Sony Ericsson W960 Working Instruction, Electrical page 11

5.2 Soldering removal
The landing area has to be cleaned from old soldering and flux.
5.3 Inspection
Check under the microscope that are no damage happened to mask, pads or the
surrounding components. Go to next step.
5.4 Assembly and re soldering
Put the board in the stations fixture, chose the adequate nozzle and reflow profile.
Check the component revision and mounting direction. Add flux on the board and on the
CPU top pads.
Pick up the CPU and align it to the board and put it down.
Pick up the memory and align it to the CPU, and put the component on the top of the
other component.
Start the reflow profile.
5.5 Inspection after repair
After soldering check the board to be sure that no other components are damaged or
removed. Inspect component by X-ray and send the board to trouble shoot station for
test.
Each time PCB assemblies have been repaired it shall be marked with an indication on the
PCB .
1206-4806 Rev1
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Working Instruction, Electrical
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