How To Disassemble Heat Sink For Bka Board - Sony A1E Series Service Manual

APPENDIX-7

How to disassemble HEAT SINK for BKA board

HEAT, SINK (BKA)
XBR-55/65/77A1E
HOLDER, HS WS (MUF)
4-548-743-01
HOLDER, (HS MUF)
4-549-188-01
SHEET, NOISE REDUCTION
4-691-273-01
1.5±1.5
1.5±1.5
If you need to disassemble HEAT SINK from service board for repair,
Please cut HOLDER,HS WS(MUF) with tool (nippers) from B side of board.
However, please do it carefully because some damage may be given
to the neighborhood parts or the board itself.
※Do not reuse HOLDER,HS WS(MUF). Should be replaced to new parts.
Please unhook HOLDER,(HS MUF).
NOTE:
Potting operation is necessary when you re-assemble HEAT SINK.
Please refer SBR "New Potting TIM Operation for board repair" for details.
Set "HEAT SINK (BKA)" to BKA board after potting operation.
Please use HOLDER (HS MUF) as guide while setting.
Install "HEAT SINK (BKA)" to BKA board by below sequence.
Setting
Nipper
Cut HOLDER,HS WS(MUF)
Push
Unhook HOLDER,(HS MUF)
Potting
<1>
Install
<2>
Install
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