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Item Description
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
(Philips#1) screw driver 2±0.5 (kgf/cm)
(Philips#2) screw driver 4±0.5 (kgf/cm)
(Philips#2) screw driver 5±0.5 (kgf/cm)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Refer to 2-3 to disassemble Panel & system.
2.
Refer to 4-5 to disassemble FAN & Heat sink.
3.
Refer to 6-7 to disassemble DIMM & SSD.
4.
Refer to 8 to disassemble power button board and Power button FFC.
5.
Refer to 9-10 to disassemble Webcam.
6.
Refer to 11 to disassemble Antenna and WIFI module.
7.
Refer to 12-13 to disassemble HDD.
8. Refer to 14-16 to disassemble ODD.
9. Refer to 17 to disassemble Speaker.
10. Refer to 18 to disassemble M/B.
11. Refer to 19-20 to disassemble Hinge & M/B shielding.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations)
1. Place system & Stand. (Stand is assembled by user, not in Factory)
EL-MF877-00
Template Revision C
Last revalidation date 04-01-2018
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPI instructions for this template are available at
EL-MF877-01
Quantity of
items
included in
product
Tool Size (if
applicable)
Page 2
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