HUAWEI MU736 HSPA+ M.2 Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2013-03-08 Creation 2013-05-09 Updated Tunable Antenna Control 4.4.2 Updated Table 4-4 4.5.1 Updated Antenna Design Indicators 4.5.3 Updated GSM/WCDMA/GPS Antenna Requirements 5.5.2...
MU736 module 5.5.2 Updated Table 5-12 DC power consumption (GPS) Updated Table 5-13 Test conditions and results of the reliability of the MU736 module Updated Figure 6-1 Dimensions of MU736 Updated Figure 6-4 Packet system 2013-10-21 Updated Table 5-13 Test conditions and...
Introduction Introduction This document describes the hardware application interfaces and air interfaces that are provided when HUAWEI MU736 HSPA+ M.2 Module (hereinafter referred to the MU736 module) is used. M.2 is the new name for NGFF (Next Generation Form Factor).
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU736 module and provides: Function Overview Circuit Block Diagram 2.2 Function Overview Table 2-1 Features...
HSPA+: UL 5.76 Mbps/DL 21.6 Mbps Operating Windows 7/8/8.1, Android 4.0 or later, Chrome OS System When the MU736 module works at this temperature, NOT all its RF performances comply with the 3GPP TS 45.005 specifications. Huawei Proprietary and Confidential Issue 05 (2014-01-14)
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Overall Description 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU736 module. The application block diagram and major functional units of the MU736 module contain the following parts: ...
The MU736 module uses a 75-pin Gold Finger as its external interface. For details about the module and dimensions, see "6.2 Dimensions of MU736". Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the MU736 module.
Table 3-1 shows the definitions of pins on the 75-pin signal interface (67 for signals and 8 for notch) of the MU736 module. As the M.2 naming nomenclature, MU736 is Type 3042-S3-B (30 mm × 42 mm, Component Max Height on top is 1.5 mm and single-sided, Key ID is B.)
Table 3-1 Definitions of pins on the M.2 interface Pin Name DC Characteristics (V) Description Normal Min. Typ. Max. Connected to Ground internally. CONFIG_3 MU736 is configured as WWAN-SSIC 0. 3.3V Power supply 3.135 Ground Ground 3.3V Power supply 3.135 Ground Ground A single control to turn On/Off WWAN.
Reserved for Future Use, please keep it Reserved NC in host side. Not Connected internally. CONFIG_0 MU736 is configured as WWAN-SSIC 0. Reserved for Future Use, please keep it Reserved NC in host side. Open drain and a pull-up WWAN to wake up the host.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Pin Name DC Characteristics (V) Description Normal Min. Typ. Max. Not Connected Ground Ground I2C clock –0.3 I2C_SCL This function is under development. Not Connected I2C data –0.3 I2C_SDA This function is under development.
SIM_DET H: SIM is present. L: SIM is absent. –0.3 RESET# System reset, active low. Not Connected Connected to Ground internally. CONFIG_1 MU736 is configured as WWAN-SSIC 0. 3.3V Power supply 3.135 Ground Ground 3.3V Power supply 3.135 Ground Ground 3.3V...
When the MU736 module works normally, power is supplied through the 3.3V pins and the voltage ranges from 3.135 V to 4.4 V (typical value is 3.3 V). The MU736 provides 5 power pins, and 11 Ground pins. To ensure that the MU736 module works normally, all the pins must be connected.
3.3 V 3.135 V Time If customer wants to power cycle MU736, the 3.3V pin must stay below 1.8 V for more than 100 ms. The sequence is shown as in Figure 3-4 . Huawei Proprietary and Confidential Issue 05 (2014-01-14)
Output power supply interface is UIM_PWR. Through the UIM_PWR power supply interface, the MU736 module can supply 1.8 V or 2.85 V power to UIM card. The max current can reach 200 mA, so special attention on PCB design should be taken at the host side.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces BodySAR detection (BodySAR_N) pin UIM detection (SIM_DET) pin Table 3-3 lists the pins on the signal control interface. Table 3-3 Pins on the signal control interface...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.4.2 Power_On_Off Control Pin The MU736 module can be controlled to be powered on/off by the Power_On_Off pin. Table 3-4 Two states of Power_On_Off Item. Pin state Description High MU736 is powered on.
MU736 is powered directly to battery For use case MU736 is connected directly to battery, such as tablet platforms, Power_On_Off pin should be controlled by a GPIO from host to control MU736 power On/Off. It is critical to make sure the module is safely powered off when the Tablet SoC is shut off.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces The recommended connections are shown as in Figure 3-8 . Figure 3-8 Recommended connections of Power_On_Off pins (Control) MU736 HOST Power_On_Off GPIO Pin 6 Power on sequence Do not toggle RESET# pin during power on sequence. Pulling RESET# pin low will extend time for module startup.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-10 Recommended power off timing (connect to battery) 3.3V (Vbatt, always on) RESET# Logic low or high-impedance (preferred) Power_On_Off Logic low or high-impedance (preferred) Power off t1 ≥ 500 ms If there is limitation on the controlling GPIO to be programmable 500 ms, the hardware solution can be used, as shown in Figure 3-11 .
Description of the Application Interfaces 3.4.3 RESET# Pins The MU736 module can be reset through the RESET# pin asynchronous, active low. Whenever this pin is active, the module will immediately be placed in a Power On reset condition. Care should be taken for this pin unless there is a critical failure and all other methods of regaining control and/or communication with the WWAN sub-system have failed.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-13 Hardware circuit for RESET# (Option 2) GPIO1 MU736 HOST RESET# Pin 67 1MΩ NMOS 33 рF NMOS 0 Ω GPIO1 Option 3: Hardware circuit for RESET# In this case, the GPIO is not high-impedance when the host is powered off.
It will also disconnect the module from the network resulting in a call drop. 3.4.4 LED# Pin MU736 provides an open drain signal to indicate the RF status. Table 3-5 State of the LED# pin Operating Status...
(Modem) 10 kΩ Host BB Chip W_DISABLE# It is recommended not to add a diode on the W_DISABLE# pin outside the MU736 module. 3.4.6 GPS_DISABLE# Pin MU736 provides a hardware pin (GPS_DISABLE#) to enable/disable the GPS function. Table 3-7 Function of the GPS_DISABLE# pin...
10 kΩ Host BB Chip GPS_DISABLE# It is recommended not to add a diode on the GPS_DISABLE# pin outside the MU736 module. 3.4.7 Wake_On_WWAN# Pin MU736 provides an open drain output Wake_On_WWAN# pin to wake host. It is low active.
If BodySAR_N pin is used to monitor the proximity sensor output, there are some essential preconditions for this hardware solution. MU736 cannot provide any control signal for the proximity sensor. Any control or programming required by the proximity sensor should be handled by the host side.
BB Chip sensor BodySAR_N Host AP It is recommended not to add a diode on the BodySAR_N pin outside the MU736 module. 3.4.9 SIM_DET Pin MU736 supports USIM Hot Swap function. MU736 provides an input pin (SIM_DET) to detect whether the USIM card is present or not.
When SIM is inserted (hot), SIM_DET pin will change from Low to High; When SIM is removed (hot), SIM_DET pin will change from High to Low. MU736 will detect the rising or falling edge of SIM_DET to react the hot swap. Figure 3-22 The logic of SIM_DET WWAN Module 1.8V...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.5 USB Interface The MU736 is compliant with USB 2.0 high speed protocol. The USB input/output lines are following USB 2.0 specifications. Definition of the USB interface: Pin Name Description DC Characteristics (V) Min.
1.98/3.0 3.6.2 Circuit Recommended for the USIM Card Interface As the MU736 module is not equipped with an USIM socket, you need to place an USIM socket on the user interface board. Figure 3-25 shows the circuit of the USIM card interface.
SIM_DATA signal wires with ground. The Ground pin of the USIM socket and the Ground pin of the USIM card must be well connected to the power Ground pin supplying power to the MU736 module. A 100 nF capacitor (0402 package is recommended so that larger capacitance such as 1µF can be employed if necessary) and a 33 pF capacitor are placed...
–0.3 ANTCTL3 Tunable antenna control signal bit 3. It is a push-pull type GPIO. 3.8 Config Pins The module provides 4 config pins. MU736 is configured as WWAN-SSIC 0. Table 3-12 List of CONFIG pins Pin Name Description DC Characteristics(V) Min.
These 4 configurations are called Port Config0~3. In each Port Configuration each GPIO is defined as a specific functional pin. The GPIO pin assignment can see in Table 3-14 . MU736 supports Config0. But the audio function is not implemented in MU736.
The antenna interface must be used with coaxial cables with characteristic impedance of 50 Ω. The MU736 module supports the buckled RF connector antenna connection methods: buckled RF connector MM4829-2702RA4 by MURATA or other equivalent connectors Figure 3-27 shows the RF connector dimensions.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-28 Specifications of 0.81 mm coaxial cable mating with the RF connector Figure 3-29 shows the connection between the RF connector and the 0.81 mm cable. Figure 3-29 Connection between the RF connector and the 0.81 mm cable Figure 3-30 shows the specifications of 1.13 mm coaxial cable mating the...
The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP TS 51.010-1 and 3GPP TS 34.121-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.
According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-4 lists the required ranges of the conducted transmit power of MU736. The tested values listed in the Test Value column must range from the minimum power to the maximum power.
In addition, the transmission cable from the antenna port of MU736 to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss be as low as possible, for example, U.FL-LP-088...
Antenna direction The primary antenna must be placed as near as possible to the MU736 to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the MU736.
For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU736: Primary/Diversity/GPS/WIFI antenna: omnidirectional. In addition, the diversity antenna’s pattern should be complementary with the primary antenna’s pattern.
The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.
The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and total isotropic sensitivity (TIS) can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz.
EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the MU736 module. Using the MU736 module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the MU736 module...
: When the MU736 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. : When the MU736 module works at this temperature, NOT all its RF indexes comply with the 3GPP TS 45.005 specifications.
Low-level output 0.15 voltage 5.5 Power Supply Features 5.5.1 Input Power Supply Table 5-6 lists the requirements for input power of the MU736 module. Table 5-6 Requirements for input power for the MU736 module Parameter Min. Typ. Max. Ripple Unit 3.3 V...
Table 5-8 to Table 5-12 . The power consumption listed in this section is tested when the power supply of MU736 module is normal voltage (3.3 V), and all of test values are measured at room temperature. Table 5-8 Averaged power off DC power consumption of MU736...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Table 5-9 Averaged standby DC power consumption of MU736 (WCDMA/HSDPA/GSM) Description Bands Test Value (mA) Notes/Configuration Typical Sleep HSPA+/WCDMA UMTS bands Module is powered up. (sleep) DRX cycle=8 (2.56s) Module is registered on the network.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Description Band Test Value (mA) Notes/Configuration Typical 23.5 dBm Tx Power Band II 0 dBm Tx Power (PCS 1900) 10 dBm Tx Power 23.5 dBm Tx Power Band IV...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Table 5-11 Averaged DC power consumption of MU736 (GPRS/EDGE) Description Test Value (mA) Notes/Configuration Typical GPRS850 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down...
Test condition: For Max Tx power ,see 4.4.2 Conducted Transmit Power, they are listed in Table 4-4 ; for Max data throughput, see 2.2 Function Overview, they are listed in Table 2-1 Features. Table 5-12 Averaged GPS operation DC power consumption of MU736 Description Test Value (mA)
The Rx power of GPS is –130 dBm. 5.6 Reliability Features Table 5-13 lists the test conditions and results of the reliability of the MU736 module. Table 5-13 Test conditions and results of the reliability of the MU736 module Item...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Thermal shock Low temperature: JESD22- 3 pcs/group Visual inspection: –40º A106-B High temperature: Function test: ok 85º C RF specification: ok Temperature change interval: <...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Shock test Half-sine wave shock JESD-B1 3 pcs/group Visual inspection: 04-C Peak acceleration: 30 Grms Function test: ok Shock duration: 11 ms...
The following are the EMC design comments: Attention should be paid to static control in the manufacture, assembly, packaging, handling, and storage process to reduce electrostatic damage to HUAWEI module. RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustments on RF match circuit.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the following aspects of the MU736 module: Dimensions of MU736 Label Packing System 6.2 Dimensions of MU736 Figure 6-1 shows the dimensions of MU736 in details.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Installation Installation 7.1 About This Chapter This chapter describes the assembly of MU736, including: Connect MU736 to Board Antenna Plug 7.2 Connect MU736 to Board Figure 7-1 Install MU736 It refers to M.2 specification.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Installation 7.3 Antenna Plug Figure 7-2 Mating the plug Align the mating tool or the mating end of the tool over the plug end of the cable assembly. Firmly place the tool over the plug until it is secured in the tool.
This chapter gives a general description of certifications of MU736. 8.2 Certifications The certification of MU736 is testing now. Table 8-1 shows certifications the MU736 will be implemented. For more demands, please contact us for more details about this information.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 9.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 9.4 Traffic Security Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information 9.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 9.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.
Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 05 (2014-01-14)
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion Application Process China Compulsory Certification European Conformity Coding Scheme Circuit Switched Data Direct Current Direct Memory Access Development Kit...
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion HSDPA High-Speed Downlink Packet Access HSPA+ Enhanced High Speed Packet Access HSUPA High Speed Up-link Packet Access International Standards Organization Liquid Crystal Polyester Low-Dropout...