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Motorola Symbol SE4400 Integration Manual

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SE4400
Integration Guide

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Summary of Contents for Motorola Symbol SE4400

  • Page 1 SE4400 Integration Guide...
  • Page 3 SE4400 Integration Guide 72E-63399-04 Revision A January 2007...
  • Page 4 The software is provided strictly on an “as is” basis. All software, including firmware, furnished to the user is on a licensed basis. Motorola grants to the user a non-transferable and non-exclusive license to use each software or firmware program delivered hereunder (licensed program).
  • Page 5 Revision History Changes to the original manual are listed below: Change Date Description 72E-63399-01 6/2004 Initial release 72E-63399-02 8/2004 Updated mechanical drawing 72E-63399-03 4/2006 Update with engineering changes 72E-63399-04 1/2007 Added SE4400-E004E version decode ranges...

  • Page 7: Table Of Contents

    Contents About This Guide Introduction ..............ix Chapter Descriptions .
  • Page 8 SE4400 Integration Guide Commercially Available Coatings ..........2-6 A Word About Coatings .
  • Page 9 Contents Index Feedback...
  • Page 10 SE4400 Integration Guide viii...

  • Page 11: About This Guide

    About This Guide Introduction The SE4400 Integration Guide discusses the theory of operation, installation, and specifications of the engine, and how to integrate the engine into data capture devices. Note: This guide provides general instructions for the installation of the engine into a customer's device.

  • Page 12: Notational Conventions

    SE4400 Integration Guide Notational Conventions The following conventions are used in this document: • Bullets indicate: • action items • lists of alternatives • lists of required steps that are not necessarily sequential • Sequential lists (e.g., those that describe step-by-step procedures) appear as numbered lists.

  • Page 13: Chapter 1. Getting Started

    Chapter 1 Getting Started Per FDA and IEC standards, the engine described in this guide is not given a laser classification. However, the following precautions should be observed: Caution This laser component emits CDRH Class II/IEC Class I laser light. Do not stare into beam.

  • Page 14: Se4400

    SE4400 Integration Guide SE4400 The SE4400 contains: • a monochrome VGA charge coupled device (CCD) imager system • a laser-based aiming system • an illumination system • a motor drive for changing focus position • ample signal processing to provide an 8-bit data output (grayscale) for each pixel of the CCD sensor array.

  • Page 15: Aiming System

    Getting Started A 31-pin ZIF connector on the SE4400 connects the engine and the device via a 40 mm flex (available from Symbol, p/n 50-16000-650, via KT-SE4400-01). For information about this connector and flex, see Figure 4-1 on page 4-4 Figure 4-3 on page 4-6.

  • Page 16: Aiming Control

    SE4400 Integration Guide Aiming Control The aiming subsystem is under dynamic software control and is independent of the illumination subsystem. The SE4400 can capture images with both the aiming subsystem turned on (the image of the aiming pattern is captured in the digital image) and the aiming subsystem turned off. Illumination System An illumination subsystem, consisting of one red 635 nm LED, is provided to meet the image capture and decoding requirements throughout the full range of ambient lighting...

  • Page 17: Chapter 2. Installation

    Chapter 2 Installation Overview This chapter provides information for mounting and installing the SE4400, including physical and electrical considerations, and recommended window properties for the SE4400. General Information Grounding The chassis is at ground. Isolate the SE4400 and host if installing the engine to a host that is not at ground, or has ground with the potential to inject noise.

  • Page 18: Mounting

    SE4400 Integration Guide Mounting There are two mounting holes (M1.6x0.35) and two locator holes on the bottom of the chassis (see Figure 2-1). The SE4400 can be mounted in any orientation without degradation in performance. Note: Mounting the SE4400 in a non-upright position results in images rotated accordingly in snapshot or video mode.
  • Page 19 Installation Notes: Unless otherwise specified: • Chassis is at ground. • Nominal aiming pattern envelope is 30 x 22.5 • Nominal imaging FOV envelope is 32 x 24 • Nominal illumination envelope is 40 cone. • Maximum envelopes do not include integration tolerances. •...

  • Page 20: Housing Design

    SE4400 Integration Guide Housing Design Note: Opto-mechanical analysis is recommended for housing design to ensure optimal scanning or imaging performance. Design the housing so that internal reflections from the illumination system are not directed back toward the engine. The reflections from the window can cause problems, and for particular window tilt angles, these reflections can bounce off the top or bottom of the housing and reach the engine.
  • Page 21 Installation or without an anti reflection coating, depending on the application). Following are descriptions of three popular window materials: PMMA, ADC (CR-39 ), and chemically tempered float glass. Table 2-1 outlines the suggested window properties. Table 2-1. Suggested Window Properties Material Clear cell-cast acrylic Thickness...

  • Page 22: Commercially Available Coatings

    SE4400 Integration Guide Commercially Available Coatings Anti-Reflection Coatings Anti-reflection coatings can be used for stray light control or to achieve maximum working range, and can be applied to the inside and/or outside of the window to reduce the amount of light reflected off the window back into the engine. However, they are expensive and have very poor abrasion and scratch resistance.

  • Page 23: A Word About Coatings

    Installation A Word About Coatings In all cases, adhere to the minimum tilt angle specified in Table 2-4 on page 2-9. When the SE4400 is set to an exposure time less than 10 milliseconds and gain less than 127, anti- reflection coating is not necessary (see Exposure &...

  • Page 24: Optical Path And Exit Window

    SE4400 Integration Guide Optical Path and Exit Window Figure 2-2. SE4400 Optical Path and Exit Window...

  • Page 25: Recommended Exit Window Information

    Installation Recommended Exit Window Information Exit Window Notes on page 2-10 for important information about Table 2-4. Table 2-4. Recommended Exit Window Information Near Zone Far Zone Distance From SE4400 At 1.00 mm 2.00 mm 3.80 mm 6.35 mm 8.90 mm 11.5 mm Imaging Axis (0.04 in.)

  • Page 26: Exit Window Notes

    SE4400 Integration Guide Exit Window Notes • For near zone, A is measured from the back surface (farther from the engine) of the exit window. • For far zone, A is measured from the front surface (closer to the engine) of the exit window.

  • Page 27: Chapter 3. Se4400 Specifications

    Chapter 3 SE4400 Specifications Overview This chapter provides the technical specifications of the SE4400. Decode zone and exit window characteristics are also provided. Technical Specifications Table 3-1. SE4400 Technical Specifications at 23° C Item Description Power Requirements Input Voltage 2.85 V to 3.45 V Camera Operating Current 79 mA typical Additional Motor Current...
  • Page 28 SE4400 Integration Guide Table 3-1. SE4400 Technical Specifications at 23° C (Continued) Item Description Minimum Optical Resolutions 6.67 mil (PDF417), 5 mil (Code 39) Aiming Delays Laser Turn On Time 494 µs typical Laser Turn Off Time 43 µs typical Illumination Delays LED Turn On Time 27 µs typical...
  • Page 29 SE4400 Specifications Table 3-1. SE4400 Technical Specifications at 23° C (Continued) Item Description Illumination Element Light Emitting Diode (LED) 635 nm ± 20 nm Total LED Output Power Less than 10 mW Pattern Angle 50º (FWHM) Shock 2000 ± 5% G applied via any mounting surface at -20º, 20º and 55º...

  • Page 30: Skew, Pitch And Roll

    SE4400 Integration Guide Note: Environmental and/or tolerance parameters are not cumulative. A thermal analysis is recommended if the application is subject to an extreme temperature environment. Skew, Pitch and Roll Measured on a 20 mil Code 39 symbol at a distance of 10 inches. Tolerance is reduced at extreme ends of the working range.
  • Page 31 SE4400 Specifications Skew Pitch + 60° from normal + 50° from normal Roll 360° Note: Tolerances are reduced at extreme ends of the working range. Figure 3-1. Skew, Pitch and Roll...

  • Page 32: Decode Zones

    SE4400 Integration Guide Decode Zones SE4400-E000E Near Focus Figure 3-2 shows the decode zone for the Near Focus SE4400-E000E. Typical values appear. Table 3-2 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 33 SE4400 Specifications Table 3-2. SE4400-E000E Near Focus Decode Distances Typical Working Guaranteed Working Bar Code Symbol Density/ Ranges Ranges Content/ Bar Code Type Note 2 Contrast Near Near 5.0 mil ABCDEFGH 3.5 in 7.0 in 4.25 in 6.0 in Code 39 80% MRD 8.9 cm 17.8 cm...
  • Page 34 SE4400 Integration Guide Far Focus Figure 3-3 shows the decode zone for the Far Focus SE4400-E000E. Typical values appear. Table 3-3 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 35 SE4400 Specifications Table 3-3. SE4400-E000E Far Focus Decode Distances Typical Working Guaranteed Working Bar Code Symbol Density/ Ranges Ranges Content/ Bar Code Type Note 2 Contrast Near Near 5.0 mil ABCDEFGH 6.5 in 7.5 in Code 39 80% MRD 16.5 cm 19.1 cm 6.67 mil 4 Col, 20 Rows...
  • Page 36 SE4400 Integration Guide Toggled Focus Figure 3-4 shows the decode zone for the Toggled Focus SE4400-E000E. Typical values appear. Table 3-4 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 37 SE4400 Specifications Table 3-4. SE4400-E000E Toggled Focus Decode Distances Typical Working Guaranteed Working Bar Code Symbol Density/ Ranges Ranges Content/ Bar Code Type Note 2 Contrast Near Near 5.0 mil ABCDEFGH 3.5 in 7.5 in 4.25 in 6.0 in Code 39 80% MRD 8.9 cm 19.1 cm...
  • Page 38 SE4400 Integration Guide Decode Distances in Darkness Table 3-5. SE4400-E000E Decode Distances in Darkness Typical Working Bar Code Symbol Density/ Focus Ranges Content/ Bar Code Type Position Note 2 Contrast Near 5.0 mil ABCDEFGH Near 3.5 in 5.875 in Code 39 80% MRD 8.9 cm 14.1 cm...
  • Page 39 SE4400 Specifications Table 3-5. SE4400-E000E Decode Distances in Darkness (Continued) Typical Working Bar Code Symbol Density/ Focus Ranges Content/ Bar Code Type Position Note 2 Contrast Near 15 mil 80% MRD Near Note 1 7.125 in PDF417 18.1 cm Note 1 7.75 in 19.7 cm 20 mil...

  • Page 40: Se4400-E004E

    SE4400 Integration Guide SE4400-E004E Near Focus Figure 3-5 shows the decode zone for the Near Focus SE4400-E004E. Typical values appear. Table 3-6 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 41 SE4400 Specifications Table 3-6. SE4400-E004E Near Focus Decode Distances Guaranteed Working Bar Code Typical Working Ranges Symbol Density/ Ranges Content/ Bar Code Type Note 2 Contrast Near Near 4.0 mil 80% MRD 2.9 in 3.7 in Note 1 3.3 in PDF417 7.37 cm 9.40 cm...
  • Page 42 SE4400 Integration Guide Far Focus Figure 3-6 shows the decode zone for the Far Focus SE4400-E004E. Typical values appear. Table 3-7 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 43 SE4400 Specifications Table 3-7. SE4400-E004E Far Focus Decode Distances Typical Working Guaranteed Working Bar Code Symbol Density/ Ranges Ranges Content/ Bar Code Type Note 2 Contrast Near Near 4.0 mil 80% MRD PDF417 5.0 mil ABCDEFGH 4.3 in 7.0 in 5.25 in 6.75 in Code 39...
  • Page 44 SE4400 Integration Guide Toggled Focus Figure 3-7 shows the decode zone for the Toggled Focus SE4400-E004E. Typical values appear. Table 3-8 lists the typical and guaranteed distances for selected bar code densities. The minimum element width (or “symbol density”) is the width in mils of the narrowest element (bar or space) in the symbol.
  • Page 45 SE4400 Specifications Table 3-8. SE4400-E004E Toggled Focus Decode Distances Typical Working Guaranteed Working Bar Code Symbol Density/ Ranges Ranges Content/ Bar Code Type Note 2 Contrast Near Near 4.0 mil 80% MRD 2.9 in Note 1 PDF417 7.37 cm 5.0 mil ABCDEFGH 2.2 in 7.0 in...
  • Page 46 SE4400 Integration Guide Decode Distances in Darkness Table 3-9. SE4400-E004E Decode Distances in Darkness Typical Working Bar Code Symbol Density/ Focus Ranges Content/ Bar Code Type Position Note 2 Contrast Near 4.0 mil 80% MRD Near 2.9 in 3.5 in PDF417 7.37 cm 8.89 cm...
  • Page 47 SE4400 Specifications Table 3-9. SE4400-E004E Decode Distances in Darkness (Continued) Typical Working Bar Code Symbol Density/ Focus Ranges Content/ Bar Code Type Position Note 2 Contrast Near 13 mil 012345678905 Near 2.7 in 5.2 in UPC-A 80% MRD 6.86 cm 13.21 cm 3.2 in 10.7 in...
  • Page 48 SE4400 Integration Guide 3-22...

  • Page 49: Chapter 4. Electrical Interface

    Chapter 4 Electrical Interface Overview The SE4400 has one 31-pin connector. See Figure 2-1 on page 2-3 for the pin one location, on the side opposite the aiming/illumination system. SE4400 Table 4-1 lists the pins and signals of the 31-pin connector on the SE4400. Table 4-1.
  • Page 50 SE4400 Integration Guide Table 4-1. SE4400 Signal Information (Continued) SE4400 Signal Note Number Name EXSFT External Frame Sync ILLUM_ENB* LED Illumination Control AIM_ENB* Laser Aiming Control PIX_D0 Pixel Data Bit 0 (LSB) PIX_D1 Pixel Data Bit 1 PIX_D2 Pixel Data Bit 2 PIX_D3 Pixel Data Bit 3 PIX_D4...
  • Page 51 Electrical Interface If CS* is brought low, the pixel data lines (PIX_D0 through PIX_D7) are in the output state in acquisition mode, and are brought low in stand-by mode. If CS* is brought high, the pixel data lines are in the output state during acquisition mode, and are in a Hi-Z state during stand-by mode.

  • Page 52: Connector Drawings

    SE4400 Integration Guide Connector Drawings 1.6 (0.063) 0.12 (0.005) 0.85 (0.033) Notes: 1. Dimensions are in mm (in.) 2. Material: Housing: LCP UL94V-0 Actuator: PPS UL94V-0 1.3 (0.051) Terminal: phosphor bronze, Sn-Pb over Cu plating 0.3 (0.012) Stopper: phosphor bronze, Sn-Pb over Cu plating 3.
  • Page 53 Electrical Interface Dimensions are in mm unless otherwise specified. Figure 4-2. 31-Pin ZIF Connector, p/n 50-12100-1002 (continued)
  • Page 54 SE4400 Integration Guide 10.50 4.50 + 0.50 Polymide Stiffener Far Side See Note 6 & 10 2X R 5.25 +/- 0.50 12X R 0.20 4.35 +/- 0.01 9.50 Notes: 1. Dimensions are in mm. 2. Material: Base dielectric to be 1 mil polymide per IPC-4204/11 with 1/2 oz. copper clad. Coverlayer(s) to be polymide per IPC-4203/1.

  • Page 55: Molex Connector Specifications

    Electrical Interface Molex Connector Specifications The following table provides electrical, mechanical, and environmental performance specifications for the Molex connector. Table 4-2. Molex Connector Specifications Item Test Condition Requirement Electrical Performance Contact Resistance Mate applicable FPC, measure by dry Odd CKT: 80 milliohms max. circuit, 20 mV max., 10 mA.
  • Page 56 SE4400 Integration Guide Table 4-2. Molex Connector Specifications (Continued) Item Test Condition Requirement Vibration DC 1 mA Appearance No damage Amplitude: 1.5 mm P-P Contact Odd CKT: 100 Sweep time: 10~55~10 Hz in 1 minute Resistance milliohms max. Duration: 2 hours in each X.Y.Z. axes Even CKT: 60 (MIL-STD-202 Method 201) milliohms max.
  • Page 57 Electrical Interface Table 4-2. Molex Connector Specifications (Continued) Item Test Condition Requirement Humidity Temperature: 60 ±2 Appearance No damage Relative Humidity: 90 / 95% Contact Odd CKT: 100 Duration: 96 hours Resistance milliohms max. (JIS C0022/MIL-STD-202 Method 103) Even CKT: 60 milliohms max.

  • Page 58: Connector Insertion/Withdrawal Force

    SE4400 Integration Guide Table 4-2. Molex Connector Specifications (Continued) Item Test Condition Requirement Solderability Soldering Time: 3 ±0.5 second Solder wetting 75% of Solder Temperature: 230 ±5 immersed area must show no 0.2 mm from terminal tip voids, pin 0.2 mm from fitting nail tip. holes.

  • Page 59: Chapter 5. Application Notes

    Chapter 5 Application Notes Overview This chapter includes image acquisition and power consumption information. Image Acquisition The SE4400 CCD is a monochrome VGA resolution sensor. The pixel area, shown in Figure 5-1, is composed of 680 horizontal pixels and 492 vertical pixels; however the actual area upon which light is gathered is slightly smaller (652 x 486 pixels).
  • Page 60 SE4400 Integration Guide *OBP = Optically Blocked Pixels, which are not photosensitive. Figure 5-1. Pixel Layout To operate properly, the CCD chipset requires a clock near 24 MHz. To achieve this, an internal PLL multiplies the incoming 12 MHz MCKI by two to generate the 24 MHz internal camera clock, MCK.

  • Page 61: Startup Procedure

    Application Notes Note: Clock details apply for the I C settings provided in Appendix A, Register Settings. For alternate clock scenarios, refer to LC99704B- WK3 Sanyo DSP Specification, Version 1. The operating settings, stored in the SE4400’s on-board DSP registers, are programmed using the I C interface developed by Philips.
  • Page 62 SE4400 Integration Guide the Vcc supply voltage cannot meet this rise time requirement, bring REG_RES* low by external means for a minimum of 500 µs. After a successful reset, the I C registers contain default parameters that place the SE4400 in stand-by mode. Initialize the SE4400 with the register values listed in Table A-1 Table A-2.
  • Page 63 Application Notes Figure 5-2. Mode 3 Startup Timing Diagram...

  • Page 64: Image Acquisition Procedure

    SE4400 Integration Guide Image Acquisition Procedure Figure 5-3 summarizes the Mode 3 imaging acquisition procedure. Table 5-1 provides a summary of the Mode 3 input and output signal functions. The CCD is exposed to light during the time that EXSFT is low. This exposure time must be an integer multiple of line times "H", unless it begins after the negative edge of VREF, in which case this time is not restricted.
  • Page 65 Application Notes Table 5-1. Mode 3 Signal Function Summary Signal Significance of Significance of Function Comment Name Negative Edge Positive Edge EXSFT Sets exposure Causes the CCD Causes the CCD to The period time. to begin exposing. stop exposing. between successive positive Begins frame Begins transfer of...
  • Page 66 SE4400 Integration Guide Figure 5-3. Mode 3 Image Acquisition Procedure Diagram...

  • Page 67: Mode 1

    Application Notes Mode 1 Startup Procedure Figure 5-4 for the Mode 1 startup procedure timing diagram. The Vcc supply voltage and REG_RES* reset line requirements are the same in Mode 1 as in Mode 3. After a successful reset, the I C registers contain default parameters that place the SE4400 in stand-by mode.
  • Page 68 SE4400 Integration Guide Figure 5-4. Mode 1 Startup Timing Diagram 5-10...

  • Page 69: Image Acquisition Procedure

    Application Notes Image Acquisition Procedure Figure 5-5 summarizes the Mode 1 imaging acquisition procedure. Table 5-2 summarizes the Mode 1 input and output signal functions. As with Mode 3, VREF and HREF indicate the reading of valid vertical and horizontal pixel data, respectively.
  • Page 70 SE4400 Integration Guide Figure 5-5. Mode 1 Image Acquisition Procedure Diagram 5-12...

  • Page 71: Power Modes

    Application Notes Power Modes The SE4400 supports five power modes, defined in Table 5-3, which offer trade-offs between power consumption and image acquisition time. Table 5-3. Power Mode Descriptions Power Current Draw Mode 3 Mode 1 Description Mode (ma) Recovery Time Recovery Time Completely powered off by a ~156 ms...
  • Page 72 SE4400 Integration Guide • To enter Mode D, halt the acquisition of the 8-bit pixel data. The recovery time for this mode can vary from 66 ms down to 33 ms, depending on how near the exit of Mode D is to the end of the frame (if it occurs immediately prior to the end of the frame, the recovery time is 33 ms).
  • Page 73 Application Notes Figure 5-6. Power Mode Overview 5-15...

  • Page 74: Motor Control

    SE4400 Integration Guide Motor Control The SE4400’s lens system can be dynamically set to near or far focus positions: • The near focus allows the SE4400 to focus on objects that are about five inches away. • The far focus allows the SE4400 to focus on objects that are about nine inches away.
  • Page 75 Application Notes auto-exposure mode unless Address 130d[2] is set to 0. For more information concerning auto-exposure, refer to LC99704B-WK3 Sanyo DSP Specification, Version 1. Digital and analog gain controls can be varied over the I C interface. Use both the digital and analog gain to achieve a maximum gain of over 30 dB.

  • Page 76: Power Consumption

    SE4400 Integration Guide Power Consumption Figure 5-8 segments the current profile into 7 divisions of time. See Table 5-5 for details of this segmentation. These measurements were taken with the motor disabled and the illumination and aiming turned off. The results apply to both Mode 1 and Mode 3 operation. Figure 5-8.
  • Page 77 Application Notes Table 5-5. Detailed Breakdown Of Current Profile Start time End time Average Peak Triggering w/Respect to w/Respect to Duration Frequency Region Current Current Event Negative Edge Negative Edge (ms) (Hz) (mA) (mA) of VREF (ms) of VREF (ms) Negative 0.000 0.460...
  • Page 78 SE4400 Integration Guide 5-20...

  • Page 79: Appendix A Register Settings

    Appendix A Register Settings Mode 3 I C Register Settings Table A-1. Mode 3 I C Register Settings: Initial Setting A Register Register Data Address (HEX) (HEX) Comment 0x00 0x00 register reset 0x00 0x01 register reset 0xF8 0x00 circuit reset 0xF8 0x01 circuit reset...
  • Page 80 SE4400 Integration Guide Table A-1. Mode 3 I C Register Settings: Initial Setting A (continued) Register Register Data Address (HEX) (HEX) Comment 0x09 0x85 NSUB DC level 0x0A 0x03 UV0, UV1 input 0x0B 0x00 Y output 0x0E 0x00 VGA CCD 0x0F 0x9F 8 bit raw output...
  • Page 81 Register Settings Table A-1. Mode 3 I C Register Settings: Initial Setting A (continued) Register Register Data Address (HEX) (HEX) Comment 0x50 0x00 Digital CLP H mode 0x82 0x30 AGC,ADGC,AE OFF 0x9D Varies Analog gain setting 0x9E Varies Digital gain setting 0xBF AMPCLP x1 0xCD...

  • Page 82: Mode 1 I2C Register Settings

    SE4400 Integration Guide Mode 1 I C Register Settings Table A-3. Mode 1 I C Register Settings Register Address Register Data (Dec) (Dec) Note: The register data must be written in the order shown.
  • Page 83 Register Settings Table A-3. Mode 1 I C Register Settings (continued) Register Address Register Data (Dec) (Dec) Note: The register data must be written in the order shown.
  • Page 84 SE4400 Integration Guide Table A-3. Mode 1 I C Register Settings (continued) Register Address Register Data (Dec) (Dec) Note: The register data must be written in the order shown.
  • Page 85 Register Settings Table A-3. Mode 1 I C Register Settings (continued) Register Address Register Data (Dec) (Dec) Note: The register data must be written in the order shown.

  • Page 86: Stand-By I2C Register Settings

    SE4400 Integration Guide Stand-by I C Register Settings Table A-4. I C Settings to Enter Stand-by Register Address Register Data Comment (Hex) (Hex) 0x09 0x01 Driver standby 1 0x3c Driver standby 2 0xB8 0x22 Analog block standby 0xB9 0x00 MCKI standby 0xC2 0x00 PLL standby...
  • Page 87 Index aiming ......1-3 decode distances control ......1-4 far focus .
  • Page 88 SE4400 Integration Guide motor control ....5-16 startup ......5-9 near focus decode distances .
  • Page 89 Index shock specification ....3-3 temperature specification ....3-3 signal functions mode 1 .
  • Page 90 SE4400 Integration Guide Index-4...
  • Page 91 Tell Us What You Think... We’d like to know what you think about this Manual. Please take a moment to fill out this questionnaire and fax this form to: (631) 738-4618, or mail to: Symbol Technologies, Inc. One Symbol Plaza M/S B-10 Holtsville, NY 11742-1300 Attention: Technical Publications Manager Advanced Data Capture Division...
  • Page 94 Symbol Technologies, Inc. One Symbol Plaza Holtsville, New York 11742-1300 http://www.symbol.com 72E-63399-04 Revision A - January 2007...

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