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A
S
BOUT THE
YSTEM
Specifications
Table 1.1: System Specifications
S
PECIFICATIONS
Form factor
Chassis dimensions
(W x H x D)
Mainboard form factor
(Wx L), full-width
Processor
Chipset
Memory
Storage controller
Networking
2U rack mount
444mm x 87.5 mm x 866 mm
17.5" x 3.4" x 34.1"
400mm x 559.8mm / 15.75" x 22.04"
Processor type:
Intel® Xeon® Processor Scalable Family (codename Skylake-SP)
Max. TDP support:
205W*, optimized power delivery for 85W, VRD 13
*165W for GPU SKU
Number of processors: 4
Internal Interconnect: 10.4 GT/s
®
Intel
C621/C624/C628
Total slots: 48
Memory type: DDR4 2666 MT/s RDIMM
Memory size: 8GB, 16GB, 32 GB*
*More options refer to the CCL
Onboard (Intel® C621/C624/C628):
(8) SATA 6Gbps port with (1) x8 slimline connector
(6) sSATA 6Gbps port with (1) x4 slimline connector (reserved) and (2) M.2
2280/22110 connectors
Dedicated GbE management NIC port from PHY RTL8211 to BMC
Intel® C621 as 2x or 4xGbE integrated network solution with PHY (optional)
Intel® C624/C628 as 2x or 4x10GbE integrated network solution with PHY
(optional)
D
ESCRIPTION
S
F
YSTEM
EATURES
1-2
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