Soldering Issues; Hot Air Gun Temperature Requirements; Soldering Tip Temperature Requirements; Bottom Heat Requirements - Sony Ericsson G900 Working Instructions

3 Soldering issues

3.1

Hot air gun temperature requirements

The air temperature must not exceed 360
The temperature shall be measured 5 mm from the nozzle outlet.
If it is not possible to remove and/or solder with 360
process must be considered to ensure high process control.
A temperature being too high can cause damage and cracks due to the thermal stress on sensitive
components, e.g. ceramic components like capacitors.
3.2

Soldering tip temperature requirements

The soldering tip temperature must be minimum 310
A temperature being too high can cause damage and cracks due to the thermal stress on sensitive
components, e.g. ceramic components like capacitors.
3.3

Bottom heat requirements

In certain cases some components may require a bottom heater during repair in order to pre-heat the
board and to level out the
This will also minimize the thermal stress.
The temperature on the PBA surface must not exceed 150
thermal stress on the PWB.
3.4

BGA rework specifications

For all components that require the use of a BGA Rework Station, follow the:
Technical Requirement, Generic document; Space ID: 1207-2949
and
Heat treatment document; Space ID: 1210-5414
1210-5423 Rev1
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Sony Ericsson Mobile Communications AB
o
C.
T on the PBA.
o
C, a BGA Rework Station or another repair
o
C and maximum 360
o
C to minimize inter-metallic growth and
Working Instruction, Electrical
o
C.
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