Table Of Contents - Ebyte E01С-ML01D User Manual

Si24rl 2.4ghz spi dip wireless module
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Chengdu Ebyte Electronic Technology Co., Ltd
1.Overview............................................................................................................................................................2
1.1 Brief introduction....................................................................................................................................2
1.2 Features................................................................................................................................................... 2
1.3 Application..............................................................................................................................................2
2. Specification and parameter..............................................................................................................................3
2.1 Limit parameter.......................................................................................................................................3
2.2 Operating parameter................................................................................................................................3
3. Size and pin definition...................................................................................................................................... 4
4.Basic operation...................................................................................................................................................5
4.1
Hardware design................................................................................................................................ 5
4.2
Software editing.................................................................................................................................5
5 Circuit diagram...................................................................................................................................................6
6. FAQ.................................................................................................................................................................. 6
6.1 Communication range is too short.......................................................................................................... 6
6.2 Module is easy to damage.......................................................................................................................6
6.3 BER(Bit Error Rate) is high...................................................................................................................6
7.Soldering guidance.............................................................................................................................................7
7.1 Reflow soldering temperature.................................................................................................................7
7.2 Reflow soldering curve........................................................................................................................... 7
8 Packing method for bulk order.......................................................................................................................... 8
Revision history.................................................................................................................................................... 8
About us................................................................................................................................................................ 8
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E01C-ML01D User Manual
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