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Quectel M10 Hardware Description

Quectel M10 Hardware Description

Cellular engine
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M10
Quectel Cellular Engine
Hardware Design
M10_HD_V1.00

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  • Page 1 Quectel Cellular Engine Hardware Design M10_HD_V1.00...
  • Page 2 Document Control ID General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided to Quectel by the customers. Quectel has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession.

  • Page 3: Table Of Contents

    M10 Hardware Design Contents Contents ............................2 0 Revision history ...........................7 1 Introduction ..........................8 1.1 Related documents .......................8 1.2 Terms and abbreviations.......................9 1.3 Safety caution........................11 2 Product concept ........................13 2.1 Key features ........................13 2.2 Functional diagram......................15 2.3 Evaluation board ........................16 3 Application interface .........................17...
  • Page 4 M10 Hardware Design 3.15 Behaviors of the RI ......................51 3.16 Network status indication....................52 3.17 General purpose input & output (GPIO) ................53 3.18 Open drain output (LIGHT_MOS)...................53 4 Antenna interface ........................55 4.1 Antenna installation......................55 4.2 RF output power.........................55 4.3 RF receive sensitivity ......................56 4.4 Operating frequencies ......................56...
  • Page 5 TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER............55 TABLE 29: THE MODULE CONDUCTED RF RECEIVE SENSITIVITY ........56 TABLE 30: THE MODULE OPERATING FREQUENCIES..............56 TABLE 31: M10 CONNECTION DIAGRAMS..................58 TABLE 32: ABSOLUTE MAXIMUM RATINGS.................59 TABLE 33: OPERATING TEMPERATURE..................59 TABLE 34: THE MODULE POWER SUPPLY RATINGS..............59 TABLE 35: THE MODULE CURRENT CONSUMPTION..............60...
  • Page 6 FIGURE 35 : MODULE SERVICES AS CALLER................52 FIGURE 36: REFERENCE CIRCUIT OF THE NETLIGHT..............53 FIGURE 37: REFERENCE CIRCUIT OF THE LIGHT_MOS.............54 FIGURE 38: M10 TOP AND SIDE DIMENSIONS（UNIT: MM）............65 FIGURE 39: M10 BOTTOM DIMENSIONS（UNIT: MM） .............66 M10_HD_V1.00 - 5 -...
  • Page 7 M10 Hardware Design FIGURE 40: PAD BOTTOM DIMENSIONS（UNIT: MM） .............66 FIGURE 41: FOOTPRINT OF RECOMMENDATION（UNIT: MM）..........68 FIGURE 42: TOP VIEW OF THE MODULE ..................69 FIGURE 43: BOTTOM VIEW OF THE MODULE................69 M10_HD_V1.00 - 6 -...

  • Page 8: Revision History

    M10 Hardware Design 0 Revision history Revision Date Author Description of change 1.00 2009-06-27 Tracy ZHANG Initial M10_HD_V1.00 - 7 -...

  • Page 9: Introduction

    6 Product Information.This document describes the hardware interface of the Quectel’s M10 module series that connects to the specific application and the air interface. This document can help you quickly understand module interface specifications, electrical and mechanical details.

  • Page 10: Terms And Abbreviations

    M10 Hardware Design 1.2 Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description Analog-to-Digital Converter Adaptive Multi-Rate Antenna Reference Point ASIC Application Specific Integrated Circuit Bit Error Rate Base Transceiver Station CHAP Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data...
  • Page 11 M10 Hardware Design Abbreviation Description Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel Printed Circuit Board Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value)

  • Page 12: Safety Caution

    The following safety precautions must be observed during all phases of the operation. Usage , service or repair of any cellular terminal or mobile incorporating M10 module. Manufactures of the cellular terminal should send words the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
  • Page 13 M10 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, for example no mobile fee or a invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency calls.

  • Page 14: Product Concept

    M2M, Telemetry and other mobile data communication systems. The M10 is a an SMD type module, which can be embedded in customer applications through it’s 64-pin pads. It provides all hardware interfaces between the module and customers’ boards.
  • Page 15 M10 Hardware Design Class 1 (1W) at DCS 1800 and PCS 1900 GPRS multi-slot class 12 （default） GPRS connectivity GPRS multi-slot class 10 (option) GPRS multi-slot class 8 (option) GPRS mobile station class B Temperature range Normal operation: -35°C ~ +80°C Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C ○...

  • Page 16: Functional Diagram

    CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2 Functional diagram The following figure shows a block diagram of the M10 module and illustrates the major functional part: The GSM baseband engine Flash and SRAM The GSM radio frequency part The SMT pads interface —LCD interface...

  • Page 17: Evaluation Board

    Figure 1 : Module functional diagram 2.3 Evaluation board In order to help you on the application of M10, Quectel can supply an Evaluation Board (EVB) and a link-board that interfaces the module directly with appropriate power supply, SIM card holder, RS232 serial interface, handset port, earphone port, antenna and all GPIOs of the module.

  • Page 18: Application Interface

    M10 Hardware Design 3 Application interface The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in following chapters: Power supply (refer to Chapter 3.3) Serial interfaces (refer to Chapter 3.8)
  • Page 19 M10 Hardware Design judge whether the system is Imax=20mA power on or off. When the 2.2~4.7uF bypass voltage is low, the system is capacitor, when power off. Otherwise, the using this pin for system is power on. power supply. Digital ground...
  • Page 20 M10 Hardware Design pin open General purpose input/output PIN NAME DESCRIPTION DC CHARACTERISTICS COMMENT KBC0~KBC4 Keypad interface VILmin=0V If unused keep VILmax=0.67V pins open VIHmin=1.7V KBR0~KBR4 Pull up to VIHmax= VDD_EXT+0.3 VDD_EXT, if VOLmin=GND unused keep pins VOLmax=0.34V open VOHmin=2.0V...

  • Page 21: Operating Modes

    M10 Hardware Design SIM_RST SIM reset VOLmax=0.4V Maximum cable When SIM_VDD=3V length 200mm VILmax=0.4V from the module When SIM_VDD=1.8V pad to SIM card VILmax=0.2* SIM_VDD holder. VOHmin=0.9*SIM_VDD When SIM_VDD=3V VOLmax=0.4V When SIM_VDD=1.8V VOLmax=0.2* SIM_VDD SIM_PRESE SIM card detection VILmax=0.67V If unused , keep VIHmin=1.7V...

  • Page 22: Power Supply

    ESR and small size but may not be cost effective. A lower cost choice may be a 100 µF tantalum capacitor (low ESR) with a small (0.1µF to 1µF) ceramic in parallel, which is illustrated as following figure. The capacitors should put as close as possible to the M10 VBAT pins. The following figure is the recommended circuit.

  • Page 23: Figure 2: Reference Circuit Of The Vbat Input

    M10 Hardware Design VBAT C1=100uF, C2=0.1uF~1uF Figure 2 : Reference circuit of the VBAT input The circuit design of the power supply depends strongly from the power source where this power is drained. The following figure is the reference design of +5V input source power supply. The designed output for the power supply is 4.16V, thus a linear regulator can be used.

  • Page 24: Power Supply Pins

    M10 Hardware Design time, around 577us every 4.615ms, in talking mode. The following figure is the VBAT voltage and current ripple at the maximum power transmitting phase, the test condition is VBAT=4.0V, VBAT maximum output current =2A, C1=100µF tantalum capacitor (ESR=0.7Ω) and C2=1µF.

  • Page 25: Power Up And Power Down Scenarios

    M10 Hardware Design 3.4 Power up and power down scenarios 3.4.1 Turn on The module can be turned on by various ways, which are described in following chapters: Via PWRKEY pin: starts normal operating mode (please refer to chapter 3.4.1.1);...

  • Page 26: Figure 6: Turn On The Module Using Keystroke

    M10 Hardware Design PWRKEY TVS1 Close to S1 Figure 6 : Turn on the module using keystroke The power on scenarios illustrates as following figure. VBAT Pulldown > 2000ms PWRKEY > 0.6*VBAT (INPUT) <0.2*VBAT VDD_EXT （OUTPUT） Figure 7: Timing of turn on system When power on procedure complete, the module will send out following result code to indicate the module is ready to operate when set as fixed baud rate.

  • Page 27: Turn Off

    M10 Hardware Design GSM network and the software protocol stack is closed. Thus the parts of AT commands related with SIM card and Protocol stack will not be accessible, and the others can be used as well as in normal mode.

  • Page 28: Figure 8: Timing Of Turn Off System

    M10 Hardware Design It can caused the module logoff from the network and allow the software to enter into a secure state and save data before completely disconnect the power supply. Before the completion of the switching off procedure the module will send out result code: NORMAL POWER DOWN After this moment, the AT commands can’t be executed.

  • Page 29: Figure 9: Reference Circuit For Emerg_Off Using Driving Circuit

    M10 Hardware Design following URC will be presented: UNDER-VOLTAGE WARNNING If the voltage ≥ 4.5V, the following URC will be presented: OVER-VOLTAGE WARNNING The uncritical voltage range is 3.4V to 4.6V. If the voltage ≥ 4.6V or ≤ 3.4V, the module will be automatic shutdown soon.

  • Page 30: Restart Module Using The Pwrkey Pin

    M10 Hardware Design EMERG_OFF TVS1 Close to S1 Figure 10: Reference circuit for EMERG_OFF using keystoke Take care to use the EMERG_OFF pin. It should be used under emergent situation. For instance, if the module is unresponsive or abnormal, the EMERG_OFF pin can be used to shutdown the system, and this operation may causes the loss of all information stored in the volatile memory since power is cut off immediately.

  • Page 31: Power Saving

    M10 Hardware Design Delay>2s Pulldown > 20ms EMERG_OFF （INPUT） PWRKEY （INPUT） Figure 12 : Timing of restart system after emergency shutdown 3.5 Power saving There are two methods for the module to enter into low current consumption status. “AT+CFUN” is used to set module into minimum functionality mode and DTR hardware interface signal can be used to lead system to be SLEEP mode (or slow clocking mode).

  • Page 32: Sleep Mode (Slow Clock Mode)

    M10 Hardware Design 3.5.2 SLEEP mode (slow clock mode) We can control module to enter or exit the SLEEP mode in customer applications through DTR signal. When DTR is in high level, and there is no on air and hardware interrupt (such as GPIO interrupt or data on serial port), the module will enter SLEEP mode automatically.

  • Page 33: Rtc Backup

    M10 Hardware Design 3.7 RTC backup The RTC (Real Time Clock) power supply of module can be provided by an external capacitor or battery (rechargeable or non-chargeable) through the VRTC on the SMT pad. There is a 3.9 K resistor has been integrated in the module used for limiting current. You need only a coin-cell battery or a super-cap to VRTC to backup power supply for RTC.

  • Page 34: Serial Interfaces

    M10 Hardware Design MODULE 3.9K VRTC Core Large-capacitance Capacitor Figure 15: RTC supply from capacitor Coin-type Capacitor backup Coin-type Rechargeable Capacitor such as XH414H-IV01E form Seiko can be used. Figure 16 : Seiko XH414H-IV01E Charge Characteristic 3.8 Serial interfaces The module provides two unbalanced asynchronous serial ports. One is the serial port ,the other is the debug port.

  • Page 35: Table 9: Logic Levels Of The Serial Port And Debug Port

    M10 Hardware Design Serial port TXD: Send data to the RXD signal line of the DTE RXD: Receive data from the TXD signal line of the DTE Debug port DBG_TXD: Send data to the /RXD signal line of the DTE DBG_RXD: Receive data from the /TXD signal line of the DTE The logic levels are described in following table.

  • Page 36: Function Of Serial Port & Debug Port Supporting

    M10 Hardware Design MODULE (DCE) CUSTOMER (DTE) Serial port Serial port1 /RING Debug port Serial port2 DBG_TX /TXD DBG_RX /RXD Figure 17 : Connection of serial interfaces   Note: The RTS PIN must be connected to the GND in the customer circuit when  only the TXD and RXD are used in the Serial Port communication.  3.8.1 Function of serial port & debug port supporting Serial port Seven lines on Serial Interface.

  • Page 37: Software Upgrade And Software Debug

    M10 Hardware Design you the flexibility to put the GSM engine into operation no matter what baud rate your host application is configured to. To take advantage of autobauding mode, specific attention should be paid to the following requirements: Synchronization between DTE and DCE: When DCE powers on with the autobauding enabled, it is recommended to wait 2 to 3 seconds before sending the first AT character.

  • Page 38: Figure 18: Connection Of Software Upgrade

    M10 Hardware Design MODULE(DCE) IO CONNECTOR Serial port PWRKEY PWRKEY Figure 18 : Connection of software upgrade Note: The RTS PIN must be connected to the GND in the customer circuit when only the TXD and RXD are used in the Serial Port communication.

  • Page 39: Audio Interfaces

    M10 Hardware Design SP3238 T1IN T4OUT T2IN T2OUT T3IN T3OUT T4IN T1OUT T5OUT T5IN MODULE /R1OUT R1IN R1OUT R2OUT R2IN R3OUT R3IN ONLINE /STATUS /SHUTDOWN TO PC serial port Figure 20: RS232 level converter circuit ： Note 1 For detail information about serial port application, please refer to document [10] ：...

  • Page 40: Table 11: Pin Definition Of Audio Interface

    M10 Hardware Design capacitor is recommended ) which usually for block the DC voltage in the single-end mode. The module analogy output configuration is determined by control register settings and established using analogy multiplexes. These two analogy channels can be easily swapped by “AT+QAUDCH” command. For more details, please refer to document [1].

  • Page 41: Microphone Interfaces Configuration

    M10 Hardware Design 3.9.1 Microphone interfaces configuration Close to Microphone Differential layout 10pF 33pF ANTI MICxP Electret 10pF 33pF Microphone MOUDLE MICxN 33pF 10pF ANTI AGND Figure 21: Microphone interface configuration of AIN1&AIN2 M10_HD_V1.00 - 40 -...

  • Page 42: Speaker Interface Configuration

    M10 Hardware Design 3.9.2 Speaker interface configuration Close to speaker Differential layout 10pF 33pF ANTI SPK1P MOUDLE 10pF 33pF SPK1N 10pF 33pF ANTI Figure 22: Speaker interface configuration of AOUT1 Close to speaker Differential layout Amplifier 33pF 10pF circuit ANTI...

  • Page 43: Figure 24: Speaker Interface Configuration Of Aout2

    M10 Hardware Design Close to speaker Differential layout 10pF 33pF ANTI 22uF SPK2P MOUDLE AGND Figure 24: Speaker interface configuration of AOUT2 Close to speaker Differential layout Amplifier 10pF 33pF circuit ANTI SPK2P MOUDLE AGND 10pF 33pF ANTI Figure 25: Speaker interface with amplifier configuration of AOUT2 Note: the value of C1 and C2 depends on the input impedance of audio amplifier .

  • Page 44: Earphone Interface Configuration

    M10 Hardware Design 3.9.3 Earphone interface configuration Close to Socket Differential layout 33pF 33pF MIC2N MIC2P MOUDLE 22uF SPK2P AGND 33pF 10pF Amphenol 9001-8905-050 AGND AGND Figure 26: Earphone interface configuration Table 12: MIC input characteristics Parameter Unit Working Voltage...

  • Page 45: Buzzer

    M10 Hardware Design Auxiliary Single load Output(SPK2) Ended Resistance Ref level Maxim driving current limit of SPK1 SPK2 3.10 Buzzer The BUZZER on the SMT pads can be used to drive a buzzer to indicate incoming call. The output volume of buzzer can be set by “AT+CRSL”. The reference circuit for buzzer shown as...

  • Page 46: Sim Card Interface

    M10 Hardware Design 3.11 SIM card interface 3.11.1 SIM card application You can use AT Command to get information in SIM card. For more information, please refer to document [1]. The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM (intended for use with a SIM application Tool-kit).

  • Page 47: Design Considerations For Sim Card Holder

    M10 Hardware Design VDD_EXT 100K SIM CARD MOLEX-91228 SIM_VDD SIM_RST SIM_CLK MODULE SIM_PRESENCE PRESENCE GND SIM_DATA SMF05C Figure 28: Reference circuit of the 8 pins SIM card If you don’t use the SIM card detection function, you can let the SIM_PRESENCE open. The reference circuit about 6 pins SIM card illustrates as following figure.

  • Page 48: Table 17: Pin Description (Amphenol Sim Card Holder)

    M10 Hardware Design http://www.amphenol.com for more information about the holder. Figure 30 : Amphenol C707 10M006 512 2 SIM card holder Table 17: Pin description (Amphenol SIM card holder) Name Function SIM_VDD SIM Card Power supply, it can identify automatically the SIM Card power mode，one is 3.0V±10%, another is 1.8V±10%.

  • Page 49: Lcd Interface

    M10 Hardware Design Figure 31 : Molex 91228 SIM card holder Table 18: Pin description (Molex SIM card holder) Name Function SIM_VDD SIM Card Power supply, it can identify automatically the SIM Card power mode，one is 3.0V±10%, another is 1.8V±10%. Current is about 10mA.

  • Page 50: Keypad Interface

    Display data output Note: This function is not supported in the default firmware. There must be some special firmware if you want. Please contact Quectel for more details. 3.13 Keypad interface The keypad interface consists of 5 keypad column outputs and 5 keypad row inputs. The basic configuration is 5 keypad columns and 5 keypad rows, giving 25 keys.

  • Page 51: Adc

    “AT+QADC” to read the voltage value added on ADC0 pin. For detail of this AT command, please refer to document [1]. To get the battery temperature, M10 provide the TEMP_BAT pin, which is internal pulled-up to 2.8V through 10Kohm. The battery pack should include an NTC resistor. If the NTC is not inside the battery, it must be in thermal contact with the battery.

  • Page 52: Behaviors Of The Ri

    M10 Hardware Design Table 21: Pin definition of the ADC Name Function ADC0 Analog to digital converter. TEMP_BAT Analog to digital converter. 2.8V MODULE ADC0 AUXADC0 BASE BAND TEMP_BAT AUXADC2 Figure 33 : Internal circuit of the ADC Table 22: Characteristics of the ADC...

  • Page 53: Network Status Indication

    M10 Hardware Design Data calling Change LOW, then： （1）Change to HIGH when establish calling. （2）Use AT command ATH, the RI changes to HIGH. When receive SMS, The RI will change to LOW and hold low level about 120 ms, then change to HIGH.

  • Page 54: General Purpose Input & Output (Gpio)

    Keypad interface KBR5 Note: This function is not supported in the default firmware. There must be special firmware if you require. Please contact Quectel for more details. 3.18 Open drain output (LIGHT_MOS) The module provides a open drain output pin to control LCD or keyboard backlight. The output LIGHT_MOS can sink 150mA.

  • Page 55: Table 26: Pin Definition Of The Light_Mos

    Name Function LIGHT_MOS Open Drain Output Port Note: This function is not supported in the default firmware. There must be special firmware if you require. Please contact Quectel for more details . VBAT 300R MODULE LIGHT_MOS Figure 37 : Reference circuit of the LIGHT_MOS M10_HD_V1.00...

  • Page 56: Antenna Interface

    RF trace which the impendence must be controlled in 50Ω. To help the customer to ground the antenna, M10 comes with 2 grounding pads located close to the antenna pad.

  • Page 57: Rf Receive Sensitivity

    M10 Hardware Design 4.3 RF receiving sensitivity Table 29: The module conducted RF receiving sensitivity Frequency Receive sensitivity GSM850 < -107dBm EGSM900 < -107dBm DCS1800 < -107dBm PCS1900 < -107dBm 4.4 Operating frequencies Table 30: The module operating frequencies Frequency...

  • Page 58: Electrical, Reliability And Radio Characteristics

    M10 Hardware Design 5 Electrical, reliability and radio characteristics 5.1 PIN assignment of the module Notes: Be careful, the connection diagrams adapt to only right module, please check your module type. M10_HD_V1.00 - 57 -...

  • Page 59: Table 31: M10 Connection Diagrams

    M10 Hardware Design Table 31: M10 Connection diagrams PIN NO. PIN NAME PIN NO. PIN NAME DISP_DATA DISP_CLK DISP_CS DISP_D/C DISP_RST NETLIGHT VDD_EXT GND1 DBG_RXD DBG_TXD SIM_PRESENCE SIM_VDD SIM_DATA SIM_CLK SIM_RST VRTC EMERG_OFF PWRKEY AGND SPK2P SPK1N SPK1P MIC1P MIC1N...

  • Page 60: Absolute Maximum Ratings

    M10 Hardware Design 5.2 Absolute maximum ratings Absolute maximum rating for power supply and voltage on digital and analog pins of module are listed in the following table: Table 32: Absolute maximum ratings Parameter Unit VBAT Peak current of power supply...

  • Page 61: Current Consumption

    M10 Hardware Design Voltage drop Normal condition, power during control level for Pout max transmitting burst Voltage ripple Normal condition, power control level for Pout max @ f<200kHz @ f>200kHz Average supply POWER DOWN mode VBAT current SLEEP mode @ DRX=5...
  • Page 62 M10 Hardware Design Condition Current Consumption Voice Call GSM850 @power level #5 <300mA,Typical 290mA @power level #10,Typical 150mA @power level #19,Typical 100mA EGSM 900 @power level #5 <300mA,Typical 270mA @power level #10,Typical 140mA @power level #19,Typical 100mA DCS 1800 @power level #0 <250mA,Typical 240mA...

  • Page 63: Electro-Static Discharge

    M10 Hardware Design @power level #10,Typical 182mA @power level #19,Typical 125mA EGSM 900 @power level #5 <350mA,Typical 300mA @power level #10,Typical 175mA @power level #19,Typical 125mA DCS 1800 @power level #0 <300mA,Typical 240mA @power level #10,Typical 135mA @power level #15,Typical 120mA PCS 1900 @power level #0 <300mA,Typical 230mA...
  • Page 64 M10 Hardware Design Part Contact discharge Air discharge VBAT,GND ±5KV ±10KV PWRKEY ±4KV ±8KV Antenna port ±5KV ±10KV SPK1P/1N, SPK2P/2N, ±4KV ±8KV MIC1P/1N, MIC2P/2N M10_HD_V1.00 - 63 -...

  • Page 65: Product Information

    M10 Hardware Design 6 Product information Table 37: Ordering information Part Number Frequency Bands(MHz) GSM850 EGSM900 DCS1800 PCS1900 GSM/GPRS RF Function M10_HD_V1.00 - 64 -...

  • Page 66: Mechanics

    M10 Hardware Design 7 Mechanics This chapter describes the mechanical dimensions of the module. 7.1 Mechanical dimensions of module Figure 38: M10 TOP and SIDE dimensions（Unit: mm） M10_HD_V1.00 - 65 -...

  • Page 67: Figure 40: Pad Bottom Dimensions（Unit: Mm

    M10 Hardware Design test point BOTTOM VIEW   （Unit: mm） M10 bottom dimensions Figure 39: Figure 40: PAD bottom dimensions（Unit: mm） M10_HD_V1.00 - 66 -...

  • Page 68: Footprint Of Recommendation

    M10 Hardware Design 7.2 Footprint of recommendation single pad M10_HD_V1.00 - 67 -...

  • Page 69: Figure 41: Footprint Of Recommendation（Unit: Mm

    M10 Hardware Design safe area line module dimension keepout area Figure 41: Footprint of recommendation（Unit: mm） ： Note1 Keep out on the user mainboard below the test point and the keepout area ,as these are solder mask. ： Note2 For maintain this module, the placement must be keep a distance between the module and other component about 3 mm.

  • Page 70: Top View Of The Module

    M10 Hardware Design 7.3 Top view of the module Figure 42 : Top view of the module 7.4 Bottom view of the module Figure 43 : Bottom view of the module M10_HD_V1.00 - 69 -...
  • Page 71 Shanghai Quectel Wireless Solutions Co., Ltd. Room 801, Building E, No.1618, Yishan Road, Shanghai, China 201103 Tel: +86 21 5108 2965 info@quectel.com Mail:...

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