Baking - SimCom SIM7000 Hardware Design

6.5

Baking

In order to get better yield, the module need to bake before SMT.
If the packaging is in perfect condition, the module which date of production is within six

months has no use for baking. If the date of production is more than six months, the module must
be baking.
If the packaging had been opened or damaged, the module must be baking.

Table 37: Baking conditions
conditions
Baking temperature
Baking time
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
parameters
120℃
8 hours