Packaging; Tape And Reel Packaging - Quectel BC65 Hardware Design

Table 26: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 ° C and 200 ° C)
Reflow Zone
Max slope
Reflow time (D: over 220 ° C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTES
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module's shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.

7.3. Packaging

The modules are stored in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.

7.3.1. Tape and Reel Packaging

The reel is 330 mm in diameter and each reel contains 250 modules.
BC65_Hardware_Design
NB-IoT Module Series
BC65 Hardware Design
Recommendation
1 to 3 ° C/s
70–120 s
2 to 3 ° C/s
45–70 s
238 ° C to 246 ° C
-1.5 to -3 ° C/s
1
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