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FEBL22660GDRB-02
RB-S22660GD32
User's Manual
Issue Date: February 5, 2021

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Summary of Contents for Rohm LAPIS RB-S22660GD32

  • Page 1 FEBL22660GDRB-02 RB-S22660GD32 User's Manual Issue Date: February 5, 2021...
  • Page 2 US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.. 10) Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology's Products.
  • Page 3: Table Of Contents

    RB-S22660GD32 User’s Manual Table of Contents Overview ................................1 Operational notes ...............................1 Specification ...............................2 3.1. EROFF jumper pin .............................2 3.2. OE jumper pin ............................2 3.3. IOVDD jumper pin .............................2 3.4. OUT jumper pin ............................2 3.5. LOUT jack ..............................2 3.6. SP jack.................................3 3.7.
  • Page 4: Overview

    RB-S22660GD32 User’s Manual 1. Overview This instruction manual is for the RB-S22660GD32 which is reference board for the ML22660 (hereinafter referred to as "Speech Synthesis LSIs"). This board can be combined with Sound Device Control Board 3 (hereinafter referred to as "SDCB3") to do the following: Voice playback by ML22660.
  • Page 5: Specification

    RB-S22660GD32 User’s Manual 3. Specification 3.1. EROFF jumper pin EROFF jumper pin is jumper pin that switch the connection of EROFF pin of Speech Synthesis LSIs. EROFF Contents EROFF pin is connected to CN1,CN2. EROFF pin is connected to IOVDD. Set to NML when connecting to SDCB3 for use.
  • Page 6: Sp Jack

    RB-S22660GD32 User’s Manual 3.6. SP jack SP jack is a jack where the signal from SPP,SPM pins of Speech Synthesis LSIs is output. Set Mode of Play setting of SDCB Controller to Speaker AMP. (Refer to Speech LSI Utility User's Manual.) Connect a monaural speaker.
  • Page 7: Xt1 Land, J1 Land

    RB-S22660GD32 User’s Manual Change DVDD or GND to the desired I2C slave address. Figure 4 SAD2-0 lands 3.10. XT1 land, J1 land XT1 land is used to mount the Ceramic resonator. When using a ceramic resonator for the clock of Speech Synthesis LSIs, mount the components. When no component is mounted, Speech Synthesis LSIs operates with built-in RC oscillation.
  • Page 8: Cn2 Connector

    RB-S22660GD32 User’s Manual 3.12. CN2 connector CN2 connector is used to connect to the pins of Speech Synthesis LSIs. SDCB3 Single unit Single unit Pin No Pin No Pin Name connection serial flash memory interface: serial flash memory interface: Enable Disable DVDD DVDD...
  • Page 9: Appendix

    RB-S22660GD32 User’s Manual 4. Appendix 4.1. PCB layout Figure 8 shows the RB-S22660GD32 PCB layout. Do not connect any components to the CN2 while the RB-S22660GD32 and SDCB3 are connected. Do not connect any component part to CN1。 Figure 8 PCB layout FEBL22660GDRB...
  • Page 10: Bom List, Schematic

    Hirose Electric Co., Ltd. 2-Conductor Miniature MARUSHIN ELECTRIC MFG. 8 MJ-354A0 JACK1,JACK2 Jack CO., LTD. 9 MCR03EZPJ203 Resistor 20kΩ ±5% Rohm Co., Ltd. 10 MCR03EZPJ103 Resistor 10kΩ ±5% Rohm Co., Ltd. 11 MCR03EZPJ104 R3,R4 Resistor 100kΩ ±5% Rohm Co., Ltd. 12 -...
  • Page 11 RB-S22660GD32 User’s Manual FEBL22660GDRB...
  • Page 12: Revision History

    RB-S22660GD32 User’s Manual 5. Revision History Page Document No. Issue Date Description Previous Edition Edition FEBL22660RGDB-01 March 9, – – First edition. 2020 FEBL22660GDRB-02 February 5 Notes Notes Change the description. 2021 Company name change. 2. Operational notes Added to connect a monaural speaker to the LOUT jack and SP jack.
  • Page 13 RB-S22660GD32 User’s Manual 4.1. PCB layout Changed chapter number. Changed Figure 8. 4.2. BOM list, Schematic Changed chapter number. Company name change. 4.2. BOM list, Schematic Changed chapter number. Company name change. FEBL22660GDRB...

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