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Relay board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
C4506
C4505
C4509
C4504
C4503
C4501
R457
Q451
R455
R456
D454
R4531
R4532
R4541
R4542
forward side
C4533
C4543
R4533
C4532
R4543
R4536
C4542
R4546
R4537
C4538
R4547
C4548
R460
D460
R459
R458
PbF
LVA10862-A2
EP452
EP453
Jack board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
reverse side
CN861
R8601
C8601
K8601
J8601
J8501
C8505
SLOT-LED board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
D491
CN491
Gyro board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
reverse side
UL
MARK
EP481
C4842
IC484
PbF
LVA10860-A2
reverse side
CN851
EP861
VA852
K8503
L8501
K8501
K8502
VA853
J8501
K8504
C8504
K8505
Relay board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
S2A
C133
C129
R62
C25
Q102
R63
R56
C26
R64
R59
R68
R171
C127
C19
C126
R143
C20
K121
R142
R145
R204
R268
R148
R267
R149
R163
R181
R152
R164
R169
K111
R105
R166
C79
C77
K142
C76
C78
C110
R168
R151
C111
R150
K136
C216
C220
C235
C198
R397
C225
C228
R102
C175
R419
R319
R375
C195
R323
C197
R231
R350
C232
Sensor board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
PbF
S2A
LVA10838-B2
Sensor board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
Sensor IC board (Common)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
forward side
2-22
reverse side
IC304
LVA10838-
R131
R201
R132
R147
C128
Q9
IC399
R227
C125
P3.3V
C67
LPFSEL/ACT
CN402
R128
C156
R49
C12
C9
C14
C13
C11
C8
R307
C24
R190
R47
Q106
CLKO
R189
C131
C132
R116
B
A
IC398
NEXWE
TIN
R94
R100
R215
R233
R205
C135
C6
TP99
C66
R382
C15
C87
C83
TUBUYAKI
R352
C101
TP87
USBCLK
R136
C99
R107
C136
USBNEN
RFVCC
PRTOUT
C84
C102
TP68
C139
TP64
C86
TP61
TP72
MONI5
TP60
TP71
B
MONI4
TP97
TP94
C119
D
MONI3
TP88
MONI1
C70
A
MONI2
PCMCLK0
MONI0
BCK0
FIN
R93
LRCLK0
R265
C149
K114 K115
c
K133
R52
C170
REAR_LCH
c
C60
D
D5V
SW1__
C176
R220
WOOFER
D-
DP
M5V
C109
C65
C108
C145
R110
C142
C162
C143
C63
R213
C173
C113
R301
R226
C148
TP80
AOUT0
R329
TP75
R309
C240
C226
R405
R393
R399
C211
PbF
R365
R123
R121
TP62
R124
C150
C234
C224
C210
SW1_PAD
C103
C206
R229
CN2
R146
R384
D6
R367
TP98
TP69
R383
R362
R311
C219
R379
R330
R392
C229
TP63
R394
C237
C215
IC1
R318
R325
Q11
C239
R417
TP89
TP66
R264
reverse side
T2A
reverse side
reverse side
C8306
C8303
R8302
C8305
IC801
R8304
R8305
R8301
CN802
B1
T2A
CLD-
TP16
DLD+
RFGND
TP19
TP14
TP15
R67
TP7
TP22
TP8
R46
R72
R55
TP20
R54
TP21
C21
TP5
R141
R76
TP12
TP11
TP10
TEMPDET
R155
TP102
R216
C233
C115
TP79
TP81
EP1
TP92
TP67
R324
C223
C238
1
3
G
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