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HP EliteBook 840 G6 Product End-Of-Life Disassembly Instructions

HP EliteBook 840 G6 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP EliteBook 840 G6 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
EL-MF877-00
Template Revision C
Last revalidation date 04-01-2018
Notes
With a surface greater than 10 sq cm
M/B
All types including standard alkaline, coin or button style
batteries
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[X] screws
[X] snaps
[
[
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps (14" LED)
DC Cable for External Power Supply
Excluding B&S parts (EPS)
HPI instructions for this template are available at
HP's Sustainability
Contact.
] adhesive
] other. Explain
EL-MF877-01
Quantity of
items
included in
product
2
0
2 (Main
battery and
RTC battery)
0
1
0
0
0
1
0
0
Page 1

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Summary of Contents for HP EliteBook 840 G6

  • Page 1 Marketing Name / Model [List multiple models if applicable.] HP EliteBook 840 G6 Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances...
  • Page 3 MANUFACTURING PROCESS INSTRUCTIONS MECHANICAL ASSEMBLY MODEL : Computron Trypticon Crescent & Tenjin 拆机SOP Sub-assembly name: Crescent & Tenjin 拆机SOP Document No.: 陈博 Written by: Revision: 1.00 Date: 2019/3/4 Page: 1 of 29 A.Current station version list: Station Version Station Version Station Version Station Version Station VersionStation Version 1.00 1.00 1.00...
  • Page 4 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 1(1/1) 作 业 名 称 : Remove the self-contained screws 编辑日期:2019/4/3 Ver. : 1.00 步骤: 1. Remove the self-contained screws*8 ❖ Torque:2.0 ± 0.2 kgf.cm ❖ No stripped screws 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 5 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 2(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble BASE Ver. : 1.00 步骤: 1. Separate base with cable management rod 步骤: Inserted the cable bar into the gap between TOP and BASE intermediate area, and then slid cable bar to separate the TOP from the BASE.
  • Page 6 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 3(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble battery Ver. : 1.00 步骤: 1. Pull out the battery CNTR 2. Remove battery screw T8*5 ❖ Torque:2.0 ± 0.2 kgf.cm ❖...
  • Page 7 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 4(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble DDR Ver. : 1.00 步骤: 1. Disassemble DDR, Picture 1 2. Disassemble NFC FFC, NFC MODULE, NFC ANTENNA 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 8 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 5(1/1) 作 业 名 称 : 编辑日期:2019/4/3 DisassembleWWAN/WAN CABLE Ver. : 1.00 步骤: 1. Disassemble WWAN/WAN CABLE, remove from the hook in turn 2. Disassemble screws of WWAN/WLAN CARD/SSD, and take out WWAN、WLAN CARD、SSD.
  • Page 9 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 6(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Power FFC FAN/LVDS CABLE Ver. : 1.00 步骤: 1. Disassemble Power FFC/FAN cable, LVDS cable 注意事项︰如有异常,请立即通知领班或助理。 治具清单(治具规格) 数量 治具清单(治具规格) 数量...
  • Page 10 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 7(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Hinge screws Ver. : 1.00 步骤: 1. Disassemble Hinge screws M2.5*4.0 ❖ Torque:3.0 ± 0.2 kgf.cm ❖ No stripped screws 2.
  • Page 11 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 8(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble KB screws Ver. : 1.00 步骤: 1. Disassemble KB screws M2.0*3.0(6052B0302601)*2 ❖ Torque:1.5 ± 0.2 kgf.cm ❖ No stripped screws 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 12 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 9(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble KB Ver. : 1.00 步骤: 1. Use a thin round bar to push out KB from the gap between FAN and MB 2.
  • Page 13 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 10(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Remove the screws under the KB Ver. : 1.00 步骤: 1. Remove the screws under the KBM2.0*3.0(6052B0302601)*7 ❖ Torque:1.5 ± 0.2 kgf.cm ❖...
  • Page 14 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 11(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Remove the Thermal and Fan Screws Ver. : 1.00 步骤: 1. Remove the Thermal/FAN self-contained screws*7(picture 1) ❖ Torque:1.5 ± 0.2 kgf.cm ❖...
  • Page 15 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 12(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble USB Bracket/FFC CNTR Ver. : 1.00 步骤: 1. Remove the USB Bracket screw M2.0*3.0(6052B0302601)*2 ❖ Torque:1.5 ± 0.2 kgf.cm ❖...
  • Page 16 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 13(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble RJ45 screws Ver. : 1.00 步骤: 1. Disassemble RJ45 screws M2.0*4.0(6052B0101901)*6(picture 1) ❖ No stripped screws ❖ Torque:1.5 ± 0.2 kgf.cm 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 17 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 14(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble RJ45 screws Ver. : 1.00 步骤: 1.Take off I/O Frame(6051B1194301) 2. Disassemble Speaker CNTR 3. Use disassemble stick to remove RTC battery in the direction of below arrow 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 18 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 15(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Remove MB screws Ver. : 1.00 步骤: 1. Remove MB screws M2.0*3.0(6052B0302601)*5 ❖ Torque:1.5 ± 0.2 kgf.cm ❖ No stripped screws 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 19 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 16(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble SMC FFC/MB Ver. : 1.00 步骤: 1. Disassemble Smart Card FFC和USB FPC 2. Tilt the MB about 30 degrees and take it out of the TOP 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 20 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 17(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Finger Printer Ver. : 1.00 步骤: 1. Disassemble Finger Pinter M2.0*2.0(6052B0156301)* 1 ❖ Torque:1.5 ± 0.2 kgf.cm ❖ No stripped screws 2.
  • Page 21 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 18(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble the SMC screws Ver. : 1.00 步骤: 1. Disassemble the SMC screws M2.0*2.0(6052B0156201)*3 and remove the SMC/B from the TOP ❖...
  • Page 22 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 19(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble the Speaker screws Ver. : 1.00 步骤: 1. Disassemble pick button FPC CNTR 2. Disassemble thumb screws M2.0*2.0 (6052B0156301)*2 ❖...
  • Page 23 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 20(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble screws of Power/B,pick button Ver. : 1.00 步骤: 1. Disassemble pick button FPC CNTR 2. Disassemble Power/B screws M2.0*3.0(6052B0302601)*1 and take out Power/B 3.
  • Page 24 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 21(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Clickpad screws Ver. : 1.00 步骤: 1. Disassemble M2.0*2.0 screws(6052B0302601 )*4 and take out pick Button ❖ Torque:1.5 ± 0.2 kgf.cm ❖...
  • Page 25 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 22(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Hinge cap Ver. : 1.00 步骤: 1. Remove the Hinge cap from the A Cover 注意事项︰如有异常,请立即通知领班或助理。 治具清单(治具规格) 数量 治具清单(治具规格) 数量...
  • Page 26 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 23(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Bezel Ver. : 1.00 步骤: 1. Remove the bezel from the inside of A Cover 注意事项︰如有异常,请立即通知领班或助理。 治具清单(治具规格) 数量 治具清单(治具规格) 数量...
  • Page 27 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 24(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Panel screws Ver. : 1.00 步骤: 1. Disassemble Panel screws M2.0*2.0(6052B0156201)*4 ❖ Torque:2.0 ± 0.2 kgf.cm ❖ No stripped screws 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 28 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 25(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Panel CNTR Ver. : 1.00 步骤: 1. Disassemble Panel CNTR 2. Remove camera cable from cable hook of A cover 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 29 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 26(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble Camera Ver. : 1.00 步骤: 1. Disassemble camera cable 2. Disassemble camera, ALS/B, MIC/B from A cover 注意事项︰如有异常,请立即通知领班或助理。 治具清单(治具规格) 数量...
  • Page 30 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 27(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble ANTENNA Ver. : 1.00 步骤: 1. Disassemble WLAN ANTENNA from the A cover 2. Disassemble WWAN ANTENNA from the A cover 注意事项︰如有异常,请立即通知领班或助理。...
  • Page 31 作 业 指 导 书 Document No. : Crescent & Tenjin 拆机SOP 站 別: 28(1/1) 作 业 名 称 : 编辑日期:2019/4/3 Disassemble HINGE screws Ver. : 1.00 步骤: 1. Disassemble the left and right hinge screws M2.5*10 (6052A0028701)*6, and take off the Hinge ❖...