Specification Of Rework; Process Of Rework; Preparations Of Rework; Removing Of The Module - Huawei ME909u-521 Hardware Manual

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide

6.10 Specification of Rework

6.10.1 Process of Rework

6.10.2 Preparations of Rework

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6.10.3 Removing of the Module

The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.
Issue 05 (2017-12-15)
Remove barrier or devices that can't stand high temperature before rework.
If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .
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Mechanical Specifications
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