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WL1837MODCOM8I WLAN MIMO and Bluetooth
The WL1837MODCOM8I is a Wi-Fi
the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that
offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-
optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas
supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP
(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux
Android™, WinCE, and RTOS.TI.
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1
Overview
1.1
General Features
1.2
Key Benefits
1.3
Applications
2
Board Pin Assignment
2.1
Pin Description
2.2
Jumper Connections
3
Electrical Characteristics
4
Antenna Characteristics
4.1
VSWR
4.2
Efficiency
4.3
Radio Pattern
5
Circuit Design
5.1
EVB Reference Schematics
5.2
Bill of Materials (BOM)
6
Layout Guidelines
6.1
Board Layout
7
Ordering Information
1
WL1837MODCOM8I EVB (Top View)
2
EVB Top View
3
EVB (Bottom View)
4
Antenna VSWR Characteristics
5
Antenna Efficiency
6
EVB Reference Schematics
7
WL1837MODCOM8I Layer 1 Layout
8
WL1837MODCOM8I Layer 2 Layout
9
WL1837MODCOM8I Layer 3 Layout
10
WL1837MODCOM8I Layer 4 Layout
11
Module Layout Guidelines (Top Layer)
Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
SWRU382 – November 2014
Submit Documentation Feedback
Evaluation Board for TI Sitara™ Platform
dual-band, Bluetooth, and BLE module evaluation board (EVB) with
®
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WL1837MODCOM8I WLAN MIMO and Bluetooth
Copyright © 2014, Texas Instruments Incorporated
Contents
List of Figures
User's Guide
SWRU382 – November 2014
®
Module
®
Module Evaluation Board
for TI Sitara™ Platform
,
®
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Table of Contents
Related Manuals for Texas Instruments WL1837MODCOM8I
Summary of Contents for Texas Instruments WL1837MODCOM8I
- Page 1 WL1837MODCOM8I Layer 4 Layout .................. Module Layout Guidelines (Top Layer) Sitara, WiLink are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Android is a trademark of Google, Inc. Linux is a registered trademark of Linus Torvalds.
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Page 2: Swru382 – November
Pin Description ............................................Module Layout Guidelines ..............Antenna and RF Trace Routing Layout Guidelines WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 3: Overview
Overview Figure 1 shows the WL1837MODCOM8I EVB. Figure 1. WL1837MODCOM8I EVB (Top View) General Features The WL1837MODCOM8I EVB includes the following features: • WLAN, Bluetooth, and BLE on a single module board • 100-pin board card • Dimensions: 76.0 mm (L) x 31.0 mm (W) •... -
Page 4: Applications
Lower manufacturing costs saves board space and minimizes RF expertise. • AM335x Linux and Android reference platform accelerates customer development and time to market. Applications The WL1837MODCOM8I device is designed for the following applications: • Portable consumer devices • Home electronics •... -
Page 5: Pin Description
WLAN Logger output N.C. No connection N.C. No connection Ground Ground SDIO_CLK WLAN SDIO clock SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... - Page 6 Ground Ground N.C. No connection BT_UART_IF_TX Bluetooth HCI UART transmit output N.C. No connection WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board for SWRU382 – November 2014 TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated...
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Page 7: Jumper Connections
GPIO12 General-purpose I/O TCXO_CLK_COM Option to supply 26 MHz externally GPIO10 General-purpose I/O Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections: • J1: Jumper connector for V power input • J3: Jumper connector for V power input •... -
Page 8: Antenna Characteristics
VSWR characteristics. Figure 4. Antenna VSWR Characteristics Efficiency Figure 5 shows the antenna efficiency. Figure 5. Antenna Efficiency WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback... -
Page 9: Radio Pattern
0402 0402 0402 0402 0402 U.FL-R-SMT(10) U.FL-R-SMT(10) U.FL U.FL Figure 6. EVB Reference Schematics SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board for TI Sitara™ Platform Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 10: Bill Of Materials (Bom)
76.0 mm × 31.0 mm 茂榮 4 / FR4 (4 pcs / PNL) × 1.6 mm C5 and C6 are mounted with a 0-Ω resistor by default. WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright ©... -
Page 11: Layout Guidelines
Layout Guidelines Board Layout Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB. Figure 7. WL1837MODCOM8I Layer 1 Layout Figure 8. WL1837MODCOM8I Layer 2 Layout SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth ®... -
Page 12: Wl1837Modcom8I Layer 3 Layout
Layout Guidelines www.ti.com Figure 9. WL1837MODCOM8I Layer 3 Layout Figure 10. WL1837MODCOM8I Layer 4 Layout Figure 11 Figure 12 show instances of good layout practices. WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board SWRU382 – November 2014 for TI Sitara™ Platform Submit Documentation Feedback Copyright ©... -
Page 13: Module Layout Guidelines (Top Layer)
Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer and the module mounting layer. SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board for TI Sitara™... - Page 14 NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board SWRU382 –...
- Page 15 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. SWRU382 – November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth ® Module Evaluation Board for TI Sitara™ Platform Submit Documentation Feedback Copyright ©...
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Page 16: Ordering Information
Whenever possible, maintain a clearance around these signals. Ordering Information Part number: WL1837MODCOM8I Revision History DATE REVISION NOTES November 2014 Initial draft Revision History SWRU382 – November 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 17: Important Notice
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.