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HUAWEI ME906s LTE M.2 Module
Hardware Guide
Issue
05
Date
2019-03-25

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Summary of Contents for Huawei ME906s LTE M.2

  • Page 1 HUAWEI ME906s LTE M.2 Module Hardware Guide Issue Date 2019-03-25...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI ME906s LTE M.2 Module Hardware Guide About This Document About This Document Revision History DocumentVer Date Chapter Descriptions sion 2015-06-10 Creation Updated dimensions in Table 2-1 2015-07-23 Features 3.4.2 Updated the maximum value of the pull- up resistor 4.3.1 Updated the test instrument 4.4.2...
  • Page 4: Table Of Contents

    HUAWEI ME906s LTE M.2 Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview..........................8 2.3 Circuit Block Diagram ........................9 3 Description of the Application Interfaces ................11 3.1 About This Chapter ..........................
  • Page 5 HUAWEI ME906s LTE M.2 Module Hardware Guide Contents 3.11.2 Coaxial RF Connector Guidelines ..................42 4 RF Specifications ......................... 45 4.1 About This Chapter ......................... 45 4.2 Operating Frequencies ........................45 4.3 Conducted RF Measurement ......................46 4.3.1 Test Environment ........................46 4.3.2 Test Standards ........................
  • Page 6 HUAWEI ME906s LTE M.2 Module Hardware Guide Contents 9.6 Safety of Children ........................... 72 9.7 Environment Protection ........................72 9.8 WEEE Approval ..........................72 9.9 RoHS Approval ..........................72 9.10 Laws and Regulations Observance ..................... 73 9.11 Care and Maintenance ......................... 73 9.12 Emergency Call ..........................
  • Page 7: Introduction

    Introduction This document describes the hardware application interfaces and air interfaces that are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the ME906s module) is used. M.2 is the new name for NGFF (Next Generation Form Factor), which is the specification of PCI-SIG (Peripheral Component Interconnect Special Interest Group).
  • Page 8: Overall Description

    HUAWEI ME906s LTE M.2 Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the ME906s module and provides:  Function Overview  Circuit Block Diagram 2.2 Function Overview Table 2-1 Features...
  • Page 9: Circuit Block Diagram

    3GPP specifications. 2.3 Circuit Block Diagram The ME906s module is developed based on Huawei's Balong Hi6921M platform. Figure 2-1 shows the circuit block diagram of the ME906s module. The application block diagram and major functional units of the ME906s module contain the following parts: ...
  • Page 10 HUAWEI ME906s LTE M.2 Module Hardware Guide Overall Description  Power manager  Nand Flash  Radio Frequency (RF) transceiver  RF Front End Figure 2-1 Circuit block diagram Huawei Proprietary and Confidential Issue 05 (2019-03-25) Copyright © Huawei Technologies Co., Ltd.
  • Page 11: Description Of The Application Interfaces

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the application interfaces of the ME906s module, including:  75-pin Gold Finger  Power Interface ...
  • Page 12 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-1 TOP view of gold finger interface pins Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch) of the ME906s module.
  • Page 13 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the M.2 interface Min. Typ. Max. Pin Name Description Parameter Comments Type module is Connected to Ground CONFIG_3 configured internally. as WWAN- SSIC 0.
  • Page 14 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Notch Notch Notch Notch Notch Notch Reserved for future use, Reserved please keep it not connected in the host side.
  • Page 15 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Not Connected 0.7 x USIM USIM_PW USIM_RESET USIM Reset R=1.8 V or 0.2 x 3.0 V USIM Not Connected 0.7 x...
  • Page 16 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Not Connected Ground Ground 1.26 current firmware I2C_SCL I2C clock, slave. does not support –0.3 0.63 this function. Not Connected 1.35...
  • Page 17 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Ground Ground Not Connected Not Connected Not Connected Not Connected Not Connected Ground Ground Not Connected Tunable antenna control 1.37...
  • Page 18 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type USIM hot swap detection pin. 1.26 Rising edge for insertion; falling edge for removal. module is USIM_DET pulled up When it is High, USIM is inside.
  • Page 19: Power Interface

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces 3.3 Power Interface 3.3.1 Overview The power supply part of the ME906s module contains:  3.3V pin for the power supply  USIM_PWR pin for USIM card power output Table 3-2 lists the definitions of the pins on the power supply interface.
  • Page 20 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-2 Recommended power circuit 3.3V 3.3V Module (Modem) 330 pF 100 nF 1 μF 22 μF 220 μF 3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be under 3.135 V in any case, which is shown as the following figure.
  • Page 21: Usim Power Output Usim_Pwr

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-3 Power supply timing sequence between power cycling Parameter Remarks Time (Min.) Unit Power off time 3.3.3 USIM Power Output USIM_PWR Through the USIM_PWR power supply interface, the ME906s module can supply 1.8 V or 3.0 V power to USIM card.
  • Page 22 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces  BodySAR detection (BodySAR_N) pin  USIM detection (USIM_DET) pin Table 3-3 lists the pins on the signal control interface. Table 3-3 Pins on the signal control interface Parameter Min.
  • Page 23: Power_On_Off Control Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Parameter Min. Typ. Max. Comments Pin Name Description Type Hardware pin for BodySAR Detection. 1.26 When it is High, No TX BodySAR_N power backoff (default). –0.3 When it is Low, TX power backoff.
  • Page 24 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-4 Recommended connections of Power_On_Off pin (auto power) ME906s 3.3V Pin2, 4, 70, 72, 74 47 kΩ Power_On_Off Pin6  Power on sequence Do not toggle RESET# during power on sequence. Pulling RESET# low will extend time for module startup.
  • Page 25 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-6 Recommended power off timing sequence (cut off 3.3 V) 3.3V RESET# Power_On_Off Power off If ME906s is powered directly to battery For use case ME906s is connected directly to battery, such as tablet platforms, Power_On_Off should be controlled by a GPIO from the host to control ME906s to be powered on/off.
  • Page 26 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Do not toggle RESET# during power on sequence, pulling RESET# low will extend time for module startup. The recommended power on timing sequence is shown as Figure 3-8 .
  • Page 27 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-10 Recommended warm boot timing in the notebook/tablet 3.3V (battery, always on) RESET# Power_On_Off Warm boot in the notebook/tablet t2 ≥ 500 ms If there is a limitation on the controlling GPIO to be programmable 500 ms, the hardware solution as shown in Figure 3-11 can be used.
  • Page 28: Reset# Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces 3.4.3 RESET# Pin The ME906s module can be reset through the RESET# pin asynchronous, active low. Whenever this pin is active, the module will immediately be placed in a Power On reset condition.
  • Page 29 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces GPIO1 Module HOST RESET# Pin 67 1MΩ NMOS 33рF NMOS 0Ω GPIO1 Hardware circuit for RESET# (option 3) GPIO is not high-impedance when the host is powered off.
  • Page 30: Led# Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces 3.4.4 LED# Pin ME906s provides an open drain signal to indicate the RF status. Table 3-5 State of the LED# pin Operating Status LED# RF function is turned on...
  • Page 31: Gps_Disable# Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-13 Connections of the W_DISABLE# pin It is recommended not to add a diode on the W_DISABLE# pin outside the module. 3.4.6 GPS_DISABLE# Pin ME906s provides a hardware pin (GPS_DISABLE#) to disable or enable the GPS. In addition, the GPS can also be enabled or disabled through software AT commands.
  • Page 32: Wake_On_Wwan# Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces It is recommended not to add a diode on the GPS_DISABLE# pin outside the module. 3.4.7 Wake_On_WWAN# Pin ME906s provides an open drain output Wake_On_WWAN# pin to wake up the host, which is low active.
  • Page 33: Usim_Det Pin

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces BodySAR_N Function High Max. TX power will NOT be backed off (default). Floating Max. TX power will NOT be backed off. If BodySAR_N pin is used to monitor the proximity sensor output directly, there are some essential preconditions for this hardware solution.
  • Page 34 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-18 Connections of the USIM_DET pin CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin in the USIM socket.
  • Page 35: Usb Interface

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-19 Logic of USIM_DET 3.5 USB Interface The ME906s is compliant with USB 2.0 high speed protocol. The USB input/output lines are following USB 2.0 specifications. Definition of the USB interface: Pin No.
  • Page 36: Usim Card Interface

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-21 USB D+ and 3.3V power on timing sequence 3.3V Power_On_Off USB D+ Parameter Remarks Time (Nominal value) Unit Power valid to USB D+ high The layout design of this circuit on the host board should comply with the USB 2.0 high speed protocol, with differential characteristic impedance of 90 Ω.
  • Page 37: Circuit Recommended For The Usim Card Interface

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type 0.7 x USIM USIM_P USIM_CLK USIM Clock WR=1.8 V or 0.2 x 3.0 V USIM 0.7 x USIM 0.2 x...
  • Page 38: Tunable Antenna Control

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-22 Circuit of the USIM card interface  The ESD protection component should choose low capacitance. The capacitance of the component should be lower than 10 pF.
  • Page 39: Config Pins

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Table 3-11 List of ANTCTL pins Min. Typ. Max. Pin Name Description Parameter Comments Type Tunable antenna 1.37 control signal, bit 0. ANTCTL0 It is a push-pull type 0.45...
  • Page 40: Reserved Pins

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces In the M.2 spec, the 4 pins are defined as shown in Table 3-13 . Table 3-13 List of Config pins Config_0 Config_1 Config_2 Config_3 Module type and...
  • Page 41: Nc Pins

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces 3.10 NC Pins The module has some NC pins. All of NC pins are not connected in the module. Table 3-16 List of NC pins Min. Typ. Max.
  • Page 42: Coaxial Rf Connector Guidelines

    HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces 3.11.2 Coaxial RF Connector Guidelines  The antenna interface must be used with coaxial cables with characteristic impedance of 50 Ω.  The ME906s module supports the buckled RF connector antenna connection methods: buckled RF connector 818000500 by ECT, RFC43-1K2600 by ACON or other equivalent connectors.
  • Page 43 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-25 Specifications of 0.81 mm coaxial cable mating with the RF connector Figure 3-26 Connection between the RF connector and the 0.81 mm cable Figure 3-27 Specifications of 1.13 mm coaxial cable mating with the RF connector...
  • Page 44 HUAWEI ME906s LTE M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-28 Connection between the RF connector and the 1.13 mm cable Huawei Proprietary and Confidential Issue 05 (2019-03-25) Copyright © Huawei Technologies Co., Ltd.
  • Page 45: Rf Specifications

    HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the ME906s module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...
  • Page 46: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions.  4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity...
  • Page 47 HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications Table 4-2 Conducted Rx sensitivity Typical Value Band Note (Unit: dBm) – GSM 850 BER Class II < 2.44% – GSM 900 BER Class II < 2.44% – GSM 1800 BER Class II < 2.44% –...
  • Page 48: Conducted Transmit Power

    HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications  The test values are the average of some test samples. LTE sensitivity is tested in SIMO (Main + AUX).   The circular error probability for GPS value is 50%.
  • Page 49: Antenna Design Requirements

    HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications 4.5 Antenna Design Requirements 4.5.1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss.
  • Page 50 HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications  Distance between antennas  Antenna type  Antenna direction The primary antenna must be placed as near as possible to the ME906s to minimize the cable length. The secondary antenna needs to be installed perpendicularly to the primary antenna.
  • Page 51: Interference

    RF transmission cable into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.
  • Page 52 HUAWEI ME906s LTE M.2 Module Hardware Guide RF Specifications Antenna Requirements Bandwidth of primary 70 MHz in GSM 850 antenna 80 MHz in GSM 900 170 MHz in GSM 1800 140 MHz in GSM 1900 250 MHz in UMTS Band 1/LTE Band 1...
  • Page 53: Electrical And Reliability Features

    HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the ME906s module, including:  Absolute Ratings  Operating and Storage Temperatures ...
  • Page 54: Power Supply Features

    HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Table 5-2 Operating and storage temperatures Specification Min. Max. Unit –10 Normal operating temperature ° C –20 Extended operating temperature ° C –40 Ambient storage temperature ° C [1]: When the ME906s module works at –20° C to –10° C or +55° C to +70° C, NOT all its RF specifications comply with the 3GPP specifications.
  • Page 55: Power Consumption

    HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features 5.4.2 Power Consumption The power consumption of ME906s in different scenarios are respectively listed in Table 5-5 to Table 5-9 . The power consumption listed in this section are tested when the power supply of ME906s module is normal voltage (3.3 V), and all of test values are measured at...
  • Page 56 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Description Bands Test Value (Unit: mA) Notes/Configuration Typical Idle LTE bands Module is powered up. DRX cycle=8 (2.56s) Module is registered on the network, and no data is transmitted.
  • Page 57 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Band 8 1 dBm Tx Power (900 MHz) 10 dBm Tx Power 23.5 dBm Tx Power Band 1 1 dBm Tx Power (IMT2100) 10 dBm Tx Power 23.5 dBm Tx Power...
  • Page 58 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Table 5-8 Averaged DC power consumption (GSM/GPRS/EDGE) Test Value (Unit: mA) Description Notes/Configuration Typical 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down GPRS 850 1 Up/1 Down 2 Up/1 Down...
  • Page 59 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features 2 Up/1 Down GPRS 1900 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE 850 1 Up/1 Down...
  • Page 60: Reliability Features

    HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE 1900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique.
  • Page 61 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  High-temperature Temperature: 85º C JESD22- Visual inspection: ok storage A103-C pcs/group  Operation mode: no Function test: ok power, no package RF specification: ok ...
  • Page 62 HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Sine vibration Frequency range: 5 Hz to JESD22- Visual inspection: ok 200 Hz B103-B pcs/group Function test: ok  Acceleration: 1 Grms RF specification: ok ...
  • Page 63: Emc And Esd Features

    HUAWEI ME906s LTE M.2 Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Temperature High temperature: 85º C JESD22- Visual inspection: ok cycle A104-C pcs/group Low temperature: –40º C  Function test: ok ...
  • Page 64  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI ME906s module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 05 (2019-03-25) Copyright © Huawei Technologies Co., Ltd.
  • Page 65: Mechanical Specifications

    HUAWEI ME906s LTE M.2 Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the following aspects of the ME906s module:  Dimensions  Packing System 6.2 Dimensions Figure 6-1 shows the dimensions of ME906s in details.
  • Page 66: Packing System

    HUAWEI ME906s LTE M.2 Module Hardware Guide Mechanical Specifications 6.3 Packing System ME906s package includes the blister tray, the blister tray cover, and the carton (with bottom and top clapboard). The blister tray of the ME906s module package is as shown in the following figure.
  • Page 67: Installation

    HUAWEI ME906s LTE M.2 Module Hardware Guide Installation Installation 7.1 About This Chapter This chapter describes the assembly of ME906s, including:  Connect ME906s to board  Thermal Management  Antenna Plug 7.2 Connect ME906s to board Figure 7-1 Install the module HUAWEI M.2 Module...
  • Page 68: Thermal Management

    HUAWEI ME906s LTE M.2 Module Hardware Guide Installation 7.3 Thermal Management Because ME906s is very small, the dissipating heat is very important to it. It has to take several means to ensure ME906s to meet the specification. The methods described as follow: ...
  • Page 69 HUAWEI ME906s LTE M.2 Module Hardware Guide Installation Figure 7-3 Unmating the plug The extraction tool is recommended.   Any attempt of unmating by pulling on the cable may result in damage and influence the mechanical / electrical performance.
  • Page 70: Certifications

    HUAWEI ME906s LTE M.2 Module Hardware Guide Certifications Certifications This chapter gives a general description of certifications of ME906s. Table 8-1 Product certifications Certification ME906s-158      EU RoHS  PVC-Free   Halogen-free  Table 8-1 shows certifications the module has been implemented. For more demands, please contact us for more details about this information.
  • Page 71: Safety Information

    HUAWEI ME906s LTE M.2 Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 9.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.
  • Page 72: Traffic Security

    HUAWEI ME906s LTE M.2 Module Hardware Guide Safety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 9.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.
  • Page 73: Laws And Regulations Observance

    The following approvals and notices apply in specific regions as noted. 9.13.1 EU Regulatory Conformance Statement Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. Huawei Proprietary and Confidential Issue 05 (2019-03-25) Copyright ©...
  • Page 74: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 05 (2019-03-25)
  • Page 75: Appendix A Circuit Of Typical Interface

    HUAWEI ME906s LTE M.2 Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface DNI: Do Not Install initially. M.2: new name of NGFF. Config pin SCH CONFIG[3:0] is for card type indication and present detection...
  • Page 76: Appendix B Acronyms And Abbreviations

    HUAWEI ME906s LTE M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP 3rd Generation Partnership Project China Compulsory Certification Central Processing Unit Coding Scheme Circuit Switched Data Direct Current Direct Memory Access...
  • Page 77 HUAWEI ME906s LTE M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion Global System for Mobile communication Human Body Model HSIC High Speed Inter-Chip Interface HSDPA High-Speed Downlink Packet Access HSPA+ Enhanced High Speed Packet Access...
  • Page 78 HUAWEI ME906s LTE M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion UMTS Universal Mobile Telecommunications System Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access...

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