Huawei MU709s-2 Hardware Manual page 5

HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
3.12 Reserved Interface ....................................................................................................................... 42
3.13 NC Interface ................................................................................................................................. 43
4 RF Specifications ......................................................................................................................... 44
4.1 About This Chapter ......................................................................................................................... 44
4.2 Operating Frequencies ................................................................................................................... 44
4.3 Conducted RF Measurement ......................................................................................................... 45
4.3.1 Test Environment ................................................................................................................... 45
4.3.2 Test Standards ....................................................................................................................... 45
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 45
4.4.1 Conducted Receive Sensitivity .............................................................................................. 45
4.4.2 Conducted Transmit Power ................................................................................................... 46
4.5 Antenna Design Requirements ...................................................................................................... 46
4.5.1 Antenna Design Indicators..................................................................................................... 46
4.5.2 Interference ........................................................................................................................... 49
4.5.3 GSM/WCDMA Antenna Requirements .................................................................................. 49
5 Electrical and Reliability Features ........................................................................................... 50
5.1 About This Chapter ......................................................................................................................... 50
5.2 Absolute Ratings ............................................................................................................................ 50
5.3 Operating and Storage Temperatures ............................................................................................ 50
5.4 Power Supply Features .................................................................................................................. 51
5.4.1 Input Power Supply ............................................................................................................... 51
5.4.2 Power Consumption .............................................................................................................. 52
5.5 Reliability Features ......................................................................................................................... 55
5.6 EMC and ESD Features ................................................................................................................. 58
6 Mechanical Specifications ......................................................................................................... 60
6.1 About This Chapter ......................................................................................................................... 60
6.2 Storage Requirement ..................................................................................................................... 60
6.3 Moisture Sensitivity ........................................................................................................................ 60
6.4 Dimensions and Interfaces ............................................................................................................. 61
6.5 Packaging ....................................................................................................................................... 61
6.6 Label ............................................................................................................................................... 63
6.7 Customer PCB Design ................................................................................................................... 63
6.7.1 PCB Surface Finish ............................................................................................................... 63
6.7.2 PCB Pad Design .................................................................................................................... 63
6.7.3 Solder Mask ........................................................................................................................... 64
6.7.4 Requirements on PCB Layout ............................................................................................... 64
6.8 Assembly Processes ...................................................................................................................... 64
6.8.1 General Description of Assembly Processes ........................................................................ 64
6.8.2 Stencil Design ........................................................................................................................ 65
6.8.3 Reflow Profile ........................................................................................................................ 65
6.9 Specification of Rework .................................................................................................................. 66
Issue 03 (2014-09-18)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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