Sony Ericsson W960 Working Instruction, Electrical page 7

It's also recommended to place thermocouples on adjacent components to make sure that they
are not over exposed to the heat.
* The higher temperature in case the board has extremely high ΔT.
290
250
200
150
100
50
0
1206-4806 Rev1
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Sony Ericsson Mobile Communications AB
Picture 6.1
Table 6.1.1
Ramp rate
Ramp rate cooling
Time above liquidus
Minimum temperature
Maximum component temperature
Time above 235°C
Recommended Total time
Table 6.2
40 80 120
# 2
# 1
< 3°C/sec
< 6°C/sec
40-70 sec
235°C
260 °C
10-40 sec
Approx. 3-5min
Reflow zone
160 200
Time [Seconds]
Working Instruction, Electrical
# 3 (Recommended)
260°C
245°C
235°C
240 280
150°C
125°C
7(35)