Thermal Restriction Matrix - Dell E665 Owner's Manual

Table 33. Particulate contamination specifications (continued)
Particulate contamination
Corrosive dust
Table 34. Gaseous contamination specifications
Gaseous contamination
Copper Coupon Corrosion rate
Silver Coupon Corrosion rate
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 35. Thermal restriction matrix for processor and fans
Configuration
Processor TDP
120 W
155 W
180 W
200 W
225 W
240 W
NOTE: For 10 x 2.5-inch drives (NVMe), maximum supported ambient temperature is 30°C.
Table 36. Label reference
Label
STD
Processor cTDP Max
150 W
180 W
200 W
200 W
240 W
240 W
Specifications
NOTE: This condition applies to data center and non-data
center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Specifications
<300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
<200 Å/month as defined by ANSI/ISA71.04-2013
8 x 2.5-inch
STD fan
STD heat sink
STD fan
STD heat sink
STD fan
HPR heat sink
STD fan
HPR heat sink
HPR fan
HPR heat sink
HPR fan
HPR heat sink
Description
Standard
10 x 2.5-inch drives
(NVMe)
HPR fan
STD heat sink
HPR fan
STD heat sink
HPR fan
HPR heat sink
HPR fan
HPR heat sink
HPR fan
HPR heat sink
HPR fan
HPR heat sink
Technical specifications 27