High-Density Configuration - ADC 75 Ohm Interconnect Specification Sheet

Digital Monitor Module System
75 Ohm Interconnect

High-Density Configuration

Features:
• Improved circuit density by 20%; 352 circuits in
fully loaded bay
• Cable bars reduce cable congestion and simplify
maintenance
• Circuit designation label door ensures proper
cable routing and identification
• Bay equipped with four vertical cabling channels,
cable troughs, and equipment cable tie-down
bars for high density cable management
• Zone 4 earthquake-rated equal-flange rack with
EIA mounting spacing
O r d e r i n g I n f o r m a t i o n
Description
Unloaded Pair of Dual Chassis
accomodates up to 16 modules in two, eight-position chassis
600 mm Dual Skeleton Bay
accomodates up to 11 dual chassis
IBC-D3001
Front View
w w w . a d c . c o m
IBC-D3001
Side View
• + 1 - 9 5 2 - 9 3 8 - 8 0 8 0
D3C-0016HD
Front View
Dimensions (HxWxD)
88 x 236 x 165 mm
(3.5" x 9.3" x 6.5")
2200 x 600 x 250 mm
(86.7" x 23.6" x 23.6")
• 1 - 8 0 0 - 3 6 6 - 3 8 9 1
Ordering Number
D3C-0016HD
IBC-D3C001
6