Samsung Xpress M288 Series Service Manual page 3

Mono laser mfp
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2.2.5.1.
2.2.5.2.
2.2.5.3.
2.2.5.4.
2.2.5.5.
2.2.5.6.
2.2.5.7.
2.2.5.8.
2.2.5.9.
2.2.6.
Engine F/W Control Algorithm ...................................................................................... 2 − 36
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7.
Software Descriptions .................................................................................................. 2 − 38
2.2.7.1.
2.2.7.2.
2.2.7.3.
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
Precautions when replacing parts ................................................................................................ 3 − 1
3.1.1.
Precautions when assembling and disassembling ............................................................... 3 − 1
3.1.2.
Preautions when handling PBA ...................................................................................... 3 − 1
3.1.3.
Releasing Plastic Latches .............................................................................................. 3 − 2
3.2.
Screws used in the printer.......................................................................................................... 3 − 3
3.3.
Replacing the Main SVC parts ................................................................................................... 3 − 4
3.3.1.
Side Cover ................................................................................................................. 3 − 4
3.3.2.
Rear Cover................................................................................................................. 3 − 5
3.3.3.
Front Cover ................................................................................................................ 3 − 6
3.3.4.
Scan Unit................................................................................................................... 3 − 7
3.3.5.
OPE.......................................................................................................................... 3 − 8
3.3.6.
ADF ......................................................................................................................... 3 − 9
3.3.7.
ADF Roller ................................................................................................................ 3 − 9
3.3.8.
ADF Motor ................................................................................................................ 3 − 10
3.3.9.
Scan Motor ................................................................................................................ 3 − 11
3.3.10. CIS Unit .................................................................................................................... 3 − 12
3.3.11. Fax Board .................................................................................................................. 3 − 12
3.3.12. Middle Cover ............................................................................................................. 3 − 13
3.3.13. Main Board ................................................................................................................ 3 − 14
3.3.14. SMPS........................................................................................................................ 3 − 14
3.3.15. HVPS........................................................................................................................ 3 − 15
Copyright© 1995-2013 SAMSUNG. All rights reserved.
Main board .................................................................................................. 2 − 24
OPE board ................................................................................................... 2 − 26
Wireless LAN board ...................................................................................... 2 − 27
Joint PBA .................................................................................................... 2 − 27
SMPS Board ................................................................................................ 2 − 28
HVPS Board ................................................................................................ 2 − 30
Fax board .................................................................................................... 2 − 31
NFC Tag Sticker ........................................................................................... 2 − 32
Electrical Parts Location ................................................................................. 2 − 33
Feeding ....................................................................................................... 2 − 36
Transfer....................................................................................................... 2 − 36
Fusing......................................................................................................... 2 − 37
LSU............................................................................................................ 2 − 37
Software system overview .............................................................................. 2 − 38
Architecture ................................................................................................. 2 − 38
Data and Control Flow ................................................................................... 2 − 39
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