Hot Air Gun Temperature Requirements; Soldering Tip Temperature Requirements; Bottom Heat Requirements; Bga Equipment Reflow Profiles - Sony Ericsson W960 Working Instruction, Electrical

3 Hot air gun temperature requirements

The air temperature shall not exceed 360°C. The temperature shall be measured 5 mm from
the nozzle outlet.
If it's not possible to remove and/ or solder with 360°C a BGA Rework Station or another
repair process shall be considered to ensure high process control.
Too high temperature can cause damage and cracks due to thermal stress on sensitive
components, e.g. ceramic components like capacitors.

4 Soldering tip temperature requirements

The soldering tip temperature shall be minimum 310°C and maximum 360°C.
Too high temperature can cause damage and cracks due to thermal stress on sensitive
components, e.g. ceramic components like capacitors.

5 Bottom heat requirements

In the chapter 8 "Replacement of components" there are components which require to us a
bottom heater during repair to pre-heat the board and to level out the ∆T on the PBA. It will
also minimize thermal stress.
The temperature on the PBA surface shall not exceed 150°C to minimize inter-metallic
growth and thermal stress on PWB.

6 BGA equipment reflow profiles

6.1

General

BGA Rework Station shall be able to control time, airflow and temperature to achieve
controlled and stable reflow profile. It shall also have a temperature controlled bottom heater.
The profile shall be according to SEMC profiling specification below.
Profile parameters are illustrated in table 6.1.1.
Reflow profile in this document always refers to the reflow profile which is measured on the board/component
with thermocouples and do not refer to the BGA Rework Stations setting which can vary depending on the
machine type and individual machine. Verification of reflow profile shall be done on each set of equipment.
Reference profile is showed in table 6.2
6.2

Temperature Measurements

One thermocouple shall be located in the middle of the component (Thermocouple # 1). It
shall be drilled from bottom side and located at the ball. The hole shall be filled with glue. A
slot could also be milled in the PWB to locate the thermocouple under the component. See
picture 6.1.
The other thermocouple (Thermocouple # 2) should be attached in the center and on the top
of the component body; it shall be attached with thin heat resistant tape or a thin layer of glue.
Too thick layer of glue will isolate too much heat which could give uncertain measurements.
1206-4806 Rev1
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Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
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