Huawei MU709s-2 Hardware Manual page 22
Hspa+ lga module
Hide thumbs
Also See for MU709s-2:
- Hardware manual (56 pages) ,
- Acceptance inspection manual (13 pages) ,
- Hardware migration manual (70 pages)
Table of Contents
Advertisement
HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
Pin
Pin
Pad
No.
Name
Type
112
GND
-
113
GPIO3
I/O
114
GND
-
115
AUX_AN
-
T
116
GND
-
-
117
NC
-
118
NC
-
119
NC
-
120
NC
121
GND
-
122
GND
-
123
GND
-
124
GND
-
125
GND
-
126
GND
-
127
GND
-
128
GND
-
129
GND
-
130
GND
-
131
GND
-
132
GND
-
133
GND
-
Issue 03 (2014-09-18)
Description
Ground
General I/O pins. The
function of these pins
has not been defined.
Ground
RF AUX antenna pad
Ground
Not connected,
please keep this pin
open.
Not connected,
please keep this pin
open.
Not connected,
please keep this pin
open.
Not connected,
please keep this pin
open.
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
2BDescription of the Application
Min.(
Parameter
V)
-
-
V
1.35
OH
V
0
OL
V
1.26
IH
V
–0.30
IL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Interfaces
Typ.
Max.
Comments
(V)
(V)
-
-
-
1.80
2.10
-
-
0.45
1.80
2.10
-
0.63
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
22
Advertisement
Table of Contents
