Function Signal name Signal form and level...
  • Page 75  BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment External VEXT Normal mode: VEXT may be used for applica- supply min = 2.75V tion circuits.
  • Page 76 4.616ms, with 180µs forward time. ent during handover. b) Driving a status LED to indi- cate different operating modes of BGS3. The LED must be installed in the host application. To select a) or b) use the AT^SSYNC command. If unused keep line open.
  • Page 77  BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment ASC1 RXD1 max = 0.2V at I = 2mA 4-wire serial interface for AT Serial min = 2.55V at I = -0.5mA commands or data stream.
  • Page 78  BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment CCIN  100k CCIN = Low, SIM card holder interface max = 0.6V at I = -25µA...
  • Page 79  BGS3 Hardware Interface Description 5.5 Pad Assignment and Signal Description Table 27: Signal description (Continued) Function Signal name Signal form and level Comment Analog VMIC min = 2.4V Microphone supply for cus- Audio typ = 2.5V tomer feeding circuits interface max = 2.6V...

  • Page 80: Power Supply Ratings

     BGS3 Hardware Interface Description 5.6 Power Supply Ratings Power Supply Ratings Table 28: Power supply ratings Parameter Description Conditions Unit BATT+ Supply voltage Directly measured at reference point TP BATT+ and TP GND, see Section 3.2.2. Voltage must stay within the min/max values, including voltage drop, ripple, spikes.

  • Page 81: Table 29: Current Consumption During Tx Burst For Gsm 850Mhz And Gsm 900Mhz

     BGS3 Hardware Interface Description 5.6 Power Supply Ratings Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz Mode GSM call GPRS GPRS Class10 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx...

  • Page 82: Table 30: Current Consumption During Tx Burst For Gsm 1800Mhz And Gsm 1900Mhz

     BGS3 Hardware Interface Description 5.6 Power Supply Ratings Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz Mode GSM call GPRS GPRS Class10 Class 8 Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx RF power nominal 0.5W...

  • Page 83: Electrical Characteristics Of The Voiceband Part

     BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Electrical Characteristics of the Voiceband Part 5.7.1 Setting Audio Parameters by AT Commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters.

  • Page 84: Audio Programming Model

     BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters inBbcGain and inCalibrate can be set with AT^SNFI.

  • Page 85: Characteristics Of Audio Modes

     BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. All values are noted for default gains e.g. all parameters of AT^SNFI and AT^SNFO are left unchanged.

  • Page 86: Voiceband Receive Path

     BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 1kHz with default audio mode settings, unless otherwise stated. • Default audio mode settings are: mode=5 for EPP1 to EPN1 and mode=6 for EPP2 to EPN2, outBbcGain=1 (Mode 5) or outBbcGain=0 (Mode 6), OutCalibrate=16384 (vol- ume=4) or OutCalibrate=11585 (volume=3), sideTone=0.
  • Page 87  BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part Table 33: Voiceband receive path Parameter Unit Test condition / remark Frequency Response 0Hz - 100Hz 200Hz -1.1 300Hz - 3350Hz -0.2 3400Hz -0.7 4000Hz >4400Hz 1. That means the differential voltage at EPP1/EPN1 for a sine wave must not exceed 3.8 Vpp at 8 Ohm.

  • Page 88: Voiceband Transmit Path

     BGS3 Hardware Interface Description 5.7 Electrical Characteristics of the Voiceband Part 5.7.5 Voiceband Transmit Path Test conditions: • The values specified below were tested to 1kHz and default audio mode settings, unless otherwise stated. • Parameter setup: Audio mode=5 for MICP1 to MICN1 and 6 for MICP2 to MICN2, inBbc-...

  • Page 89: Air Interface

    Test conditions: All measurements have been performed at T = 25°C, V = 4.0V. The BATT+ nom reference points used on BGS3 are the BATT+ and GND contacts (test points are shown in Figure Table 35: Air interface Parameter Unit...

  • Page 90: Electrostatic Discharge

    SIM interface: clamp diodes for protection against overvoltage. The remaining ports of BGS3 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the "Human Body Model"...

  • Page 91: Mechanics, Mounting And Packaging

    6 Mechanics, Mounting and Packaging Mechanics, Mounting and Packaging Mechanical Dimensions of BGS3 Figure 35 shows the top view of BGS3 and provides an overview of the board's mechanical dimensions. For further details see Figure Figure 35: BGS3– top view BGS3_HD_v01.000d...

  • Page 92: Figure 36: Dimensions Of Bgs3 (All Dimensions In Mm)

     BGS3 Hardware Interface Description 6.1 Mechanical Dimensions of BGS3 Figure 36: Dimensions of BGS3 (all dimensions in mm) BGS3_HD_v01.000d Page 92 of 109 2010-03-26 Confidential / Released...

  • Page 93: Mounting Bgs3 Onto The Application Platform

    Taking the copper pad area as base, maximum possible overprinting is 85% of this area. How- ever, Cinterion tests have shown that for most pads an overprinting of 40% is well suited, i.e., 1.3mm x 1.3mm. An exception is the RF pad: Because of the smaller distance to the adjacent ground pads, there should be no overprinting to optimize RF performance.

  • Page 94: Board Level Characterization

     BGS3 Hardware Interface Description 6.2 Mounting BGS3 onto the Application Platform Figure 38: Recommended stencil design (bottom view) 6.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro- cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.

  • Page 95: Moisture Sensitivity Level

    Moisture Sensitivity Level BGS3 comprises components that are susceptible to damage induced by absorbed moisture. Cinterion’s BGS3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan- dard for moisture sensitive surface mount devices and is classified as MSL 4.

  • Page 96: Maximum Temperature And Duration

    BGS3 is specified for one soldering cycle only. Once BGS3 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.

  • Page 97: Durability And Mechanical Handling

    6.2.4.1 Storage Life BGS3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90%.

  • Page 98: Packaging

    40. The figure also shows the prop- er part orientation. The tape width is 56 mm and the BGS3 modules are placed on the tape with a 36-mm pitch. The reels are 330mm in diameter with 150mm hubs. Each reel contains 300 modules.

  • Page 99: Barcode Label

     BGS3 Hardware Interface Description 6.3 Packaging 6.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 42: Barcode label on tape reel BGS3_HD_v01.000d Page 99 of 109...

  • Page 100: Shipping Materials

    6.3 Packaging 6.3.2 Shipping Materials BGS3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute BGS3 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card •...

  • Page 101: Figure 44: Moisture Sensitivity Label

     BGS3 Hardware Interface Description 6.3 Packaging Figure 44: Moisture Sensitivity Label BGS3_HD_v01.000d Page 101 of 109 2010-03-26 Confidential / Released...

  • Page 102: Transportation Box

     BGS3 Hardware Interface Description 6.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.

  • Page 103: Sample Application

    7 Sample Application Sample Application Figure 46 shows a typical example of how to integrate a BGS3 module into the GSM part of a mobile application. Usage of the various host interfaces depends on the desired features of the application.

  • Page 104: Figure 46: Bgs3 Sample Application

     BGS3 Hardware Interface Description 7 Sample Application Sample Application CRS04 up to 7.0V charge BC847 R ** EMERG_OFF BATTEMP BC847 VSENSE ISENSE VCC µC CHARGEGATE 100k Digital Audio PWR_IND SYNC *) For debug and/or test purposes EPN1 CCIN EPP1...

  • Page 105: Reference Approval

     BGS3 Hardware Interface Description 8 Reference Approval Reference Approval Reference Equipment for Type Approval The Cinterion Wireless Modules reference setup submitted to type approve BGS3 consists of the following components: • Cinterion Wireless Module BGS3 (mounted on adapter) •...

  • Page 106: Compliance With Fcc And Ic Rules And Regulations

    Manufacturers of mobile or fixed devices incorporating BGS3 modules are authorized to use the FCC Grants and Industry Canada Certificates of the BGS3 modules for their own final prod- ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat- ing "Contains FCC ID QIPBGS3", and accordingly “Contains IC 7830A-BGS3“.
  • Page 107  BGS3 Hardware Interface Description 8.2 Compliance with FCC and IC Rules and Regulations FCC RF Radiation Exposure Statement "This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunc- tion with any other antenna or transmitter."...

  • Page 108: Appendix

     BGS3 Hardware Interface Description 9 Appendix Appendix List of Parts and Accessories Table 38: List of parts and accessories Description Supplier Ordering information BGS3 Cinterion Standard module (CWM IMEI) Cinterion ordering number: L30960-N1570-A100 Cinterion ordering number: L30960-N1570-A110 Cinterion ordering number: L30960-N1570-E100...

  • Page 109: Table 39: Molex Sales Contacts (Subject To Change)

     BGS3 Hardware Interface Description 9.1 List of Parts and Accessories Table 39: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Felix-Wankel-Str. 11 Lisle, Illinois 60532 http://www.molex.com 4078 Heilbronn-Biberach U.S.A. Germany...

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