YDP-131/YDP-131C
13-4
Remove the rack R. (See procedure 8)
13-5
Remove the end block assembly R. (See procedure 9)
13-6
Remove the two (2) screws marked [30]. The SW
circuit board can then be removed. (Fig. 9)
<Top view>
[S10]
End block assembly L
(拍子木Ass'y L)
<Bottom view>
[S07]
[3B]
End Block Assembly L (拍子木 L Ass y)
●
[9B]
[9]: Bind Head Tapping Screw-B (Bタイト+BIND)
3.0X8 MFZN2W3 (WE774300)
Fig. 8 (図8)
10
[S06]
(GHL (GHS) 鍵盤Ass'y)
[S07]
[S03D]: Bind Head Tapping Screw-B (Bタイト+BIND) 3.0X8 MFZN2W3 (WE774300)
[S06]:
Bind Head Screw (小ネジ+BIND) 4.0X18 MFZN2W3 (WG259400)
[S07]:
Bind Head Tapping Screw-P (Pタイト+BIND) 4.0X22 MFZN2W3 (WF169200)
[S10]:
Bind Head Tapping Screw-B (Bタイト+BIND) 4.0X10 MFZN2W3 (WE974500)
[3B]:
Hexagonal Nut (ナット 特殊) M12X14X2 P=1.0 (WF559900)
[9B]
[9A]
PN
MV
13-4
ラック (R) を外します。 ( 8項参照)
13-5
拍子木 (R) Ass yを外します。 ( 9項参照)
13-6
[30]のネジ2本を外し、 SWシートを外します。 ( 図9)
Cable holder(束線固定金具Ass'y)
[S03D]
Keyboard assembly
[S07]
Fig. 7 (図7)
End Block Assembly R (拍子木 R Ass y)
●
[30]: Bind Head Tapping Screw-B (Bタイト+BIND)
3.0X8 MFZN2W3 (WE774300)
[S06]
End block assembly R
(拍子木Ass'y R)
[S07]
[30]
SW
Fig. 9 (図9)
[S06]