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L2 Repair Document
Note:1. Kindly note to stick high temperature tape on PCBA in case of test point
conduct electrici
ty to LCD via Mid-frame.
2. packaging method please refer item "APPENDIX 1 Packaging Requirements".
9 Other component exchange
The other components exchange such as
1)
LCM
2)
Furnished Front Casing & TP
3)
Speakers
4)
Camera
5)
Other related mechanical components
Please follow the detail steps 5.3 (Disassembly and assembly process).
But need to be very careful to handle the components with related special tool or jig (especially replacing
new components)
It is better to handle it with plastic tools (plastic tweezers and wedge etc.).
Besides operator must wear anti-static gloves, fingertips or wear static loop during the whole process of
components exchange.
10 Function test
During the function test, the following items must be checked and validated.
1)
Cosmetic aspect of the handset,
2)
The Software Technical sticker state on the Board
3)
Switch on the handset
4)
Default welcome message
Open "Calculator" application, and input "0x0-0+=" to start the auto test
5)
Requirements
1.
Any L3 PCBA which has appearance like below cases is not acceptable.
Return of PCBA process
Rev.
1.0
ONETOUCH 8085+LKB001X/A
All rights reserved. Transfer, copy, use or communication of this file is prohibited without authorization.
TCL
APPENDIX 1 Packaging
Level 2 Repair Document
Communication Ltd.
Page
66/71
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