Download  Print this page

HP ProDesk 600 G5 PCI MT Product End-of-life Disassembly Instructions

Hide thumbs

Advertisement

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 600 G5 PCI MT
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
250W EPA92 Acbel
Include the cartridges, print heads, tubes, vent
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
1
2
Page 1

Advertisement

Table of Contents

   Summary of Contents for HP ProDesk 600 G5 PCI MT

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Use 170II micro shear to cut two cable ties of PSU cables from chassis Use T-15 screwdriver to loose the screws of PSU Press PSU latch and remove it Cut the cable tie Remove screw for bottom Remove screw for top Remove cover Remove FG screw Disconnect fan connector and inlet connector.
  • Page 4 Figure 1 Pull the latch and remove access panel Figure 2 Pull the HDD latch from HDD cage Figure 3 Disconnect SATA/Power cables from the HDD Figure 4 Disconnect SATA/Power cables from slim ODD Figure 5 Remove main bezel from chassis Figure 6 Remove HDD cage from the chassis EL-MF877-00 Page 4...
  • Page 5 Figure 7 Press slim ODD latch Figure 8 Remove slim ODD from ODD cage Figure 9 Disconnect HDD SATA cable from the MB Figure 10 Disconnect HDD Power cable from the MB Figure 11 Disconnect P1 Power cable from the MB Figure 12 Disconnect P2 Power cable from the MB EL-MF877-00 Page 5...
  • Page 6 Figure 13 Disconnect speaker cable from the MB Figure 14 Disconnect CPU power cable from the MB Figure 15 Disconnect ODD power cable from the MB Figure 16 Disconnect ODD SATA cable from the MB Figure 17 Poke clip and remove SATA & power cables Figure 18 Disconnect heat sink cable from the MB EL-MF877-00 Page 6...
  • Page 7 Figure 19 Disconnect system fan cable from the MB Figure 20 Use T-15 screwdriver to loose the screws and remove heat sink Figure 21 Use PH1 screwdriver to loose the screws and Figure 22 Separate the fan from CPU heat sink remove the fan EL-MF877-00 Page 7...
  • Page 8 Figure 23 Disconnect memory from the MB Figure 24 Rotate the handle and open it up Figure 25 Remove CPU from MB Figure 26 Remove the battery from the MB Figure 27 Use T-15 to loose the screws of MB Figure 28 Remove MB from chassis EL-MF877-00 Page 8...
  • Page 9 Figure 29 Use PH1 screwdriver to loose screws of Figure 30 Use T-15 screwdriver to loose the screws of system fan and remove it speaker and remove it Figure 31 Use 170II micro shear to cut two cable ties of Figure 32 Use T-15 screwdriver to loose the screws of PSU cables from chassis EL-MF877-00...
  • Page 10 Figure 33 Press PSU latch and remove it Figure 34 Cut the cable tie Figure 35 Remove screw for bottom Figure 36 Remove screw for top Figure 37 Remove cover Figure 38 Remove FG screw EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 11 Figure 39 Disconnect fan connector and inlet connector. Figure 40 Remove PCB1 screw Figure 41 Remove AC inlet & Fan screw Figure 42 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it. EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at...

This manual is also suitable for:

Prodesk 600 g4 microtower businessProdesk 600 g4 pci microtower businessProdesk 600 g5 mtProdesk 680 g4 pci microtower business

Comments to this Manuals

Symbols: 0
Latest comments: