Soldering Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E01С-ML01D User Manual

Chengdu Ebyte Electronic Technology Co., Ltd

7.Soldering guidance

7.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

7.2 Reflow soldering curve

Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Average ramp-down rate
Time to peak temperature for
25℃
E01C-ML01D User Manual
Sn-Pb
Pb-Free Assembly
Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec 60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec 30-90 sec
220-235℃ 230-250℃
6℃/second max 6℃/second max
6 minutes max 8 minutes max
150℃
200℃
217℃
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