Lattice iCEblink40-HX1K Quick Start

Evaluation kit

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This document provides a brief introduction and instructions to install and run the
iCEblink
40-HX1K Evaluation Kit on Windows 7/Vista/XP. Please refer to the complete
documentation at www.latticesemi.com/iceblink40-hx1k.

Check Kit Contents

The iCEblink40-HX1K Evaluation Kit includes the following items:
• iCEblink40-HX1K Evaluation Board preloaded with capacitive-sense touch-button
demonstration design and USB virtual I/O demonstration
• USB cable
• QuickSTART Guide
Detailed information is provided in the iCEblink40-HX1K Evaluation Kit User's Guide at
www.latticesemi.com/iceblink40-hx1k.
USB Programming,
Debug and Power
Note: Static electricity can shorten the lifespan of electronic components. Please handle
the kit components appropriately.

Download and Install iCEcube2 Development Software

Download and install the iCEcube2
Board and the hardware drivers for Windows at www.latticesemi.com/iCEcube2.
Low Power iCE40
68 User I/O Pins
FPGA
design software for the iCEblink40 Evaluation
iCEblink40-HX1K
Evaluation Kit
(3.3V)
Capacitive Touch
Buttons
User LEDs

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Summary of Contents for Lattice iCEblink40-HX1K

  • Page 1 • iCEblink40-HX1K Evaluation Board preloaded with capacitive-sense touch-button demonstration design and USB virtual I/O demonstration • USB cable • QuickSTART Guide Detailed information is provided in the iCEblink40-HX1K Evaluation Kit User’s Guide at www.latticesemi.com/iceblink40-hx1k. USB Programming, Low Power iCE40 68 User I/O Pins ™...
  • Page 2 Connect the iCEblink40-HX1K board to your PC using the USB cable provided. a. Connect the USB cable provided to a USB port on your PC and to the board’s USB interface socket on the top-left corner of the board.
  • Page 3: Technical Support

    Copyright © 2012 Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., Lattice (design), iCE40, iCEblink and iCEcube2 are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

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