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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Cross Screw driver
Disassembly Tool / Slotted Screwdriver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Take out the monitor and external cable from carton then put them onto the desk, separate stand from monitor as
picture.
2.
Use hand and a tool to separate back cover assy from monitor as below picture，but pay attention to avoid the LVDS
cable and Lightbar cable.
3.
Use hand take out the cable management and unlock the screw Fixed base and arm then separated the base as
follow picture.
4.
Unlock 4 screws and pull out the Audio board and Keypad cable then separated the chassis assy form the back cover
assy
5.
Unlock 2 screws fixed Keypad and Bucket then the keypad is separated
6.
Pull out all cables except the LVDS and unlock 4 screws fixed Main board and chassis then separate the Mainboard.
7.
Unlock 4 screws fixed the hinge and chassis ,take out the small mylar then separate the hinge
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
N/A
Take out
the
monitor
and
external
cable from
carton
then put
them onto
the desk,
separate
stand from
monitor as
picture.
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
Ph2/Ph0
Page 2
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