HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
3.12 Reserved Interface ....................................................................................................................... 46
3.13 NC Interface ................................................................................................................................. 46
3.14 Tunable Antenna Control .............................................................................................................. 47
4 RF Specifications ......................................................................................................................... 48
4.1 About This Chapter ......................................................................................................................... 48
4.2 Operating Frequencies ................................................................................................................... 48
4.3.1 Test Environment ................................................................................................................... 49
4.3.2 Test Standards ....................................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 54
4.5.3 Antenna Requirements .......................................................................................................... 54
4.6.1 Purpose ................................................................................................................................. 55
5.1 About This Chapter ......................................................................................................................... 58
5.2 Absolute Ratings ............................................................................................................................ 58
5.4 Power Supply Features .................................................................................................................. 59
5.4.1 Input Power Supply ............................................................................................................... 59
5.4.2 Power Consumption .............................................................................................................. 60
5.5 Reliability Features ......................................................................................................................... 65
5.6 EMC and ESD Features ................................................................................................................. 68
6 Mechanical Specifications ......................................................................................................... 70
6.1 About This Chapter ......................................................................................................................... 70
6.2 Storage Requirement ..................................................................................................................... 70
6.3 Moisture Sensitivity ........................................................................................................................ 70
6.5 Packaging ....................................................................................................................................... 72
6.6 Label ............................................................................................................................................... 73
6.7 Customer PCB Design ................................................................................................................... 73
6.7.1 PCB Surface Finish ............................................................................................................... 73
6.7.2 PCB Pad Design .................................................................................................................... 73
6.7.3 Solder Mask ........................................................................................................................... 74
6.8 Thermal Design Solution ................................................................................................................ 75
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
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