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including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Disassembly Tool (Better)
Bolt screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Take out the monitor and external cable from carton, then put them onto the desk horizontally, separate stand from
monitor as picture.
2. Remove the bucket screws
3.
Use disassemble tool to separate back cover from monitor (started from the disassembiing hole as the first picture).
4.
Taking off the LVDS cable and Lightbar cable firstly,then separate USB cover and chassis , (use screwdiver to
disassemble screws as picture).
5.
Taking off PI mylar,disassemble power board and IF board screws ,as the VGA bolt screws.
6.
Separatingchassis assy all parts as picture.
7.
SeparatingMid frame and panel , Use screwdriver to remove nine screwszel.
8.
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
0
0
0
Tool Size (if
applicable)
Ph2/Ph0
Page 2
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