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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Micro shear
Screw driver
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove access panel. (see Figure 1-2)
2.
Remove front bezel. (see Figure 3)
3.
Disconnect cooler cable then remove the cooler from board. (see Figure4-5)
4.
Remove the HDD (see Figure 6-8)
5.
Remove the Slim ODD (see Figure 9-10)
6.
Unplug all cable conn. from PCA. (see Figure 11)
7.
Remove the PCA(see Figure 12-13)
8.
Remove the DIMM. (see Figure 14)
9. Remove the CPU. (see Figure 15-16)
10. Remove the Battery. (see Figure 17)
11. Remove the FIO module from chassis. (see Figure 18-19)
12. Remove the SD card reader from chassis. (see Figure 20-21)
13. Remove the speaker from chassis. (see Figure 22-23)
14. Remove Sys fan from chassis. (see Figure 24-25)
15. Remove the PSU from chassis. (see Figure 26-27)
16. Remove the PSU chassis and remove the PSU board. (see Figure 28-38)
17. Remove the Electrolytic Capacitors from PSU board. (see Figure 39-40)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
T-15
YN-3
PH2
Page 2
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