Chengdu Ebyte Electronic Technology Co., Ltd
1.Overview............................................................................................................................................................2
1.1 Brief introduction....................................................................................................................................2
1.2 Features................................................................................................................................................... 2
1.3 Application..............................................................................................................................................2
2. Specification and parameter..............................................................................................................................3
2.1 Limit parameter.......................................................................................................................................3
2.2 Operating parameter................................................................................................................................3
3. Size and pin definition...................................................................................................................................... 4
4.Basic operation...................................................................................................................................................5
4.1
Hardware design................................................................................................................................ 5
4.2
Software editing.................................................................................................................................5
5 Circuit diagram...................................................................................................................................................6
6. FAQ.................................................................................................................................................................. 6
6.2 Module is easy to damage.......................................................................................................................6
7.Soldering guidance.............................................................................................................................................7
7.2 Reflow soldering curve........................................................................................................................... 7
8 Packing method for bulk order.......................................................................................................................... 8
Revision history.................................................................................................................................................... 8
About us................................................................................................................................................................ 8
CONTENTS
E01C-ML01D User Manual
1