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6.3
Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 34: The ramp-soak-spike reflow profile of SIM7000
Note: For more details about secondary SMT, please refer to the document [19].
2018-1-31
SIM7000 _Hardware Design _V1.04
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