Table Of Contents - Sony XR-CA630X Service Manual

Fm/am, cassette
Hide thumbs Also See for XR-CA630X:
Table of Contents

Advertisement

XR-CA630X

TABLE OF CONTENTS

1.
Location of Controls ....................................................... 3
2.
2-1. Disassembly Flow ........................................................... 8
2-2. Sub Panel Assy ................................................................ 8
2-3. Mechanism Deck (MG-25F-136) ................................... 9
2-4. MAIN Board ................................................................... 9
2-5. Heat Sink (2P) ................................................................. 10
3.
3-1. Assembly Flow ................................................................ 11
3-2. Housing ........................................................................... 11
3-3. Arm (Suction) ................................................................. 12
3-4. Lever (LDG-A)/(LDG-B) ............................................... 12
3-5. Gear (LDG-FT) ............................................................... 13
3-6. Guide (C) ......................................................................... 13
4.
5.
Tape Deck Section .......................................................... 15
Tuner Section .................................................................. 15
6.
Schematic Diagrams ....................................................... 16
6-2. Printed Wiring Board - MAIN Board - ......................... 17
6-6. Printed Wiring Board - SUB Board - ............................ 21
6-7. Schematic Diagram - SUB Board - ............................... 21
6-8. Printed Wiring Board - KEY Board - ............................ 22
6-9. Schematic Diagram - KEY Board - .............................. 23
6-10. IC Pin Function Description ........................................... 26
7.
7-1. Chassis Section ............................................................... 29
7-2. Front Panel Section ......................................................... 30
7-3. MAIN Board Section ...................................................... 31
8.
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
• Do not touch the soldering iron on the same conductor of the
• Be careful not to apply force on the conductor when soldering
....................... 15
............................... 33
aged by heat.
ing repairing.
circuit board (within 3 times).
or unsoldering.

Advertisement

Table of Contents
loading

Table of Contents