Ber(Bit Error Rate) Is High; Chapter7. Soldering Guidance; Reflow Soldering Temperature - Ebyte E01C-ML01SP2 User Manual

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6.3 BER(Bit Error Rate) is high

There is co-frequency signal interference nearby, stay away from the interference source or modify the frequency

and channel to avoid interference;
The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line

should not be too long;
Unsatisfactory power supply may also cause garbled codes. Ensure the reliability of the power supply;

Poor or too long extension cords and feeders will also cause high bit error rates.


Chapter7. Soldering guidance

7.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid
phase line
Peak temp.
Average ramp-down
rate
Time to peak
temperature for 25℃
E01C-ML01SP2 User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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