HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
PIN
Pin Name
No.
Normal
142
GND
143
GND
144
GND
145
GND
Issue 09 (2014-03-06)
I/O
Description
MUX
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
-
-
Thermal Ground Pad
P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output.
The NC (Not Connected) pins are internally connected to the module. Therefore, these pins
should not be used, otherwise they may cause problems. Please contact us for more details
about this information.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
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Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
DC Characteristics (V)
Min.
Typ.
-
-
-
-
-
-
-
-
Max.
-
-
-
-
25