Basic Operation; Hardware Design - Ebyte E18-MS1PA1-IPX User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
About the difference between OAD and OTA in TI protocol stack?
OAD is short for Over the Air Download, OTA is short for Over the Air. The functions of these two are the same,
they can be called the software upgrade on air. In the earlier ZigBee protocol standard, there was no standard for node
software upgrading on air, but many customers have such requirements, thus TI developed their own protocol stack for
software upgrading on air, and named it as OAD. After that, ZigBee alliance noticed the more and more requirements for
upgrading on air, so they developed the upgrading on air standard and named it as OTA, this standard has taken the TI
OAD method as reference and has made some modification. The upgrading on air in TI's earlier protocol stack, it is called
OAD, and in the later stack, it is called OTA as following the ZigBee alliance stack.
Which protocol stack shall be selected for developing private application based on
ZigBee Mesh?
Many customers only need to apply the function of ZigBee Mesh network in their system or products, and do not need
to do according to the application layer as defined by the ZigBee, especially for some industrial applications, as for such
requirements, how to select proper TI protocol stack for developing products?
http://www.deyisupport.com/question_answer/wireless_connectivity/zigbee/f/104/t/132197.aspx

6 Basic operation

6.1 Hardware design

 It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
 Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse
connection may cause permanent damage to the module;
 Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;
 Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently；
 When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
 Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top
Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the
digital part of the module and routed in the Bottom Layer;
 Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
 It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
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E18-MS1PA1-IPX User Manual
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