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Chengdu Ebyte Electronic Technology Co., Ltd
7、Production Guidance
7.1 Reflow Soldering Curve
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
7.2 Reflow Soldering Curve
hengdu Ebyte Electronic Technology Co., Ltd
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Profile Feature
Solder Paste
Peak temperature（Tp）
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E104-BT10 User Manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8
minutes max
7-28
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