Related Manuals for Telit Wireless Solutions GL865 V3
Summary of Contents for Telit Wireless Solutions GL865 V3
- Page 1 GL865 V3/V3.1 HW User Guide 1vv0301018 Rev. 15 – 2019-01-07 Mod. 0805 2017-01 Rev.6...
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Page 2: Notice
HW User Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. -
Page 3: Usage And Disclosure Restrictions
HW User Guide USAGE AND DISCLOSURE RESTRICTIONS License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. -
Page 4: Applicability Table
HW User Guide APPLICABILITY TABLE PRODUCTS GL865-DUAL V3 GL865-QUAD V3 GL865-DUAL V3.1 GL865-QUAD V3.1 1vv0301018 Rev. 15 Page 4 of 72 2019-01-07... -
Page 5: Table Of Contents
GL865 V3/V3.1 MODULE CONNECTIONS ........ 13 PIN-OUT ..................13 Pin Layout ................... 15 HARDWARE COMMANDS ............16 Auto-Turning ON the GL865 V3/V3.1 .......... 16 Turning OFF the GL865 V3/V3.1 ..........17 Fast SYSHALT the GL865 V3/V3.1 ..........19 5.3.1. Fast SYSHALT by Hardware ............19 Resetting the GL865 V3/V3.1 ............. - Page 6 6.3.3. Power Supply PCB layout Guidelines ......... 29 ANTENNA .................. 30 GSM Antenna Requirements ............30 7.1.1. GL865 V3/V3.1 Antenna – PCB line Guidelines ......30 PCB Design Guidelines .............. 32 7.2.1. Transmission line design ............32 7.2.2. Transmission line measurements ..........33 GSM Antenna - Installation Guidelines ........
- Page 7 ADC Converter ................56 12.2.1. Description .................. 56 12.2.2. Using ADC Converter ..............56 MOUNTING THE GL865 V3/V3.1 ON YOUR BOARD ....57 General ..................57 Module finishing & dimensions ............ 57 Recommended foot print for the application ........ 58 Stencil ..................59 PCB pad design ................
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Page 8: Introduction
1. INTRODUCTION Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit GL865 V3/V3.1 module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our GL865 V3/V3.1 modules. -
Page 9: Text Conventions
HW User Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. -
Page 10: Related Documents
• Audio settings application note , 80000NT10007a • GL865/GL868 V3 Digital Voice Interface Application Note, 80000NT10104a • GL865 V3/V3.1 Product description, 80400ST10120a • SIM Integration Design Guide Application Note, 80000NT10001a • AT Commands Reference Guide, 80000ST10025a Telit EVK2 User Guide, 1vv0300704 •... -
Page 11: Overview
Telit GL865 V3/V3.1 module. For further hardware details that may not be explained in this document refer to the Telit GL865 V3/V3.1 Product Description document where all the hardware information is... -
Page 12: Gl865 V3/V3.1 Mechanical Dimensions
HW User Guide GL865 V3/V3.1 MECHANICAL DIMENSIONS The GL865 V3/V3.1 overall dimensions are: • Length: 24.4 mm • Width: 24.4 mm Thickness: 2.6 mm • Weight 2.8 g • 1vv0301018 Rev. 15 Page 12 of 72 2019-01-07... -
Page 13: Gl865 V3/V3.1 Module Connections
HW User Guide 4. GL865 V3/V3.1 MODULE CONNECTIONS PIN-OUT Signal Function Note Type Audio EAR- Earphone signal output, phase - Audio EAR+ Earphone signal output, phase + Audio MIC- Mic. signal input; phase- Audio MIC+ Mic. signal input; phase+ Audio... - Page 14 HW User Guide Signal Function Note Type GPIO_05 / GPIO05 Configurable GPIO 28KΩ- CMOS 1.8V RFTXMON / Transmitter ON monitor 40KΩ PD GPIO06 Configurable GPIO 28KΩ- GPIO_06 / ALARM CMOS 1.8V / ALARM 40KΩ PD GPIO07 Configurable GPIO 28KΩ- GPIO_07 / BUZZER CMOS 1.8V / Buzzer 40KΩ...
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Page 15: Pin Layout
HW User Guide Pin Layout TOP VIEW NOTE: The pins defined as NC/RFU shall be considered RESERVED and must not be connected to any pin in the application. 1vv0301018 Rev. 15 Page 15 of 72 2019-01-07... -
Page 16: Hardware Commands
5. HARDWARE COMMANDS Auto-Turning ON the GL865 V3/V3.1 To Auto-turn on the GL865 V3/V3.1, the power supply must be applied on the power pins VBATT and VBATT_PA, after 1000 m-seconds, the V_AUX / PWRMON pin will be at the high logic level and the module can be considered fully operating. -
Page 17: Turning Off The Gl865 V3/V3.1
Enter AT<CR> AT answer in 1 AT init sequence. second? Disconnect PWR supply Modem ON Proc. Turning OFF the GL865 V3/V3.1 Turning off of the device can be done in two ways: • General turn OFF • Processor turn OFF General turn OFF –... - Page 18 NOTE: In order to prevent a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865 V3/V3.1 when the module is powered off or during an ON/OFF transition.
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Page 19: Fast Syshalt The Gl865 V3/V3.1
HW User Guide Fast SYSHALT the GL865 V3/V3.1 The procedure to power OFF of module described in Chapter 5.2, normally takes up to 10 second to de-attach the network and internal filesystem properly closed. The Fast SYSHALT feature permits to reduce the current consumption and the time-to- power SYSHALT to minimum values. - Page 20 HW User Guide Typical timings are reported in the plot above when testing the example circuit with Ctank=47mF. The capacitor is rated with the following formula: Where 80mA is a typical current during fast SYSHALT procedure, 300ms is the typical time to execute the system halt and 0.5V is the minimum voltage margin from threshold of hardware reset.
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Page 21: Resetting The Gl865 V3/V3.1
It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stuck waiting for some network or SIM responses. To unconditionally reboot the GL865 V3/V3.1, the pad RESET* must be tied low for at least 200 milliseconds and then released. - Page 22 NOTE: In order to prevent a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865 V3/V3.1 when the module is powered OFF or during an ON/OFF transition.
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Page 23: Power Supply
HW User Guide 6. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performance, hence read the requirements carefully and the guidelines that will follow for a proper design. Power Supply Requirements The external power supply must be connected to VBATT &... -
Page 24: Power Consumption
HW User Guide Power Consumption The GL865 V3/V3.1 power consumptions are: GL865 V3/V3.1 Average Mode Mode description (mA) SWITCHED OFF Module power supplied only on VBATT_PA pin, the VBATT pin is Typical Switched Off 2uA max not power supplied. 20uA... -
Page 25: General Design Rules
• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the GL865 V3/V3.1, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor on the power supply output (usually a tantalum •... -
Page 26: Input Source Power Supply Design Guidelines
• A protection diode should be inserted close to the power input, in order to save the GL865 V3/V3.1 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the below schematic: 1vv0301018 Rev. -
Page 27: Battery Source Power Supply Design Guidelines
WARNING: The three cells Ni/Cd or Ni/MH 3.6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the GL865 V3/V3.1 and damage it. NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GL865 V3/V3.1. -
Page 28: Thermal Design Guidelines
For the heat generated by the GL865 V3/V3.1, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. -
Page 29: Power Supply Pcb Layout Guidelines
If your application doesn't have audio interface but only uses the data feature of the Telit GL865 V3/V3.1, then this noise is not so disturbing and power supply layout design can be more forgiving. -
Page 30: Antenna
In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the GL865 V3/V3.1, then a PCB line is needed in order to connect with it or with its connector. - Page 31 PCB and surround it with Ground planes, or shield it with a metal frame cover. • If you don't have EM noisy devices around the PCB of GL865 V3/V3.1, by using a micro strip on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;...
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Page 32: Pcb Design Guidelines
7.2.1. Transmission line design During the design of the GL865 V3/V3.1 interface board (see the Telit EVK2 User Guide, 1vv0300704), the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded... -
Page 33: Transmission Line Measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to GL865 V3/V3.1 RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. - Page 34 HW User Guide Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Insertion Loss of G-CPW line plus SMA connector is shown below: 1vv0301018 Rev. 15 Page 34 of 72 2019-01-07...
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Page 35: Gsm Antenna - Installation Guidelines
HW User Guide GSM Antenna - Installation Guidelines • Install the antenna in a place covered by the GSM signal. Antenna shall not be installed inside metal cases • Antenna shall be installed also according to antenna manufacturer instructions. • Installation should also take in account the R&TTE requirements described in the •... -
Page 36: Logic Level Specifications
HW User Guide 8. LOGIC LEVEL SPECIFICATIONS Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the GL865 V3/V3.1 interface circuits: Absolute Maximum Ratings -Not Functional:... -
Page 37: Reset Signal
RESET* Phone reset RESET* is used to reset the GL865 V3/V3.1. Whenever this signal is pulled low, the GL865 V3/V3.1 is reset. When the device is reset it stops any operation. After the release of the reset GL865 V3/V3.1 is unconditionally shut down, without doing any detach operation from the network where it is registered. -
Page 38: Serial Ports
The only configuration that doesn't need a level translation is the 1.8V UART. The serial port on the GL865 V3/V3.1 is a +1.8V UART with all the 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GL865 V3/V3.1 UART are the CMOS levels:... - Page 39 GL865 V3/V3.1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ rx_uart ) of the GL865 V3/V3.1 serial port and vice versa for RX.
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Page 40: Rs232 Level Translation
HW User Guide RS232 level translation In order to interface the GL865 V3/V3.1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: invert the electrical signal in both directions; •... - Page 41 HW User Guide The RS232 serial port lines are usually connected to a DB9 connector with the following layout: 1vv0301018 Rev. 15 Page 41 of 72 2019-01-07...
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Page 42: Audio Section Overview
HW User Guide AUDIO SECTION OVERVIEW The Base Band Chip of the GL865 V3/V3.1 provides one input for audio to be transmitted (Uplink) that can be connected directly to a microphone or an audio source. The bias for the microphone is already provided by the product; so the connection can be... -
Page 43: Line-In Connection
HW User Guide LINE-IN connection Vmic 220n MIC/AF_IN+ INPUT 220n MIC/AF_IN- AF_IN+ AF_IN- AGND MODULE Vmic 220n MIC/AF_IN+ INPUT 220n MIC/AF_IN- AF_IN+ Remote_GND AGND MODULE If the audio source is not a mike but a different device, the following connections can be done. -
Page 44: Ear Connection
EAR- TELIT MODULE The audio output of the GL865 V3/V3.1 is balanced, this is helpful to double the level and to reject common mode (click and pop are common mode and therefore rejected); furthermore the output stage is class-D, so it can manage directly a loudspeaker with electrical impedance of at least 8Ω. - Page 45 HW User Guide EAR+ OUTPUT EAR- TELIT MODULE L-C filtering for LOW impedance load. EAR+ OUTPUT EAR- TELIT MODULE HiZ CIRCUITRY R-C filtering for HIGH impedance load. 1vv0301018 Rev. 15 Page 45 of 72 2019-01-07...
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Page 46: Electrical Characteristics
HW User Guide Electrical Characteristics 10.4.1. Input Lines Microphone/Line-in path Line Type Differential Coupling capacitor ≥ 100nF Differential input resistance 50kΩ Levels To have 0 dBfs @1KHz Differential input voltage MIC Gain = 0dB 290mVrms MIC Gain = +6dB 145mVrms MIC Gain = +12dB 72mVrms MIC Gain = +18dB... -
Page 47: General Purpose I/O
. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the GL865 V3/V3.1 firmware and acts depending on the function implemented. For Logic levels please refer to chapter 8. -
Page 48: Gpio Logic Levels
1.8V C106/CTS GPIO Logic levels Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the GL865 V3/V3.1 interface circuits: Absolute Maximum Ratings -Not Functional: Parameter Input level on any digital pin -0.3V... -
Page 49: Using A Gpio Pad As Input
NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the GL865 V3/V3.1 when the module is powered OFF or during an ON/OFF transition. -
Page 50: Using The Alarm Output Gpio6
HW User Guide Using the Alarm Output GPIO6 The GPIO6 pad, when configured as Alarm Output, is controlled by the GL865 V3/V3.1 module and will rise when the alarm starts and fall after the issue of a dedicated AT command. -
Page 51: Magnetic Buzzer Concepts
HW User Guide Magnetic Buzzer Concepts 11.8.1. Short Description A magnetic Buzzer is a sound-generating device with a coil located in the magnetic circuit consisting of a permanent magnet, an iron core, a high permeable metal disk and a vibrating diaphragm. Drawing of the Magnetic Buzzer. -
Page 52: Working Current Influence
The STAT_LED pin status shows information on the network service availability and Call status. In the GL865 V3/V3.1 modules, the STAT_LED usually needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status. -
Page 53: Simin Detect Function
HW User Guide SIMIN detect function All the GPIO pins can be used as SIM DETECT input. The AT Command used to enable the function is: AT#SIMINCFG Use the AT command AT#SIMDET=2 to enable the SIMIN detection Use the AT command AT&W0 and AT&P0 to store the SIMIN detection in the common profile. -
Page 54: Dac And Adc Section
12.1.1. Description The GL865 V3/V3.1 provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin 15 of the GL865 V3/V3.1. The on board DAC is a 10 bit converter, able to generate an analogue value based on a specific input in the range from 0 up to 1023. -
Page 55: Enabling Dac
HW User Guide 12.1.2. Enabling DAC An AT command is available to use the DAC function. The command is: AT#DAC= [<enable> [, <value>]] <value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision) it must be present if <enable>=1 Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. -
Page 56: Adc Converter
Units Input Voltage range Volt AD conversion bits Resolution > 1 The GL865 V3/V3.1 module provides 2 Analog to Digital Converters. The input lines are: ADC_IN1 available on pin 13 ADC_IN2 available on pin 14 12.2.2. Using ADC Converter An AT command is available to use the ADC function. -
Page 57: Mounting The Gl865 V3/V3.1 On Your Board
HW User Guide MOUNTING THE GL865 V3/V3.1 ON YOUR BOARD General The GL865 V3/V3.1 modules have been designed to be compliant with a standard lead- free SMT process. Module finishing & dimensions Pin 1 Lead-free Alloy: Surface finishing Ni/Au for all solder pads... -
Page 58: Recommended Foot Print For The Application
HW User Guide Recommended foot print for the application In order to easily rework the GL865 V3/V3.1 is suggested to consider on the application a 1.5 mm placement inhibited area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. -
Page 59: Stencil
HW User Guide Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm. PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Pad Solder Mask NSMD... -
Page 60: Solder Paste
HW User Guide It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes. -
Page 61: Gl865 V3/V3.1 Solder Reflow
Time 25°C to Peak Temperature (ttp) 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: The GL865 V3/V3.1 module withstands one reflow process only. 1vv0301018 Rev. 15 Page 61 of 72 2019-01-07... -
Page 62: Debug Of The Gl865 V3/V3.1 In Production
PCB, in order to check the connection between the GL865 V3/V3.1 itself and the application and to test the performance of the module connecting it with an external computer. Depending by the customer application, these pads include, but are not limited to the following signals: •... -
Page 63: Packing System
• • Package on reel Packing on tray The GL865 V3/V3.1 modules are packaged on trays of 40 pieces each. These trays can be used in SMT processes for pick & place handling. 1vv0301018 Rev. 15 Page 63 of 72... - Page 64 HW User Guide 1vv0301018 Rev. 15 Page 64 of 72 2019-01-07...
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Page 65: Packing On Reel
HW User Guide Packing on reel The GL865 V3/V3.1 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. 1vv0301018 Rev. 15 Page 65 of 72 2019-01-07... -
Page 66: Carrier Tape Detail
HW User Guide 14.2.1. Carrier tape detail 14.2.2. Carrier detail 1vv0301018 Rev. 15 Page 66 of 72 2019-01-07... -
Page 67: Moisture Sensibility
HW User Guide Moisture sensibility The level of moisture sensibility of the Product is “3” according with standard IPC/JEDEC J-STD-020, take care of all the relative requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) The shelf life of the Product inside of the dry bag must be 12 months from the bag seal date, when stored in a non-condensing atmospheric environment of <40°C / 90% RH... -
Page 68: Conformity Assessment Issues
HW User Guide CONFORMITY ASSESSMENT ISSUES FCC/IC Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. - Page 69 HW User Guide generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or...
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Page 70: Safety Recommendations
HW User Guide SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments •... -
Page 71: Document History
Pin out pin 26 description Par.4.1 • • Transmission line design Par. 7.2.1 2015-05-25 Updated chapter 14 Packing system 2017-04-10 Added GL865 V3.1 product 2017-05-11 Modified reference to 2014/53/EU Directive 2018-11-21 Added NOTE in Footprint Par.13.3 2019-01-07 Added Fast SYSHALT Par.5.3 Updated document layout 1vv0301018 Rev. - Page 72 Mod. 0805 2017-01 Rev.6...
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